PCB DIMENSION STANDARD OF SMA Search Results

C3600 brass

Contextual Info: JBX Series Key features JBX Series • Mechanically keyed : ensures correct polarisation and alignment. • Contact layouts from 2 to 30 contacts. • Wire gauges range from 30 AWG to 12 AWG. • High contact density in a small space. • Contact termination in either crimp, solder or PCB

TT6P3-0860T

Abstract: SMT GPS band stop filter 1030 mhz filter D9000
Contextual Info: DATA SHEET Introduction and Applications for Ceramic Band Pass Filters Features High Q ceramic Rugged ● Temperature compensated ● Custom designs ● Available lead Pb -free, RoHS-compliant, and Green ● ● Benefits Low insertion loss Small compact design

SMD MARKING code 3G

Abstract: SMD MARKING CODE 501 LDH33A252B CG01-J LDH25A302L LDH33 A2 SMD CODE MARKING smd diode code B2 smd mark code Transistors smd mark code
Contextual Info: MULTILAYER DEVICES DELAY LINES, CHIP MULTILAYER WIRELESS BASE STATION LDH Series This delay line has been developed by utilizing advanced multilayer technology. It is comprised of a copper line and temperature compensated dielectric NPO 0 ± 60ppm/°C and includes a metal shield. This results in a very small

TT6P3-1080P2-0650

Abstract: TT4P3-1030P2-1535 TT6P4-0770P0-1240 TT6P3-1090P2-1029 TT6P5-0810P3-5030 tt4p3-1 TT6P2-0915T-2518
Contextual Info: DATA SHEET Introduction and Applications for Ceramic Band Pass Filters Features High Q ceramic Rugged ● Temperature compensated ● Custom designs ● ● Benefits Low insertion loss Small compact design ● Frequency stability ● Mechanical stability ●

TT6P3-1080P2-0650

Abstract: SMT GPS band stop filter diplexers tt6p3-07 TT4P3-1030P2-1535 TT4P5-2240P2-1032
Contextual Info: DATA SHEET Introduction and Applications for Ceramic Band Pass Filters Features High Q ceramic Rugged ● Temperature compensated ● Custom designs ● ● Benefits Low insertion loss Small compact design ● Frequency stability ● Mechanical stability ●

T2140

Abstract: SMT GPS band stop filter R3575 TT6P10-R1950-T2140 TT6P4-0770P0-1240 coaxial resonator, skyworks TT6P5-0765P0-11225 TT4P4-R1227.6-T1575.42 TT8N4-0840P0-0440 1575.42 resonator trans-tech
Contextual Info: DATA SHEET Introduction and Applications for Ceramic Band Pass Filters Features High Q ceramic Rugged ● Temperature compensated ● Custom designs ● ● Benefits Low insertion loss Small compact design ● Frequency stability ● Mechanical stability ●

astm c38500

Abstract: CuZn40Pb3 series 97 crimp tool
Contextual Info: JKX Series Key features • Sealed IP 68 mated connectors • Mechanically keyed : ensures correct polarization and alignment. • Contact arrangements : from 2 to 10 contacts. • Wire gauge range from 28 AWG to 14 AWG. • High contact density in a small space.

microtherm t11

Abstract: microtherm t10 microtherm t21 Microtherm microtherm T12A UL STYLE 3398 u315 microtherm T21A U112 UL2111
Contextual Info: Thermal motor protector Temperature limiter Thermal cut-out T 10 11 12 21 Applications - Motors - Transformers - Coils - Electronics, sensors Benefits - Temperature and current sensitive or only temperature sensitive - Small dimensions - High power rating

diode d2s

Contextual Info: Surface Mount Detection Switch D3SH The smallest detection switch in the world. OMRON’s data as of June 2006. • Ultra small size and ultra low profile contributing to down-sizing of sets devices. (3.0 x 3.4 × 0.9 mm (W × D × H) ■ A unique mechanism enables high contact reliability and high precision operation.

bandit TIE-DEX

Abstract: NEM-QTSB-67PGNS-B
Contextual Info: Cannon Cover headline Cover headline Nemesis Series 2 Nemesis Series By choosing the Nemesis range you will be reassured you are working with a partner who has more than 90 years of experience of connector design and manufacturing excellence. The Nemesis range is the most comprehensive small plan

Contextual Info: Surface Mount Detection Switch D3SH The smallest detection switch in the world. OMRON’s data as of June 2006. • Ultra small size and ultra low profile contributing to down-sizing of sets devices. (3.0 x 3.4 x 0.9 mm (W x D x H) • A unique mechanism enables high contact reliability and

Contextual Info: JKX Series Key features • Sealed IP 68 mated connectors • Mechanically keyed : ensures correct polarization and alignment. • Contact arrangements : from 2 to 10 contacts. • Wire gauge range from 28 AWG to 14 AWG. • High contact density in a small space.

Contextual Info: Surface Mount Detection Switch D3SH The smallest detection switch in the world. OMRON’s data as of June 2006. • Ultra small size and ultra low profile contributing to down-sizing of sets devices. (3.0 x 3.4 x 0.9 mm (W x D x H) • A unique mechanism enables high contact reliability and

EPF10K50E

Abstract: BGA and QFP Package mounting
Contextual Info: Designing with FineLine BGA Packages August 2001, ver. 1.1 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the

diode d2s

Abstract: 09005
Contextual Info: Surface Mount Detection Switch D3SH The smallest detection switch in the world. OMRON’s data as of June 2006. • Ultra small size and ultra low profile contributing to down-sizing of sets devices. (3.0 x 3.4 × 0.9 mm (W × D × H) ■ A unique mechanism enables high contact reliability and high precision operation.

G8FE-1Af

Abstract: G8FE-1AP g8fe-1ap-l G8FE under frequency relay relay 15A 125 v
Contextual Info: G8FE Automotive PCB relay Power Small but double terminal design achieved 15A current-carrying.(High heat resistance) (Surface mount type is available) • Small size and high heat resistance enable its use in engine room. • Can be used for module design (SJB) as a replacement for existing plug-in relay.

micro fineline BGA

Abstract: Epoxy, glass laminate EPC16U88
Contextual Info: Designing With Fineline BGA Packages for APEX, FLEX, ACEX, MAX 7000 & MAX 3000 Devices Application Note 114 October 2005, ver. 3.0 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues

EPF10K50E

Contextual Info: Designing with FineLine BGA Packages November 1999, ver. 1.03 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the

component data

Abstract: avago shipping label Moisture Sensitivity JEDEC SMT reflow profile avago Moisture Sensitivity avago, SMT LED
Contextual Info: ASMT-Bx20 PCB Based Subminiature Lamps PCB PolyLED Application Note 5333 Introduction The main benefits of these PCB PolyLEDs are: This series of top mount PCB PolyLED is designed with smaller footprint to achieve high density of components on board. They have the industry standard footprint of

EGSTON

Contextual Info: EGSTON Standard N1hFSW 12W General description The N1hFSW 12W family of switch mode power supplies delivers typically 12W output and features wide-range input 90-264V , small size and light weight. The units are available in cable–cable, terminal version and printed circuit

74441-0010

Abstract: 74441-0001
Contextual Info: LANGUAGE ENGLISH APPLICATION SPECIFICATION REV SHT A A 1-6 REVISE ON PC ONLY UPDATED ECN# UCP2004-2172 KAS 2004/04/30 REV DESCRIPTION DESIGN CONTROL STATUS LISLE M DOCUMENT NO. TITLE Application Specification for Small Form-factor Pluggable SFP Connector and Cage Assembly

KMDR040

Abstract: tzc3
Contextual Info: T13E5.pdf 01.5.29 This is the PDF file of catalog No.T13E-5 Ceramic Trimmer Capacitors 1. Small size with external dimension of 3.2 W x 4.5(L)x1.6(H)mm (Cross slot type : 1.7(H)mm) 2. Color coded stator permits easy identification of capacitance and reduces mounting errors.

G8FE-1AP

Abstract: G8FE-1AP-L G8FE G8FE relay g8fe-1af omron g8fe Double contact automotive relay MARK S2 G8FE 1AP
Contextual Info: G8FE Small PCB relay for automobile use high-wattage Available surface-mount Double terminal improves solder reliability • Capable of usage in an engine compartment due to small size, high wattage, and high heat resistance. • Good for module design as a replacement for a

EPC16U88

Contextual Info: Designing With High-Density BGA Packages for Altera Devices Application Note 114 December 2007, ver. 5.1 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues