container
Abstract: No abstract text available
Text: PLASTIC TUBE DIMENSIONS 2. PLASTIC TUBE CONTAINER DIMENSIONS DIP, SDIP, DMP, SDMP, SOP packages can pack in the plastic tube container the dimensions are mentioned as follows. • PLASTIC TUBE CONTAINER FOR DUAL IN LINE PLASTIC MOLD PACKAGE Plastic Tube Container for DIP16, SDIP22pin
|
Original
|
DIP16,
SDIP22pin
494mm
25pcs/tube
508mm
20pcs/tube
505mm
DIP20pin
SDIP24pin
container
|
PDF
|
EMP24-E3
Abstract: EMP20-E2 DIP18 DIP20 702 mini transistor 25PCS
Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold
|
Original
|
50pcs/tube
DIP14/16
DIP14
25pcs/tube
DIP16
25ype)
O-220F
O-220F-4
EMP24-E3
EMP20-E2
DIP18
DIP20
702 mini transistor
25PCS
|
PDF
|
DIP18
Abstract: DIP20
Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold
|
Original
|
50pcs/tube
DIP14/16
DIP14
25pcs/tube
DIP16
25ype)
O-220F
O-220F-4
DIP18
DIP20
|
PDF
|
DIP18
Abstract: DIP20 TO-220F-4
Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold
|
Original
|
50pcs/tube
DIP14/16
DIP14
25pcs/tube
DIP16
25ype)
O-220F
O-220F-4
DIP18
DIP20
TO-220F-4
|
PDF
|
DIP18
Abstract: DIP20 DIP40 702 mini transistor
Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as fillows. 1. Plastic Tube Container for dual-in-line plastic mold
|
Original
|
50pcs/tube
DIP14/16
O-220F
O-220F-4
25pcs/tube
PLCC28-M2
DIP18
DIP20
DIP40
702 mini transistor
|
PDF
|
TB389
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L16.5x5 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
|
Original
|
MO-220VHHB
P30mm
TB389.
TB389
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Exposed Pad Plastic Packages EPTQFP Q64.10x10B (JEDEC MS-026ACD-HU ISSUE D) 64 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE D D1 -D- MILLIMETERS SYMBOL EJECTOR PIN MARK NOT PIN #1 ID
|
Original
|
10x10B
MS-026ACD-HU
11o-13o
|
PDF
|
4983e
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Shrink Small Outline Plastic Packages SSOP Quarter Size Outline Plastic Packages (QSOP) M16.15A N INDEX AREA H 0.25(0.010) M E 2 INCHES GAUGE PLANE -B1 16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE (0.150” WIDE BODY)
|
Original
|
|
PDF
|
MO-220-VHHC
Abstract: TB389 MO-220VHHC 0758N
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.5x5 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 - A1 - 0.02 0.05 - A2 - 0.65
|
Original
|
TB389.
MO-220VHHC
MO-220-VHHC
TB389
0758N
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L56.8x8A 56 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VLLD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
|
Original
|
MO-220VLLD-2
TB389.
|
PDF
|
3NE8
Abstract: MO-220-vhhd-2 TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L32.5x5B 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHD-2 ISSUE C MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
|
Original
|
MO-220VHHD-2
TB389.
3NE8
MO-220-vhhd-2
TB389
|
PDF
|
land pattern for QFN 7x7
Abstract: MO-220-VKKD-1 TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L44.7x7 44 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VKKD-1 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
|
Original
|
MO-220VKKD-1
TB389.
land pattern for QFN 7x7
MO-220-VKKD-1
TB389
|
PDF
|
TB389
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.6x6B 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
|
Original
|
MO-220VJJB
-30mm
TB389.
TB389
|
PDF
|
MO-220-VGGD-2
Abstract: TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L24.4x4C 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VGGD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
|
Original
|
MO-220VGGD-2
TB389.
MO-220-VGGD-2
TB389
|
PDF
|
|
footprint dip
Abstract: TSOP 86 Package CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC TQFP 80 PACKAGE footprint ceramic pin grid array package lead finish
Text: Plastic Packages National Semiconductor offers a wide variety of plastic packages for through-hole and surface mount applications. Many of these plastic packages provide cost-effective solutions to achieving greater board density surface-mount packages and high performance. Plastic packages are extensively
|
Original
|
|
PDF
|
MO-220-VJJD-2
Abstract: TB389 tip 410
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L40.6x6 40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
|
Original
|
MO-220VJJD-2
TB389.
MO-220-VJJD-2
TB389
tip 410
|
PDF
|
MO-220-VGGC
Abstract: MO-220 TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L16.4x4 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220-VGGC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
|
Original
|
MO-220-VGGC
TB389.
MO-220
TB389
|
PDF
|
jedec package MO-220 vggc
Abstract: MO-220-VGGC 12-leadquad TB389 jedec package MO-220 MO-220 Technical Brief TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L12.4x4 12 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220-VGGC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
|
Original
|
MO-220-VGGC
TB389.
jedec package MO-220 vggc
12-leadquad
TB389
jedec package MO-220
MO-220
Technical Brief TB389
|
PDF
|
10N20
Abstract: 015mm TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.6x6 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80
|
Original
|
MO-220VJJB
-30mm
TB389.
10N20
015mm
TB389
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Exposed Pad Plastic Packages EPTQFP Q64.10x10C (JEDEC MS-026ACD-HU ISSUE D) 64 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE D D1 -D- MILLIMETERS SYMBOL EJECTOR PIN MARK NOT PIN #1 ID
|
Original
|
10x10C
MS-026ACD-HU
11o-13o
|
PDF
|
land pattern for QFN 7x7
Abstract: MO-220-VKKD-2 qfn 7x7 jedec
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L48.7x7 48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VKKD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
|
Original
|
MO-220VKKD-2
TB389.
land pattern for QFN 7x7
MO-220-VKKD-2
qfn 7x7 jedec
|
PDF
|
MO-220-VGGD-2
Abstract: TB389
Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L24.4x4 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VGGD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A
|
Original
|
MO-220VGGD-2
TB389.
MO-220-VGGD-2
TB389
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dinensions DIP, SDIP, SIP, ZIP, DMP, SOHP, SOP, EMP, SOT the dimensions are mentioned as follows. packages can pack in the plastic tube container 1.Plastic Tube Container for dual-in-line plastic mold D P I a s t i c Tube Container dimensions for DIP8
|
OCR Scan
|
\T465
IP8-50pcs/tube
DIP14/16
IP14-25pcs/tube
16-25pcs/tube
50pcs/tube
S0P18/2Q/22
25pcs/tube
S0P40
15pcs/tube
|
PDF
|
bf465
Abstract: No abstract text available
Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions D IP, SD IP, SIP, ZIP, D M P, SD M P, SOP, EM P, SO T packages can pack in the plastic tube container the dim ensions are m entioned as follows. 1.Plastic T ube C ontainer for d ual-in-line plastic m old
|
OCR Scan
|
DIP8-50pcs/tube
IP14/16
4-25pcs/tube
100pcs/tube
50pcs/tube
25pcs/tube
25pcs/tube
SQP40
bf465
|
PDF
|