PCIMX Search Results

sony cmos sensor imx 175

Abstract: sony IMX 132 CMOS Sony IMX 183 sony IMX 145 image sensor DDR21 imx cmos sony sony IMX 140 sensor sony cmos sensor imx 071
Contextual Info: Document Number: MCIMX35SR2CEC Rev. 8, 04/2010 MCIMX35 i.MX35 Applications Processors for Industrial and Consumer Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Silicon Revisions 2.0 and 2.1 Ordering Information See Table 1 on page 3 for ordering information.

samsung EMMC user guide

Abstract: Jedec lpddr2 samsung lpddr2 Mobile RAM samsung eMMC 4.5 MX53UG n78c AMBA AXI dma controller designer user guide lpddr2 layout SONY VTR M15 DIAGRAM DDR3 jedec
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 4, 11/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

777163-02

Abstract: PCI-MXI-2 777216-02 777218-02 777217-XX National Instruments 777163-01 777219-XX MXI-2 777166-01
Contextual Info: VXIbus/MXIbus Cables VXI-MXI-2 and VME-MXI-2 interfaces connect to any MXI-2 cable connector. The MXI-2 computer interface – for example, the PCI-MXI-2 – normally requires straight-point connectors. If you prefer to use a right-angle connector to save space, you can use the Type

Samsung eMMC 4.41

Abstract: LPDDR2 SDRAM samsung i.MX53 USB_OTG emmc spec samsung samsung EMMC user guide samsung lpddr2 eMMC 4.4 Jedec lpddr2 sahara lcd monitor circuit diagram free
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 3, 7/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

pin vga CRT pinout

Abstract: samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 3, 7/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm

sony cmos sensor imx 175

Abstract: sony CMOS sensor imx 135 MCIMX357 MCIMX353 SS44 marking Sony imx 145 free ba 4918 sony IMX 132 MCIMX355 MCIMX35SR2CEC
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MCIMX35SR2CEC Rev. 10, 06/2012 IMX35 i.MX35 Applications Processors for Industrial and Consumer Products 1 Introduction The i.MX353 and the i.MX357 multimedia applications processors represent the next generation of ARM11

sony cmos sensor imx 117

Abstract: sony cmos sensor imx 185 free ba 4918 Sony imx 145 sony CMOS sensor imx 135 TDA 0200 IMX351
Contextual Info: Document Number: MCIMX35SR2CEC Rev. 9, 08/2010 IMX35 i.MX35 Applications Processors for Industrial and Consumer Products Package Information Plastic Package Case 5284 17 x 17 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information.

DDR3 phy 100 pin diagram

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 1, 3/2011 MCIMX53xD This document contains information on a new product. Specifications and information herein are subject to change without notice. i.MX53xD Applications

sony cmos sensor imx 175

Abstract: sony cmos sensor imx 178 sony IMX 132 sony CMOS sensor imx 136 Sony IMX 183 sony imx 175 US18 OV2640 Camera Module Hardware ARM1136JF-S usb pin configuration sony cmos sensor imx 174
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MCIMX35SR2CEC Rev. 4, 04/2009 MCIMX35 i.MX35 MCIMX35 Multimedia Applications Processors for Industrial and Consumer Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch

sony cmos sensor imx 174

Abstract: Sony IMX 183 Sony IMX 138 CMOS sony IMX 138 sony IMX 135 sony CMOS sensor imx 135 ba 4918 sony cmos sensor imx 178 sony iMX 219 cmos image sensor free ba 4918
Contextual Info: Document Number: MCIMX35SR2CEC Rev. 5, 08/2009 MCIMX35 i.MX35 MCIMX35 Multimedia Applications Processors for Industrial and Consumer Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Silicon Revision 2.0 Ordering Information

vme bus specification

Contextual Info: 9-Slot VXI/VME Mainframe VXI-1200 FlexFrame VXI-1200 FlexFrame High-performance flexible VXI/VME mainframe 9 slots 6 C-Size VXIbus 3 B-Size VXI or VME Unique backplane design – Slot 0 control from either C or B slots High power – 720 W usable power Rugged lightweight design

vme chassis

Abstract: VME pci pci to vme VME controller VME64 VME System Controller PCI-MXI-2
Contextual Info: VME-PCI8000 VMEbus Interface Kits for PCI VME-PCI8000 Series Bidirectional transfers between the VMEbus and computer memory High-performance DMA transfers Maximum throughput across MXIbus 33 Mbytes/s burst 23 Mbytes/s sustained Direct interrupt control Optional dual-ported DRAM expansion

iMX536

Abstract: sahara lcd monitor circuit diagram free us10 sd diode samsung lpddr2 Mobile RAM Automotive Telematics On-board unit Platform emmc jedec mechanical standard Samsung board Board design guide eMMC emmc 4.5 spec samsung sony bullet camera sd 3.0 emmc 4.4
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53AEC Rev. 5, 12/2012 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1

PCI-MXI-2

Contextual Info: VXIbus Interface Kits for PCI NI VXI-PCI80xx ◾◾ VXIplug&play compliance ◾◾ Complete interface to VXI from any PCI-based computer or workstation ◾◾ VXI Slot 0 capability, including Resource Manager ◾◾ Word-serial message-based communication

Contextual Info: Freescale Semiconductor Application Note AN4604 Rev. 2.0, 5/2013 Interfacing the MC34709 with the i.MX53 Microprocessor 1 Purpose The present document shows the reader how to supply and interface the i.MX53 with the Freescale MC34709 PMIC, as well as showing an example of the system implementation at

diode marking code e26

Abstract: PIN DIAGRAM of IC AD 524 ultrasparc
Contextual Info: S un M ic r o e l e c t r o n ic s July 1997 U2P DATA SHEET UPA to PCI Interface D e s c r ip t io n The U2P * chip is the primary connection on an UltraSPARC CPU board between the UPA System Bus including UltraSPARC Processors and Memory and a PCI based I/O Subsystem. Its major functions are

920106-04

Contextual Info: VMEbus Interface Kits for PCI VME-PCI8000 Series VME-PCI8000 Series Bidirectional transfers between the VMEbus and computer memory High-performance DMA transfers Maximum throughput across MXIbus 33 Mbytes/s burst 23 Mbytes/s sustained Direct interrupt control

SCIMX

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

MCIMX535

Abstract: emmc DDR3 pcb layout samsung eMMC 4.5 eMMC 4.4 eMMC rja rjc emmc Pin assignment samsung NAND Flash DIE i.mx53 samsung eMMC 5.0 SCIMX
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53CEC Rev. 6, 03/2013 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

HMI 14 PIN CONNECTOR CONFIGURATION

Abstract: emmc jedec mechanical standard emmc bga 162 "thermal switch" t175
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 2, 5/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

PCIMX255CVM4

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information MCIMX25 i.MX25 Multimedia Applications Processor for Consumer and Industrial Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information.

AE21 ARRAY DIODE

Abstract: Sun UltraSparc T1 STP2223BGA ac10 stc AAD20
Contextual Info: STP2223BGA July 1997 U2P DATA SHEET UPA to PCI Interface DESCRIPTION The U2P * chip is the primary connection on an UltraSPARC CPU board between the UPA System Bus including UltraSPARC Processors and Memory and a PCI based I/O Subsystem. Its major functions are

IEC-60068-2-1

Abstract: IEC60068-2-2 IEC-60068-2-2 IEC-60068-2-56 desktop PC MOTHERBOARD SERVICE MANUAL ExpressCard CompactPCI Express PICMG EXP.0 R1.0 Specification laptop board repair Port MXI-Express Interface laptop motherboard repair
Contextual Info: PCI Express and ExpressCard Remote Control for VXI NI VXI-PCIe-8361T, NI VXI-PCIe-8362T, NI VXI-ExpressCard8360T, NI VXI-8360T NEW! • VXIplug&play compliance • Complete interface to VXI from any PCI Express-based computer or workstation • PXI or laptop control of VXI with an

VME64

Abstract: WIN95 CLK10 PCI-MXI-2 VME64 termination
Contextual Info: VXIbus Interface Kits for PCI VXI-PCI8000 Series Features Overview The VXI-PCI8000 Series interface kits link any PCI-based computer directly to the VXIbus using the high-speed Multisystem eXtension Interface bus MXI . The VXI-PCI8000 kits make your computer