transmission lines Twisted Pair spice model
Abstract: APP4168 AN4168
Text: Maxim > App Notes > AUTOMATIC TEST EQUIPMENT ATE HIGH-SPEED INTERCONNECT Keywords: transmission line, line impedance, high-speed signal, lossless, lossy, transmission path, source impedance, load, printed circuit board, PCB, micro-strip, coaxial, twisted pair, TDR, Time Domain Reflectometry
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com/an4168
AN4168,
APP4168,
Appnote4168,
transmission lines Twisted Pair spice model
APP4168
AN4168
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Pb95Sn5
Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377
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DS2411:
DS2415:
DS2417:
DS2432:
DS2433:
DS2502:
DS2760:
DS2761:
DS2762:
DS9503:
Pb95Sn5
pcb warpage in ipc standard
ROSIN FLUX TYPE ROL0
EIA-746
IPC-6012A
MAXIM Assembly Locations OF CODE
underfill dispense needle
FR4 substrate height and thickness
DS2761X
J-STD-004 sn63pb37
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JEP140
Abstract: JESD51-9 pcb board 0.035mm JESD51-10 JEP-140 PCB 1.2mm FR4 1oz cu JESD51-11 JESD51-X jesd51 6 JESD51-7
Text: Thermal Characterization of Packaged Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device
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TB379
JEP140
JESD51-9
pcb board 0.035mm
JESD51-10
JEP-140
PCB 1.2mm FR4 1oz cu
JESD51-11
JESD51-X
jesd51 6
JESD51-7
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JESD51-9
Abstract: JEP140 JEP-140 JESD51-10 JEDEC JESD51-8 conductivity meter circuit Reliability Test Methods for Packaged Devices thermal resistance standards JESD51-1 JESD51-3
Text: Thermal Characterization of Packaged Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device
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PDF
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TB379
JESD51-9
JEP140
JEP-140
JESD51-10
JEDEC JESD51-8
conductivity meter circuit
Reliability Test Methods for Packaged Devices
thermal resistance standards
JESD51-1
JESD51-3
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2A331JB12_ 0805, C0G, 330pF, 100Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM2195C2A331JB12_
330pF,
100Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2H820FB01_ 1111, C0G, 82pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM22M5C2H820FB01_
500Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E9R0BB12_ 0603, C0G, 9pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM1875C2E9R0BB12_
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2ER30CB12_ 0603, C0G, 0.3pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM1875C2ER30CB12_
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E8R2BB12_ 0603, C0G, 8.2pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM1875C2E8R2BB12_
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E120FB12_ 0603, C0G, 12pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM1875C2E120FB12_
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E330FB12_ 0603, C0G, 33pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM1875C2E330FB12_
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E6R8BB12_ 0603, C0G, 6.8pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM1875C2E6R8BB12_
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2A201JB12_ 0805, C0G, 200pF, 100Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM2195C2A201JB12_
200pF,
100Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E820GB12_ 0603, C0G, 82pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM1875C2E820GB12_
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E560GB12_ 0603, C0G, 56pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM1875C2E560GB12_
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E121JB12_ 0805, C0G, 120pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM2195C2E121JB12_
120pF,
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2H680FB01_ 1111, C0G, 68pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM22M5C2H680FB01_
500Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2H180FB01_ 1111, C0G, 18pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM22M5C2H180FB01_
500Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E151JB12_ 0805, C0G, 150pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM2195C2E151JB12_
150pF,
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2HR75BB01_ 1111, C0G, 0.75pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM22M5C2HR75BB01_
500Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E7R0BB12_ 0603, C0G, 7pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM1875C2E7R0BB12_
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E2R0WB12_ 0805, C0G, 2pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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Original
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GQM2195C2E2R0WB12_
250Vdc)
JEMCNC-0012L
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Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E151GB12_ 0805, C0G, 150pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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Original
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PDF
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GQM2195C2E151GB12_
150pF,
250Vdc)
JEMCNC-0012L
|
Untitled
Abstract: No abstract text available
Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E1R2WB12_ 0603, C0G, 1.2pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
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GQM1875C2E1R2WB12_
250Vdc)
JEMCNC-0012L
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