mini HDMI
Abstract: HDMI to mini HDMi CECC75 685119136923
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: LCP FLAMMABILITY RATING UL94-V0 COLOUR: BLACK CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRASS TIN PLATED QUALITY CLASS: 3 AS PER CECC 75 301-802
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Original
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UL94-V0
E323964
14-JUN-10
19-NOV-09
05-DEC-07
20-NOV-07
mini HDMI
HDMI to mini HDMi
CECC75
685119136923
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PDF
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Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: PPS MAX TEMPERATURE: REFLOW SOLDERING COMPATIBLE COLOR: BROWN CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: TIN QUALITY CLASS: 25 MATING CYCLES A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 105°C
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Original
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UL94-V0
18-OCT-05
09-APR-06
18-OCT-07
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PDF
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Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
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UL94-V0
2002/95/EC
30Vac
100Vac/min
21-SEP-11
10-MAY-11
16-SEP-10
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PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
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UL94-V0
2002/95/EC
30Vac
100Vac/min
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
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UL94-V0
2002/95/EC
30Vac
100Vac/min
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
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UL94-V0
2002/95/EC
30Vac
100Vac/min
PPR-14
12-AUG-13
09-NOV-11
21-SEP-11
10-MAY-11
16-SEP-10
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PDF
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stencil
Abstract: USB Connector pcb layout r840 USB 3.0 plug Connector pcb layout "30 pin" SMT connector
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
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UL94-V0
2002/95/EC
30Vac
100Vac/min
stencil
USB Connector pcb layout
r840
USB 3.0 plug Connector pcb layout
"30 pin" SMT connector
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PDF
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J-STD-020D
Abstract: JEDEC J-STD-020d
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
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UL94-V0
2002/95/EC
30Vac
100Vac/min
J-STD-020D
30-SEP-10
J-STD-020D
JEDEC J-STD-020d
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PDF
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J-STD-020D
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
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UL94-V0
2002/95/EC
30Vac
100Vac/min
04-AUG-10
02-APR-10
J-STD-020D
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PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
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UL94-V0
2002/95/EC
30Vac
100Vac/min
08-DEC-11
09-NOV-11
21-SEP-11
10-MAY-11
04-AUG-10
02-APR-10
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PDF
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Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: PBT FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
J-STD-020D
04-NOV-11
21-SEP-11
10-MAY-11
30-SEP-10
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: PPS MAX TEMPERATURE: REFLOW SOLDERING COMPATIBLE COLOR: BROWN CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: TIN QUALITY CLASS: 25 MATING CYCLES A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 105°C
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Original
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UL94-V0
06-MAR-12
18-OCT-05
09-APR-06
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PDF
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J-STD-020D
Abstract: weri
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
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UL94-V0
2002/95/EC
30Vac
100Vac/min
J-STD-020D
16-SEP-10
J-STD-020D
weri
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PDF
|
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
J-STD-020D
21-SEP-11
10-MAY-11
30-SEP-10
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
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UL94-V0
2002/95/EC
30Vac
100Vac/min
01-APR-14
12-AUG-13
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
09-NOV-11
21-SEP-11
10-MAY-11
04-AUG-10
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS 12.00 12.15 MATERIAL INSULATOR MATERIAL: LCP COLOUR: BLACK CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRASS TIN PLATED QUALITY CLASS: 3 AS PER CECC 75 301-802 A ENVIRONMENTAL
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Original
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UL94-V0
05-DEC-07
20-NOV-07
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PDF
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micro USB pcb layout
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLACK CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.38 to 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
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UL94-V0
2002/95/EC
30Vac
100Vac/min
J-STD-020D
16-MAR-12
10-MAY-11
26-APR-11
04-AUG-10
micro USB pcb layout
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PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLACK CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.38 to 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
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Original
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
19-SEP-12
16-MAR-12
10-MAY-11
26-APR-11
04-AUG-10
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 15.48 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE Nickel CONTACT AREA Pd-Ni + Gold SOLDER TAIL AREA Matt Tin SHIELDING: BRASS MATT TIN PLATED
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Original
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UL94-V0
2002/95/EC
30Vac
|
PDF
|
JC EC
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: LCP COLOUR: BLACK CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRASS TIN PLATED QUALITY CLASS: 1500 MATING CYCLES A ENVIRONMENTAL OPERATING TEMPERATURE: –25 °C UP TO 85 °C
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Original
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UL94-V0
09-NOV-11
05-OCT-10
08-JUL-10
05-DEC-07
20-NOV-07
JC EC
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PDF
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