tqfp 44 thermal resistance datasheet
Abstract: plcc junction to ambient resistance EPAD-TQFP-64 tqfp 64 thermal resistance
Text: THERMAL MANAGEMENT Semiconductor devices dissipate heat while operating. Device junction temperature is a function of : 1 the amount of power dissipated in the circuit, and (2) the net thermal resistance between the heat source and a reference point such as the surrounding ambient of still air. It has been well
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200LFM
tqfp 44 thermal resistance datasheet
plcc junction to ambient resistance
EPAD-TQFP-64
tqfp 64 thermal resistance
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tqfp 44 thermal resistance datasheet
Abstract: tqfp 44 thermal resistance plcc junction to ambient resistance 500LFM QL12X16B QL16X24B QL24X32B QL8X12B Thermal Resistance Calculation TO
Text: THERMAL MANAGEMENT The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external environment. This is represented in
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QL24X32B
QL8X12B
QL12X16B
QL16X24B
tqfp 44 thermal resistance datasheet
tqfp 44 thermal resistance
plcc junction to ambient resistance
500LFM
QL12X16B
QL16X24B
QL24X32B
QL8X12B
Thermal Resistance Calculation TO
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Theta-JC
Abstract: theta JA Theta-JC plcc tqfp 44 thermal resistance datasheet 500LFM QL12X16B QL16X24B QL2003 QL2005 QL2007
Text: 9 The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external
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QL8X12B
QL12X16B
QL16X24B
QL24X32B
QL2005
QL2007
QL2009
QL2003
Theta-JC
theta JA
Theta-JC plcc
tqfp 44 thermal resistance datasheet
500LFM
QL12X16B
QL16X24B
QL2003
QL2005
QL2007
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smd transistor 12W 3 pins
Abstract: Ultrasonic Cleaning Transducer AN264 LM2901 LM2903 LM2904 M74HC00 M74HC74 RH 6v IC AN264
Text: AN264 APPLICATION NOTE RESISTANCE TO SOLDERING HEAT AND THERMAL CHARACTERISTICS OF PLASTIC SMDS by C. Cognetti, E. Stroppolo and R. Tiziani INTRODUCTION Surface Mount Technology SMT has introduced a number of new technical problems, which have delayed the
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AN264
smd transistor 12W 3 pins
Ultrasonic Cleaning Transducer
AN264
LM2901
LM2903
LM2904
M74HC00
M74HC74
RH 6v
IC AN264
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PLCC-44 SMD
Abstract: PLCC-44 SMD heatsink smd transistor 12W 3 pins Ultrasonic Cleaning Transducer Ultrasonic Transducer application notes ultrasonic transducers under water application Ultrasonic Water Transducer transistor smd 4s npn smd transistor 12w M74HC74
Text: APPLICATION NOTE RESISTANCE TO SOLDERING HEAT AND THERMAL CHARACTERISTICS OF PLASTIC SMDs By C. Cogn etti, E. Stropp olo and R. T izian i INTRODUCTION Surface Mount Technology SMT has introduced a number of new technical problems, which have delayed the conversion from insertion assembly.
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Ablebond 71-1
Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board
Text: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages DC resistance R of leads or pins Capacitance (C) including lead-to-lead and loading capacitances Inductance (L) including only self-inductance values for pins traces and wires (PGA) or
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93-WA-EEP-6
91-WA-EEP-27
91-WA-EEP-31
pp1059-1070
pp357-366
Ablebond 71-1
Nitto
bimetal
ABLEBONd 84-1
FR4 epoxy dielectric constant 4.4
thermal analysis on pcb
tungsten slug glass diode
Ablebond 71
IC Packages
cpu fan pin data circuit in mother board
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5060 PLCC
Abstract: P432 PLCC-20 PLCC44 PLCC-44 PLCC-84 SO16W SO20 Small Outline SO-12 thermal resistance PLCC20
Text: APPLICATION NOTE THERMAL MANAGEMENT IN SURFACE MOUNTING The evolutionary trends of integrated circuits and printed circuits boards are, in both cases, towards improved performance and reduced size. From these points of view, a factor of major importance has
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an262
Abstract: thermal conductivity P432 PLCC-20 PLCC44 PLCC-44 SO16W SO20
Text: AN262 APPLICATION NOTE THERMAL MANAGEMENT IN SURFACE MOUNTING The evolutionary trends of integrated circuits and printed circuits boards are, in both cases, towards improved performance and reduced size. From these points of view, a factor of major importance has been
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AN262
an262
thermal conductivity
P432
PLCC-20
PLCC44
PLCC-44
SO16W
SO20
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FR4 epoxy pcb double sided
Abstract: double sided pcb, thermal via double sided pcb FR4 Aluminum Base 3 LED emitters PCB HSMC-A100 LED APPLICATION NOTE FR4 1.6mm substrate 4032C
Text: Thermal Management of Avago MonoPLCC LED Application Note 5373 Introduction Avago SMD LED that provides high luminous intensity output has common semiconductor component character with maximum permissible junction temperature in the range of 110 – 125°C. This means that the temperature of the LED die inside must not exceed this value when
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AV02-0955EN
FR4 epoxy pcb double sided
double sided pcb, thermal via
double sided pcb FR4
Aluminum Base 3 LED emitters PCB
HSMC-A100
LED APPLICATION NOTE
FR4 1.6mm substrate
4032C
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MC100H641
Abstract: MC10H641 MC10H641FN
Text: MC10H641, MC100H641 Single Supply PECL to TTL 1:9 Clock Distribution Chip Description The MC10H/100H641 is a single supply, low skew translating 1:9 clock driver. Devices in the ON Semiconductor H641 translator series utilize the PLCC−28 for optimal power pinning, signal flow through
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MC10H641,
MC100H641
MC10H/100H641
PLCC-28
MC10H640/D
MC100H641
MC10H641
MC10H641FN
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MC100H641
Abstract: MC10H641 MC10H641FN
Text: MC10H641, MC100H641 Single Supply PECL to TTL 1:9 Clock Distribution Chip Description The MC10H/100H641 is a single supply, low skew translating 1:9 clock driver. Devices in the ON Semiconductor H641 translator series utilize the PLCC−28 for optimal power pinning, signal flow through
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MC10H641,
MC100H641
MC10H/100H641
PLCC-28
MC10H640/D
MC100H641
MC10H641
MC10H641FN
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Untitled
Abstract: No abstract text available
Text: MC10H641, MC100H641 Single Supply PECL to TTL 1:9 Clock Distribution Chip Description The MC10H/100H641 is a single supply, low skew translating 1:9 clock driver. Devices in the ON Semiconductor H641 translator series utilize the PLCC−28 for optimal power pinning, signal flow through
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MC10H641,
MC100H641
MC10H/100H641
MC10H640/D
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PBD 3545
Abstract: transistor 1317 1522-PBD
Text: January 1993 PBD 3545/1 Universal Sink Driver Description Key Features PBD 3545/1 is a bipolar universal high-current highly-protected low side driver with transparent input and 2 A continuous-current sink capability. A high-level input activates the output.
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1522-PBD
S-164
O-220
3545/1N
3545/1QN
PBD 3545
transistor 1317
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Thermal Management
Abstract: Heatsinks for 14 pin dip 16 pin dip with heat sink njm3717 NJM3771 NJM3772 NJM3774 NJM3770A NJM3777
Text: Thermal Management New JRC’s stepper motor ICs are power Ics encapsulated in Dual in Line DIP , EMP and PLCC (Plastic Leaded Chip Carrier) packages. The silicon die is directly bonded to a heat-spreading lead-frame for efficient heat-transfer to an external heat sink, or to a copper ground plane on the printed circuit board.
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TO-220 package thermal resistance
Abstract: A 3548 application note PBD 3545 PBD 3545 3548-1 pbd 3548 robot circuit diagram free 1522-PBD PBD3548 BYV98
Text: February 1999 PBD 3548/1 Universal Source Driver Description Key Features PBD 3548/1 is a bipolar universal high-current highly-protected high side driver with transparent input and 2 A continuous-current source capability. A low-level input activates the output.
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3548/1N
TO-220 package thermal resistance
A 3548
application note PBD 3545
PBD 3545
3548-1
pbd 3548
robot circuit diagram free
1522-PBD
PBD3548
BYV98
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T17B
Abstract: intel 24022
Text: intei lntel387TM SX MATH COPROCESSOR The ambient temperature 0 a is guaranteed as long as Tc is not violated. The ambient temperature can be calculated from the 0 jc thermal resistance con stant from the transistor junction to the case) and 0 j a (thermal resistance from junction to ambient)
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Intel387
68-pin
lntel387TM
Intel387TM
T17B
intel 24022
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PALC22V10B-20KMB
Abstract: PALC22V10B-20WMB PALC22V10B20WMB palc22v10b-15hc V103-6 ecl pal 16 macrocells PALC22V10B palc22v10b-15jc cypress 22V10b PALC22V10B-15KMB
Text: CYPRESS SEMI CONDUCTOR b£E T> SS f i T b b E QG1D3Ô3 2Mb CYP PALC22V10B CYPRESS SEMICONDUCTOR • Advanced second generation PAL ar chitecture • Low power — 90 m A max. standard — 100 mA max. military • CMOS EPROM technology for repro grammability
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PALC22V10B
T-90-20
PALC22V10B-20KMB
PALC22V10B-20WMB
PALC22V10B20WMB
palc22v10b-15hc
V103-6
ecl pal 16 macrocells
PALC22V10B
palc22v10b-15jc
cypress 22V10b
PALC22V10B-15KMB
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CLCC 64 pins footprint
Abstract: eprom mtbf CY10E474 64 CERAMIC LEADLESS CHIP CARRIER LCC CY10E301
Text: CY7C285 CYPRESS SEMICONDUCTOR 64K x 8 Reprogrammable Fast Column Access PROM Features Functional Description • CMOS for optimum speed/power T h e CY7C285 is a high-perform ance 65,536 by 8 -bit C M O S P R O M . It is avail able in a 28-pin 300-mil package and fe a
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CY7C285
300-mil
28-pin
64-byte
T-90-20
CLCC 64 pins footprint
eprom mtbf
CY10E474
64 CERAMIC LEADLESS CHIP CARRIER LCC
CY10E301
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238Q
Abstract: 7C371-66 7C371-83 CY7C371 CY7C372 FLASH370 319q CLCC 64 pins footprint
Text: CYPRESS bSE SEMICONDUCTOR D ESSTbbS 0010S3Ö CY7C371 PRELIMINARY CYPRESS SEMICONDUCTOR Ob4 32-Macrocell Flash PLD Features Functional Description • 32 macrocells in two logic blocks • 32 I/O pins • 6 dedicated inputs including 2 clock pins • No hidden delays
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CY7C371
32-Macrocell
100MHz
44-pin
CY7C372
FLASH370
22V10
238Q
7C371-66
7C371-83
319q
CLCC 64 pins footprint
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IDT7201
Abstract: IDT7202 linear array 512 MTBF 421A1
Text: CYPRESS SEMICONDUCTOR bSE ]> • ESflTLbS OOlQbM'i ÖEO CY7C421A CY7C425A PRELIMINARY CYPRESS SEMICONDUCTOR High-Speed Cascadable 51 2 x 9 FIFO IK X 9 FIFO • TI L compatible • Three-state outputs • Pin compatible and functional equivalent to IDT7201 and IDT7202
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CY7C421A
CY7C425A
512x9
10-ns
300-mil
28-pin
32-pin
IDT7201
IDT7202
linear array 512 MTBF
421A1
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OA32
Abstract: ca3262
Text: CA3262A, CA3262 HARRIS S E M I C O N D U C T O R Quad-Gated, Inverting Power Drivers August 1997 Features Description • Independent Over-Current Limiting On Each Output The CA3262 and CA3262A are used to interface low-level logic to high current loads. Each Power Driver has four
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CA3262A,
CA3262
CA3262
CA3262A
CA3262AE
CA3262AQ
OA32
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CY10E301
Abstract: 7C245A CY7C245A CLCC 64 pins footprint CY7C245A-25QMB motorola 28pin smd control board
Text: CYPRESS SEMI CONDUCTOR bSE J> 2Sf i ^t . bS 0010171 7bE CY7C245A r^ Y p p irc c ; Reprogrammable 2K x 8 Registered PROM SEMICONDUCTOR • SV ±10% V cci commercial and military Features • Windowed for reprogrammability • CMOS for optimum speed/power • High speed
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CY7C245A
15-ns
10-ns
300-mil,
24-pin
2048-OR
T-90-20
CY10E301
7C245A
CLCC 64 pins footprint
CY7C245A-25QMB
motorola 28pin smd control board
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Untitled
Abstract: No abstract text available
Text: QL8X12A pASIC 1 FAMILY Very-High-Speed IK 3K Gate CMOS FPGA A pril 1993 pASIC HIGHLIGHTS Eg Very-High-Speed, Flexible FPGA Architecture - ViaLink metal-tometal, low-resistance antifuse (<50 ohm) interconnect technology allows data path performance over 125 MHz with logic cell delays of under 2.5 ns.
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QL8X12A
8-by-12
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Untitled
Abstract: No abstract text available
Text: £B CA3262A, CA3262 Quad-Gated Inverting Power Drivers November 1995 Features Description • Independent Over-Current Limiting On Each Output The CA3262 and CA3262A are used to interface low-level logic to high current loads. Each Power Driver has four inverting switches consisting of a non-inverting logic input
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CA3262A,
CA3262
CA3262
CA3262A
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