Untitled
Abstract: No abstract text available
Text: GS88237CB-xxx 119-Bump BGA Commercial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237CB-xxx
119-Bump
x18/x36
88237C
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Untitled
Abstract: No abstract text available
Text: GS88237CB-xxx 119-Bump BGA Commercial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237CB-xxx
119-Bump
x18/x36
88237C
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Untitled
Abstract: No abstract text available
Text: GS88237CB-xxxIV 119-Bump BGA Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply
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GS88237CB-xxxIV
119-Bump
882V37C
119-BGA
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Untitled
Abstract: No abstract text available
Text: GS88218/36CB/D-xxxI 119- and 165-Bump BGA Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable
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GS88218/36CB/D-xxxI
165-Bump
x18/x36
88218C
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Untitled
Abstract: No abstract text available
Text: GS88237CB-xxxIV 119-Bump BGA Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply
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GS88237CB-xxxIV
119-Bump
882V37C
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Untitled
Abstract: No abstract text available
Text: GS88237CB-xxxV 119-Bump BGA Commercial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply
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GS88237CB-xxxV
119-Bump
882V37C
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Untitled
Abstract: No abstract text available
Text: GS88237CB-xxxV 119-Bump BGA Commercial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply
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GS88237CB-xxxV
119-Bump
882V37C
119-BGA
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Untitled
Abstract: No abstract text available
Text: GS88218/36C B/D -xxxIV 119- and 165-Bump BGA Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
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GS88218/36C
165-Bump
x18/x36
882VxxC
882xxC
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Untitled
Abstract: No abstract text available
Text: GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
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GS88218/36C
165-Bump
x18/x36
882VxxC
882xxC
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Untitled
Abstract: No abstract text available
Text: GS816218/36D B/D -xxxV 1M x 18, 512K x 36 18Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
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GS816218/36D
x18/x36
165-bump
8162xxD
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Untitled
Abstract: No abstract text available
Text: GS832218/36A B/D -xxxV 2M x 18, 1M x 36 36Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
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GS832218/36A
x18/x36
8322xxA
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Untitled
Abstract: No abstract text available
Text: GS816218/36D B/D -xxxV 1M x 18, 512K x 36 18Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
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GS816218/36D
x18/x36
165-bump
8162xxD
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Untitled
Abstract: No abstract text available
Text: GS832218/36A B/D -xxxV 2M x 18, 1M x 36 36Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
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GS832218/36A
x18/x36
8322xxA
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Untitled
Abstract: No abstract text available
Text: GS816218/36D B/D -xxxV 1M x 18, 512K x 36 18Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
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GS816218/36D
x18/x36
8162xxD
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Untitled
Abstract: No abstract text available
Text: GS8321E18/32/36AD-xxxV 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation
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GS8321E18/32/36AD-xxxV
165-Bump
165ete
8321ExxA
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Untitled
Abstract: No abstract text available
Text: GS832118/32/36AD-xxxV 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply
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GS832118/32/36AD-xxxV
165-Bump
8321xxA
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Untitled
Abstract: No abstract text available
Text: GS881E18/32/36C T/D -xxx 100-Pin TQFP & 165-bump BGA Commercial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation
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GS881E18/32/36C
100-Pin
165-bump
supply881E18C
100-lead
881E18C
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GS816136DD-200IV
Abstract: No abstract text available
Text: GS8161xxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply
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GS8161xxD
100-Pin
165-Bump
8161xxD
GS816136DD-200IV
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Untitled
Abstract: No abstract text available
Text: GS8161ExxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation
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GS8161ExxD
100-Pin
165-Bump
8161ExxD
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Untitled
Abstract: No abstract text available
Text: GS8161ExxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation
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GS8161ExxD
100-Pin
165-Bump
8161ExxD
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Untitled
Abstract: No abstract text available
Text: GS8321E18/32/36AD-xxxV 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation
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GS8321E18/32/36AD-xxxV
165-Bump
8321ExxA
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Untitled
Abstract: No abstract text available
Text: GS8161ExxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation
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GS8161ExxD
100-Pin
165-Bump
8161ExxD
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Untitled
Abstract: No abstract text available
Text: GS8161xxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply
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GS8161xxD
100-Pin
165-Bump
addresse35
8161xxD
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Untitled
Abstract: No abstract text available
Text: GS832118/32/36AD-xxxV 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply
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GS832118/32/36AD-xxxV
165-Bump
8321xxA
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