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    PC-TSOP/DIP8-01 Search Results

    PC-TSOP/DIP8-01 Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    TLP352 Toshiba Electronic Devices & Storage Corporation Photocoupler (photo-IC output), IOP=+/-2.5 A, 3750 Vrms, DIP8 Visit Toshiba Electronic Devices & Storage Corporation
    TLP7920 Toshiba Electronic Devices & Storage Corporation Photocoupler (Isolation Amplifier), Analog output, 5000 Vrms, DIP8 Visit Toshiba Electronic Devices & Storage Corporation

    PC-TSOP/DIP8-01 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    PC-TSOP/DIP8-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO8F; Bottom Package Code: 0.6; Top Pitch (mm): 0.65; Bottom Pitch (mm): 2.54; Top Pin Count: 8; Bottom Pin Count: 8; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.125 - 0.325; Adapter Size Length X Width (in.): 0.7 x 0.4; Part Description: SOIC to DIP Converter; Original PDF