PGA SURFACE MOUNTING TYPE Search Results

Contextual Info: Series 505 PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adapter FEATURES • Convert surface mount PLCC packages to a PGA footprint • Pin polarization option also available • Consult factory for Panelized Form or for mounting of consigned chips GENERAL SPECIFICATIONS

AMS-QQ-N-290

Abstract: 84 Pin PLCC Socket
Contextual Info: Series 505 PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adapter FEATURES • Convert surface mount PLCC packages to a PGA footprint • Pin polarization option also available • Consult factory for Panelized Form or for mounting of consigned chips GENERAL SPECIFICATIONS

XX-505-11

Contextual Info: Series 505 PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adapter FEATURES • Convert surface mount PLCC packages to a PGA footprint • Pin polarization option also available • Consult factory for Panelized Form or for mounting of consigned chips GENERAL SPECIFICATIONS

Contextual Info: Series 505 PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adapter FEATURES • Convert surface mount PLCC packages to a PGA footprint • Pin polarization option also available • Consult factory for Panelized Form or for mounting of consigned chips GENERAL SPECIFICATIONS

Contextual Info: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: • Convert surface mount PQFP packages to a PGA footprint. • Available with or without .020 [.51] high stand-offs. • Consult factory for panelized form or for mounting of consigned chips.

Contextual Info: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: • Convert surface mount PQFP packages to a PGA footprint. • Available with or without .020 [.51] high stand-offs. • Consult factory for panelized form or for mounting of consigned chips.

Datasheet of IC 7432

Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
Contextual Info: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type

Contextual Info: POPS SERIES CONNECTORS 2.54m m .1 00 " Pitch, Sockets for Pin Grid Array Packages The POPS Series are sockets for 2.54mm (.100") center pin grid array-type LSIs. The Zero-Insertion-Force (ZIF) mechanism enables high density LSI mounting/dismounting by single lever

Contextual Info: j4 - p ^ -o 5 PCPS SERIES CONNECTORS 2.54mm .100" Pitch, Sockets for Pin Grid Array Packages The PCPS Series are sockets fo r 2.54mm (.100") center pin grid array-type LSIs. The Zero-lnsertion-Force (ZIF) mechanism enables high density LSI m ounting/dism ounting by single lever

PGA pin count

Abstract: 4042AS Shrink Zig-Zag In-line Package
Contextual Info: 1. PACKAGE CLASSIFICATIONS 1-3. 1 Through-hole mounting type package Type Package Types DIP Pin Count Standard RS 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 Skinny RS 20, 22 Shrink SS 30, 42, 64 ZS 20, 24, 28, 40 ZIP 8 Package Symbol Plastic Through-hole Mounting Type

44-pin plcc pcb mount footprint

Abstract: ASTM-B16-85 MIL-T-10727
Contextual Info: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: • Convert surface mount PLCC packages to a PGA footprint. • Optional open frame allows for more efficient utilization of board space and better cooling. • Pin polarization option also available.

Contextual Info: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: • Convert surface mount PLCC packages to a PGA footprint. • Optional open frame allows for more efficient utilization of board space and better cooling. • Pin polarization option also available.

44-pin plcc pcb mount footprint

Abstract: 84 pin PGA pins assignment
Contextual Info: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: • Convert surface mount PLCC packages to a PGA footprint. • Optional open frame allows for more efficient utilization of board space and better cooling. • Pin polarization option also available.

44-pin plcc pcb mount footprint

Abstract: PGA Surface Mounting Type ASTM-B16-85
Contextual Info: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: • Convert surface mount PLCC packages to a PGA footprint. • Optional open frame allows for more efficient utilization of board space and better cooling. • Pin polarization option also available.

ICKS 45

Abstract: MMX intel fc pga SLOT PGA 370
Contextual Info: Heatsinks for IC processor a rt. n o . page ^th [K/W ] dissipation m ounting method socket suitable fo r processor type conductive fo il/ cond. adhesive conductive fo il/ cond. adhesive universal universal universal universal loss IC K P G A 6 x 6 x 1 4 B 10

44-pin plcc pcb mount footprint

Contextual Info: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: •Convert surface mount PLCC packages to a PGA footprint. •Optional open frame allows for more efficient Utilization of board space and better cooling. •Pin polarization option also available.

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

tsop 48 PIN type2

Abstract: 50 mil pitch ceramic package BGA and QFP Package mounting 64 pin IC FOUR SIDE 48 pin ic qfj 84-Pin QFN
Contextual Info: Packages for IC Through-hole mount type DIP Surface mount type1 SIP Dual In-line Package (Single In-line Package) Terminals are on one side of the package and are arranged in a row. Terminals are on two opposite sides of the package and are arranged two rows.

BGA and QFP Package mounting

Abstract: tab ic
Contextual Info: 1. PACKAGE CLASSIFICATIONS IC packages are classified as indicated below according to the shape, material, and mounting method. QFP 4-way Lead TQFP / LQFP Flat SOP SSOP Bidirectional Lead TSOP SHP Surface Mounting Type Chip Carrier Bidirectional Lead SOJ 4-way Lead

land pattern for TSOP 2 86 PIN

Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS

Contextual Info: Package Lineup Package Lineup The packages are classified as follows, according to form, material, and the mounting methods for which they are suited. Packages TÍ Vertical type, Single lead Lead inserted type SIP ZIP Horizontal type,” Double lead — Matrix type

pc cooler fan

Abstract: intel 80486 k6-2 500 intel pentium mmx 80486 pentium mmx PENTIUM k6III pentium 200 mmx Pentium MMX MODULE
Contextual Info: Hola1 H A H Passive heatsinks for processors B art. no. Rth [K/W] suitable for processor type 6.1 4.5 DEC Alpha-AXP DEC Alpha-AXP ICK A 10 ICK A 20 C dim. [mm] A 10 20 D E art. no. Rth [K/W] suitable for processor type 8.1 Power PC ICK PPC 51 F fixing method:

ASTM-B16-85

Abstract: MIL-T-10727
Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

uPD70216

Abstract: PD70208GF
Contextual Info: NEC /¿PD70208, 70208 A , 70216, 70216 (A) 18. RECOMMENDED SOLDERING CONDITIONS * This product should be soldered and mounted under the conditions recommended in the table below. For the details of recommended soldering conditions for the surface mounting type, refer to the information document