XC68307
Abstract: xpc821 XC68HC901 XC68EC060 XC68040 XC68330FC XC68060 SPAK821 mc68340rp MC68230
Text: SG167/D REV 20 µ MOTOROLA Embedded Systems FACT SHEET 3rd QUARTER 1996 FC = Plastic Quad Gull Wing FE = Ceramic Quad (Gull Wing) FG = Plastic Quad Flat Pack (PQFP) FN = Plastic Quad Pack (PLCC) FT = Plastic Flat Pack (28 x 28 mm) FU = Plastic Quad Flat Pack (14 x 14 mm)
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SG167/D
MC68341EST
MC68341
M68349CPU
M68349
M68349IDP
MPC821ADS
MPC821
MPC821ADS-PC
XC68307
xpc821
XC68HC901
XC68EC060
XC68040
XC68330FC
XC68060
SPAK821
mc68340rp
MC68230
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Untitled
Abstract: No abstract text available
Text: 94 94 Cutter for Plastic Pipes, for the Electrical Installation ̈ for clean cutting of plastic pipes e.g. plastic clad pipes with 6 - 35 mm dia. ̈ not suitable for cutting cables ̈ blade is replaceable and can be retracted in any position ̈ low force requirement due to
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Untitled
Abstract: No abstract text available
Text: CUTTER, PLASTIC PIPE Plastic Pipe Cutter Cat No: 862 UPC No: 783310898061 Description • • • • • Cuts 3/4 IN schedule 40 PVC Cuts 1/8 IN - 1-3/8 IN 3-35mm O.D. flexible plastic pipe Diecast aluminum alloy body for added strength and bladeguide for square cuts
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3-35mm)
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3SB23 04-2A siemens
Abstract: 3SB24 3SB12 01 3ta21 siemens IEC 60947 VDE 0660 3SB14 00-0C siemens 3SB36 Sirius 3SB3 3SB14 3sb29
Text: Commanding and Signaling Devices Introduction • Overview 3SB2 3SB30, 3SB32 3SB31, 3SB33 3SB35, 3SB36 16 mm Plastic, round 22 mm Plastic, round 22 mm Plastic, square 22 mm Metal, round ✔ ✔ -✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ -✔ ✔ ✔ ✔ ✔ ✔ ✔
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3SB30,
3SB32
3SB31,
3SB33
3SB35,
3SB36
8WD44
58-6XB
58-6XC
3SB23 04-2A siemens
3SB24
3SB12 01
3ta21
siemens IEC 60947 VDE 0660
3SB14 00-0C
siemens 3SB36
Sirius 3SB3
3SB14
3sb29
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Intel reflow soldering profile BGA
Abstract: socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC heat pipes intel pbga package weight BGA OUTLINE DRAWING intel mother board circuit land pattern BGA 0,50 324 bga thermal
Text: 2 14 An Introduction to Plastic Ball Grid Array PBGA Packaging 1/17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 14 AN INTRODUCTION TO PLASTIC BALL GRID ARRAY (PBGA) PACKAGING 14.1. INTRODUCTION The plastic ball grid array (PBGA) is today on its way to becoming one of the most popular
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CH14WIP
Intel reflow soldering profile BGA
socket s1 REFLOW PROFILE
intel topside mark
outline of the heat slug for JEDEC
heat pipes intel
pbga package weight
BGA OUTLINE DRAWING
intel mother board circuit
land pattern BGA 0,50
324 bga thermal
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bticino
Abstract: bTicino Magic 1SL9891A00 1SL9143A00 1SLC800001D0201 6 canali 393 EZ 639 393 EZ 952 galvanised steel conduit 1SL9033A00
Text: Technical catalogue Plastic and metal trunking systems Plastic and metal trunking systems In consideration of modifications to Standards and materials, the characteristics and overall dimensions indicated in this catalogue may be considered binding only following
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1SLC800001D0201
1SLC800001D0201
bticino
bTicino Magic
1SL9891A00
1SL9143A00
6 canali
393 EZ 639
393 EZ 952
galvanised steel conduit
1SL9033A00
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Untitled
Abstract: No abstract text available
Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M72PBG
32Mx72
AS4DDR232M72PBG
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Untitled
Abstract: No abstract text available
Text: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR264M72PBG
64Mx72
AS4DDR264M72PBG
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AS4DDR264M72PBG
Abstract: DDR2 16 meg x16 industrial
Text: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR264M72PBG
64Mx72
AS4DDR264M72PBG
DDR2 16 meg x16 industrial
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AS4DDR232M64PBG
Abstract: No abstract text available
Text: iPEM 2.1 Gb SDRAM-DDR2 AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M64PBG
32Mx64
AS4DDR232M64PBG
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Untitled
Abstract: No abstract text available
Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M72PBG
32Mx72
AS4DDR232M72PBG
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infra red sensors
Abstract: Aspheric Lens TO Can bandpass filter PLC biconvex lens
Text: SYSTEMS DIVISION PLASTIC OPTICAL COMPONENTS IMAGING AND NON-IMAGING PLASTIC OPTICAL COMPONENTS DESCRIPTION FEATURES: Due to customer requests Semelab has developed the capability to design and supply polymer based optical components. These devices can be used to complement the
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AS4DDR264M72PBG
Abstract: AS4DDR232M72APBG
Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M72APBG
32Mx72
AS4DDR264M72PBG
AS4DDR232M72APBG
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Untitled
Abstract: No abstract text available
Text: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR264M72PBG
64Mx72
AS4DDR264M72PBG
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AS4DDR32M72PBG
Abstract: No abstract text available
Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply
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AS4DDR32M72PBG1
32Mx72
333Mbps
23mm-1
AS4DDR32M72PBG
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Untitled
Abstract: No abstract text available
Text: iPEM PRELIMINARY 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M72APBG
32Mx72
AS4DDR232M72APBG
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Untitled
Abstract: No abstract text available
Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply
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AS4DDR32M72PBG1
32Mx72
333Mbps
23mm-1
208-PBGA
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AMD2910A
Abstract: microprogram up down counter DIN11 IA2910A IA2910A-PDW40C IA2910A-PLC44C
Text: IA2910A Microprogram Controller Data Sheet FEATURES • Form, Fit, and Function Compatible with the AMD Am2910A • Packaging options available: 40 Pin Plastic or Ceramic DIP, 44 Pin Plastic Leaded Chip Carrier • Twelve Bits Wide • Internal Loop Counter
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IA2910A
Am2910A
IA2910A
ENG211001219-01
IA2910A-PDW40C
IA2910A-PLC44C
AMD2910A
microprogram
up down counter
DIN11
IA2910A-PDW40C
IA2910A-PLC44C
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Untitled
Abstract: No abstract text available
Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply
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AS4DDR32M72PBG1
32Mx72
333Mbps
23mm-1
208-PBGA
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AS4DDR32M72PBG
Abstract: No abstract text available
Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 219 Plastic Ball Grid Array PBGA , 32 x 25mm 2.5V ±0.2V core power supply 2.5V I/O (SSTL_2 compatible)
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AS4DDR32M72PBG
32Mx72
333Mbps
AS4DDR32M72PBG
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m6 bolt shear strength
Abstract: AMTEC SPREDSERT m8 bolt shear strength torque for SELF TAPPING SCREW PBT GF-30 PA 66 GF 30 torque for M6 brass bolt m2 bolt shear strength metric bolts torque m 32 thread inserts
Text: 0200/10.02 AMTEC Precision thread inserts for plastic parts and equipment for installation AMTEC® thread inserts Contents AMTEC® – highly wear-resistant thread inserts for plastic parts The advantages – an overview Selection guide for AMTEC® thread inserts
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AS4DDR232M72APBG
Abstract: No abstract text available
Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm
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AS4DDR232M72APBG
32Mx72
AS4DDR232M72APBG
2010Preliminary
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Untitled
Abstract: No abstract text available
Text: 12 11 10 9 8 7 6 1. MATERIAL: CAGE: NICKEL SILVER, THICKNESS: 0.25mm CONNECTOR HOUSING: GLASS FILLED HIGH TEMP PLASTIC, COLOR: BLACK OVERMOLDED TERMINAL HOUSING: GLASS FILLED HIGH TEMP PLASTIC, COLOR: BLACK TERMINALS: BRASS LIGHT PIPES: POLYCARBONITE, 94 V -0, CLEAR
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OCR Scan
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PDF
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PS-75310-001
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smd transistor nm
Abstract: 6 pin TRANSISTOR SMD CODE p Transmissive Optical Sensor 3 pin nm smd transistor SMD Transistor 1f TRANSISTOR 610 smd Photo Modules NM smd transistor NM DUAL IR REFLECTIVE SENSOR telefunken LED
Text: VISHAY Vishay Telefunken Y Vishay Telefunken Type Designation Code Detectors U • T • • • 1 Vishay Telefunken T 1 f Series P = Plastic F = Plastic Filter S = Side View M = SMD Y = Fiber Optic Internal Classification Package Varieties 1f Detector 1r
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