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    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    ICS954141CFLF

    Abstract: ics954310bglf ICS9LPRS552AGLF ICS9LPR316AGLF ics952617 ICS954206AGLF ICS9LP505 ICS9LP505-2 ICS954123BFLF L0607
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: L-0607-01R1 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 6-Oct-06 MEANS OF DISTINGUISHING CHANGED DEVICES:


    Original     		PDF L-0607-01R1 6-Oct-06 ICS9LPRS588CGLF ICS9P750CGLF ICS9P929CFLF ICS9P935AFLF ICS9P936AFLF ICS9P956AFLF ICS954141CFLF ics954310bglf ICS9LPRS552AGLF ICS9LPR316AGLF ics952617 ICS954206AGLF ICS9LP505 ICS9LP505-2 ICS954123BFLF L0607

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    ICS954141CFLF

    Abstract: ICS954123BFLF ICS1883AF Psg16 ICS954148AFLF ICS951417AFLF ICS954128AF ics952603df ics448R ics455r
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: L-0607-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 4-Aug-2006 MEANS OF DISTINGUISHING CHANGED DEVICES:


    Original     		PDF L-0607-01 4-Aug-2006 4-Aug-2006 2510BGI ICSMK3741S ICSMK3754D ICSMK3754S ICSMK3771-17R ICSMK3771-17RLF ICSMK5811G ICS954141CFLF ICS954123BFLF ICS1883AF Psg16 ICS954148AFLF ICS951417AFLF ICS954128AF ics952603df ics448R ics455r

    IDT71256SA20TP

    Abstract: TB-0504-01 IDT2305-1DCG IDTQS3VH125S1G IDT71256SA15TPI IDT74FCT164245TPVG IDT74FCT163245CPA idt71256sa15tp IDT71256SA15YG IDT71256SA25TPI
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: PCN #: TB-0504-01 Product Affected: Please see attachment 5/2/2005 Date Effective: 5/2/2005 Contact: Geoffrey Cortes Title: Manager, Corporate Quality & Reliability


    Original     		PDF TB-0504-01 IDTQS3251QG IDTQS32XVH245Q2G IDTQS3VH125S1G IDTQS3VH253QG IDTQS3253QG IDTQS3383QG IDTQS3VH126QG IDTQS3VH257QG IDT71256SA20TP TB-0504-01 IDT2305-1DCG IDTQS3VH125S1G IDT71256SA15TPI IDT74FCT164245TPVG IDT74FCT163245CPA idt71256sa15tp IDT71256SA15YG IDT71256SA25TPI

    IDTQS3245QG

    Abstract: IDT71V416S12PHGI IDTQS3861QG IDT71256SA15YGI IDTQS3383QG IDT82V3012PVG idt74fct388915tcpyg IDTCV122CPVG IDTQS3VH245QG IDT5V927PGGI
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0508-02 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: Please see attachment 12/5/2005 Geoffrey Cortes


    Original     		PDF IDTCV140PAG IDTQS3VH16212PAG IDTCV141PAG IDTQS3VH16233PAG IDTCV142PAG IDTQS3VH16244PAG IDTCV143PYG IDTQS3VH16861PAG IDTCV144PAG IDTQS3VH244QG IDTQS3245QG IDT71V416S12PHGI IDTQS3861QG IDT71256SA15YGI IDTQS3383QG IDT82V3012PVG idt74fct388915tcpyg IDTCV122CPVG IDTQS3VH245QG IDT5V927PGGI

    Untitled

    Abstract: No abstract text available
    Text: IDT - Integrated Device Technology - Zero Delay Buffers PLL > 870919I > 870919BRI. Page 1 of 2 Integrated Device Technology Products | Applications Clock / Timing Devices | Search Clock Distribution | Support The Analog and Digital Company | Zero Delay Buffers (PLL)


    Original     		PDF 870919I 870919BRI. 870919BRILF ICS870919I TB1010-01 TB0910-01

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95