PFME Search Results

Contextual Info: FUSES Resettable fuses NEW Typical Time to Trip at 23 ˚C PF ME .19 0.2 Surface Mount PTC-Fuses Type PFME PFME 5,3 x 11,5 mm fast tripping Packaged per EIA 481-1 100 100 °C trip temperature Agency recognition: UL, CSA, TÜV Time to trip s 10 50 75 1 0.1

Contextual Info: FUSES / SICHERUNGEN Resettable fuses / Rückstellende Sicherungen Oberflächenmontage PTC-Sicherungen Typ PFME 5,3 x 11,5 mm fast tripping Packaged per EIA 481-1 5,3 x 11,5 mm flink Verpackungsnorm: EIA 481-1 100 °C trip temperature Agency recognition: UL, CSA, TÜV

STK 483

Abstract: STK 033
Contextual Info: FUSES / SICHERUNGEN Resettable fuses / Rückstellende Sicherungen NEU Surface Mount PTC-Fuses Type PFME Oberflächenmontage PTC-Sicherungen Typ PFME 5,3 x 11,5 mm fast tripping Packaged per EIA 481-1 5,3 x 11,5 mm flink Verpackungsnorm: EIA 481-1 100 °C trip temperature

Contextual Info: FUSES / SICHERUNGEN Resettable fuses PFME Typical Time to Trip at 23 ˚C PF ME .19 0.2 Surface Mount PTC-Fuses Type PFME 5,3 x 11,5 mm fast tripping Packaged per EIA 481-1 100 100 °C trip temperature Agency recognition: UL, CSA, TÜV 10 50 75 Time to trip s

Contextual Info: FUSES Resettable fuses NEW Typical Time to Trip at 23 ˚C PF ME .19 0.2 Surface Mount PTC-Fuses Type PFME PFME 5,3 x 11,5 mm fast tripping Packaged per EIA 481-1 100 100 °C trip temperature Agency recognition: UL, CSA, TÜV Time to trip s 10 50 75 1 0.1

PPAP level submission requirement table

Abstract: PPAP MANUAL for automotive industry foundry metals quality MANUALS result of 200 prize bond INCOMING MATERIAL INSPECTION checklist, PCB TSMC 90nm sram SMD a006 ISO 9001 Sony foundry INCOMING MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION procedure
Contextual Info: Contents Contents i Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2000 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning 1.4.3 Quality Assurance in the Project Approval Stage

PPI0000549

Abstract: 12w 99 M/TYCO PBT-GF15 1/PBT-GF15 CONNECTOR 0/12w 99
Contextual Info: NOTA 1 SPECIFICATION 3D VIEW M 1:1 CONNECTEUR CONFORME A STE PSA 96 269 436 99 ind E ET A LA SPECIFICATION TECHNIQUE FCI FEPS 09006 FEMALE CONNECTOR ACCORDING TO STE PSA 96 269 436 99 ind E AND THE FCI TECHNICAL SPECIFICATION FEPS 09006 2 1 2 Reference / Indice

INCOMING RAW MATERIAL INSPECTION format

Abstract: INCOMING RAW MATERIAL INSPECTION checklist PPAP MANUAL ford ppap INCOMING RAW MATERIAL INSPECTION report format INCOMING RAW MATERIAL INSPECTION procedure FORD apqp manual Ford in-process quality APQP 40F-701-1-15
Contextual Info: Status of Document is:RELEASED Effective from: 21-OCT-1997 08:01:45 to Date Printed: 01/15/98 8:20 AM PURPOSE: Controlled Document DOCUMENT QUALITY POLICIES Quality Manual Harris Semiconductor Findlay, Ohio Title: Specification Type: DOCS QUALITY AND RELIABILITY MANUAL - FINDLAY

IEC62053-22

Contextual Info: Poly-Phase High-Performance Wide-Span Energy Metering IC 90E36 Version 1.1 August 24, 2011 6024 Silver Creek Valley Road, San Jose, CA 95138 2011 Integrated Device Technology, Inc. DISCLAIMER Integrated Device Technology, Inc. reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to supply the best possible product. IDT does not assume any responsibility for use of any circuitry described other than the circuitry embodied in an IDT product. The Company makes no representations that circuitry

90E32

Abstract: M/B111
Contextual Info: Poly-Phase High-Performance Wide-Span Energy Metering IC 90E32 Version 1.0 August 24, 2011 6024 Silver Creek Valley Road, San Jose, CA 95138 2011 Integrated Device Technology, Inc. DISCLAIMER Integrated Device Technology, Inc. reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to supply the best possible product. IDT does not assume any responsibility for use of any circuitry described other than the circuitry embodied in an IDT product. The Company makes no representations that circuitry

90E36

Abstract: 90E36A 04h07h
Contextual Info: Poly-Phase High-Performance Wide-Span Energy Metering IC 90E36A Version 1.0 March 29, 2013 Table of Contents FEATURES . 7

b0352

Abstract: B0351 mosfet b0351 swn 357 F B0351
Contextual Info: TPS2500, TPS2501 www.ti.com. SLVS886A – OCTOBER 2008 – REVISED AUGUST 2009 INTEGRATED USB POWER SWITCH WITH BOOST CONVERTER

tsmc cmos 0.13 um sram

Abstract: TSMC 90nm sram ford ppap EMMI microscope TSMC 0.13um process specification PPAP MANUAL for automotive industry Kyocera mold compound semiconductors cross index ISO 9001 Sony foundry metals quality MANUALS
Contextual Info: Integrated Silicon Solution Inc 2012 Q Quality y and Reliability Manual Contents Content Page Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2008 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning

8 pin ic 9435

Abstract: m 9625 b0352
Contextual Info: TPS2500, TPS2501 www.ti.com SLVS886C – OCTOBER 2008 – REVISED AUGUST 2010 INTEGRATED USB POWER SWITCH WITH BOOST CONVERTER Check for Samples: TPS2500, TPS2501 FEATURES APPLICATIONS • • • 1 23 • • • • • • • • • • Integrated Synchronous Boost Converter and

Contextual Info: 1 emUSB USB Device stack CPU-independent User & Reference Guide Document: UM09001 Software version: 2.40k Revision: 2 Date: May 23, 2014 A product of SEGGER Microcontroller GmbH & Co. KG www.segger.com UM09001 User & Reference Guide for emUSB 2010 - 2014 SEGGER Microcontroller GmbH & Co. KG

Contextual Info: Intel C600 Series Chipset Data Sheet March 2012 Document Number: 326514-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

Contextual Info: TPS2505 www.ti.com SPAS093B – DECEMBER 2009 – REVISED JUNE 2010 INTEGRATED DUAL USB SWITCHES, BOOST CONVERTER AND LDO Check for Samples: TPS2505 FEATURES 1 • • • • • • • • • • Integrated Synchronous Boost Converter, LDO and Dual USB Current-Limited Switches

Contextual Info: LOC d r a w in g m a d e in t h ir d a n g l e p r o je c t io n r 50 R E V IS IO N S C o p y r i g h t 1981 by AM P I n c o r p o r a t e d , H a r r i s b u r g , Pa. All I n t e r n a t i o n a l R i g h t s R e s e r v e d . A M P I n c o r p o r a t e d p r o d u c t s

FORD apqp manual

Abstract: ford ppap PPAP MANUAL for automotive industry quality plan apqp statistical process control manual "quality plan"
Contextual Info: Status of Document is:RELEASED Effective from: 22-JAN-1997 14:51:11 to Date Printed: 09/03/97 6:27 AM Controlled Document DESIGN QUALITY PLANNING DOCUMENT TABLE OF CONTENTS Introduction and Fundamentals 1. Planning and Definition of Program 2. Product Design and Development

Contextual Info: A8580 Wide Input Voltage, 2.4 MHz, 2.5 A Asynchronous Buck Regulator With Low-IQ Standby, Sleep Mode, External Synchronization, and NPOR Output Features and Benefits Description • Automotive AEC-Q100 qualified • Withstands surge voltages up to 40 V • Operates as low as 3.4 VIN typ with VIN decreasing

90E36

Abstract: 012x10
Contextual Info: Poly-Phase High-Performance Wide-Span Energy Metering IC 90E36 Version 1.3 October 16, 2012 6024 Silver Creek Valley Road, San Jose, CA 95138 2012 Integrated Device Technology, Inc. DISCLAIMER Integrated Device Technology, Inc. reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to supply the best possible product. IDT does not assume any responsibility for use of any circuitry described other than the circuitry embodied in an IDT product. The Company makes no representations that circuitry

Quartz Crystals

Abstract: third overtone component less crystal oscillator LC resonant High power inductor for series LC resonant
Contextual Info: APPLICATION NOTES QUARTZ CRYSTALS The following considerations must be well studied in order to select the right crystal for your applications: 1 ASIC CHARACTERISTICS : • • • • • • • • • • Negative resistance. Small-signal gain analysis.

b0352

Abstract: B0351 b0352 datasheet swn 357 mosfet 1216 EN61000-4-2 HPA337 SON-10 TPS2500 TPS2501
Contextual Info: TPS2500, TPS2501 www.ti.com. SLVS886A – OCTOBER 2008 – REVISED AUGUST 2009 INTEGRATED USB POWER SWITCH WITH BOOST CONVERTER

90E36A

Contextual Info: Poly-Phase High-Performance Wide-Span Energy Metering IC 90E36A Version 1.0 June 21, 2012 6024 Silver Creek Valley Road, San Jose, CA 95138 2012 Integrated Device Technology, Inc. DISCLAIMER Integrated Device Technology, Inc. reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to supply the best possible product. IDT does not assume any responsibility for use of any circuitry described other than the circuitry embodied in an IDT product. The Company makes no representations that circuitry