Soldering Process
Abstract: DO213-AB
Text: Pad Layouts/Soldering Process www.vishay.com Vishay General Semiconductor Pad Layouts/Soldering Process VISHAY GENERAL SEMICONDUCTOR RECOMMENDED MINIMUM MOUNTING PAD LAYOUT SIZES FOR THE SURFACE MOUNT RECTIFIER DFS BRIDGE MBS BRIDGE 0.047 1.20 MIN. MBLS BRIDGE
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DO-214AC
DO-214BA
O-263
DO-214AA
DO-214AB
J-STD-020D.
12-Sep-13
Soldering Process
DO213-AB
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"General Semiconductor" DO-214AC
Abstract: MicroSMP Pad Layout TL 413 DO-213AA DO-220AA GL34
Text: Pad Layouts/Soldering Process Vishay General Semiconductor Pad Layouts/Soldering Process VISHAY GENERAL SEMICONDUCTOR RECOMMENDED MINIMUM MOUNTING PAD LAYOUT SIZES FOR THE SURFACE MOUNT RECTIFIER MBS BRIDGE DFS BRIDGE 0.023 MIN. 0.58 MIN. 0.047 MIN. (1.20 MIN.)
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DO-218
O-263
24-Apr-07
"General Semiconductor" DO-214AC
MicroSMP Pad Layout
TL 413
DO-213AA
DO-220AA
GL34
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MM912G634DV1AE
Abstract: 51413 15x10-6 125c59 Operational transconductance amplifier 54-031 S12CPMU
Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 10.0, 1/2013 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are
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634D1
MM912G634
MM912H634
HCS12
16-Bit
MM912G634DV1AE
51413
15x10-6
125c59
Operational transconductance amplifier
54-031
S12CPMU
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PDF
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CTR31 PCB Controller
Abstract: MM912G634 fet ifr 634 MM912G634CV1AE TSG 3255 TC0800 54113 uns tread MM912 D flip flop
Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 5.0, 9/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are
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634D1
48-PIN
MM912G634
MM912H634
HCS12
16-Bit
CTR31 PCB Controller
MM912G634
fet ifr 634
MM912G634CV1AE
TSG 3255
TC0800
54113
uns tread
MM912
D flip flop
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PDF
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bc 494 b f.m transmitter
Abstract: SCR SS 3328 CTR31 PCB Controller 51-6332 Tl 5153 dp1203 N203 57210 54123 application as pulse generator TSG 3255
Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 7.0, 3/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are
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634D1
MM912G634
MM912H634
HCS12
16-Bit
bc 494 b f.m transmitter
SCR SS 3328
CTR31 PCB Controller
51-6332
Tl 5153
dp1203
N203
57210
54123 application as pulse generator
TSG 3255
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PDF
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 9.0, 12/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are
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634D1
48-PIN
MM912G634
MM912H634
HCS12
16-Bit
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PDF
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dual coil latching relay
Abstract: hall sensor 41 hall 44132 rain light sensor ctr31 D2D DIODE B2k marking 3 PIN hall effect sensor n 177 4205 mosfet TSG 3255
Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 4.0, 5/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are
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Original
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634D1
MM912G634
MM912H634
HCS12
16-Bit
dual coil latching relay
hall sensor 41
hall 44132
rain light sensor
ctr31
D2D DIODE
B2k marking
3 PIN hall effect sensor n 177
4205 mosfet
TSG 3255
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PDF
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dual coil latching relay
Abstract: MOSFET K 4202 mosfet 4914 LIN conformance fet ifr 634 TSG 3255
Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 3.0, 5/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are
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Original
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634D1
MM912G634
MM912H634
HCS12
16-Bit
dual coil latching relay
MOSFET K 4202
mosfet 4914
LIN conformance
fet ifr 634
TSG 3255
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PDF
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 7.0, 3/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are
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Original
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634D1
48-PIN
MM912G634
MM912H634
HCS12
16-Bit
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PDF
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 8.0, 11/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are
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Original
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634D1
48-PIN
MM912G634
MM912H634
HCS12
16-Bit
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PDF
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Untitled
Abstract: No abstract text available
Text: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7
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THS6032
SLOS233E
400-mA
65-MHz
100-MHz
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Untitled
Abstract: No abstract text available
Text: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7
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THS6032
SLOS233E
400-mA
65-MHz
100-MHz
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PDF
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pal 003
Abstract: No abstract text available
Text: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7
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Original
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THS6032
SLOS233E
400-mA
65-MHz
100-MHz
pal 003
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PDF
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Untitled
Abstract: No abstract text available
Text: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7
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Original
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THS6032
SLOS233E
400-mA
65-MHz
100-MHz
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PDF
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|
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Untitled
Abstract: No abstract text available
Text: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7
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Original
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THS6032
SLOS233E
400-mA
65-MHz
100-MHz
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PDF
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epcos 16v 157
Abstract: B45196 EPCOS B45196 EPCOS B45196-E 107 16V epcos B45190E1336M209 B45196-H B45197-A B45198-H B45198-R
Text: Specification Tantalum Chip Capacitor; MnO2 B45190E1336M209 Content 1. Electrical parameter 2. Shipping, storage and production environment 3. Ordering code structure 4. Specification in brief 5. Dimensional drawing 6. Marking 7. Recommended solder pad layouts
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B45190E1336M209
epcos 16v 157
B45196
EPCOS B45196
EPCOS B45196-E
107 16V epcos
B45190E1336M209
B45196-H
B45197-A
B45198-H
B45198-R
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PDF
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AA112A
Abstract: IPC-7351A
Text: PACKAGE OUTLINE DIMENSIONS AP02002 SUGGESTED PAD LAYOUT(AP02001) (Based on IPC-7351A) Table of Contents X4-DFN0402‐2/SWP . 10
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AP02002)
AP02001)
IPC-7351A)
DFN0402â
DFN0603â
DFN0606â
IPC-7351A,
AA112A
IPC-7351A
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PDF
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Untitled
Abstract: No abstract text available
Text: SM Crystal GSX-7A Specifications Product Parameters GSX 7A Frequency range: 12.0 ~ 40.0MHz fund 40.0 ~ 67.0MHz (3rd OT) Frequency stability: ±100ppm inclusive of calibration tolerance 6.20 (max) 3.70 (max) 1.40 (max) 2.54 ACTUAL SIZE SOLDER PAD LAYOUTS
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100ppm
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16.0MHZ
Abstract: 22.1184 22.118400
Text: SM Crystal GSX-7A Specifications Product Parameters GSX-7A Frequency range: 12.0 ~ 40.0MHz fund 40.0 ~ 67.0MHz (3rd OT) Frequency stability: ±100ppm inclusive of calibration tolerance 6.20 (max) 3.70 (max) 1.40 (max) 2.54 ACTUAL SIZE SOLDER PAD LAYOUTS
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100ppm
16.0MHZ
22.1184
22.118400
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PDF
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Untitled
Abstract: No abstract text available
Text: SM Crystal GSX-7A Specifications Product Parameters GSX-7A Frequency range: 12.0 ~ 40.0MHz fund 40.0 ~ 67.0MHz (3rd OT) Frequency stability: ±100ppm inclusive of calibration tolerance 6.20 (max) 3.70 (max) 1.40 (max) 2.54 ACTUAL SIZE SOLDER PAD LAYOUTS
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100ppm
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PDF
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16.0MHz GSX
Abstract: 7,3728 7.3728 GSX-852
Text: SM Crystal - Ceramic Lid GSX-852 Specifications Product Parameters GSX-852 Frequency range: 7.3728 ~ 60.0MHz 4.65 max ACTUAL SIZE 1.60 (max) SOLDER PAD LAYOUTS 3.00 2.00 1.50 2.50 1.50 4.00 ˿ ˿ 3 5 specify Temperature stability: ±30ppm ±50ppm ±100ppm
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GSX-852
30ppm
50ppm
100ppm
20ppm
100ppm)
GSX-852/551EF
16.0MHz GSX
7,3728
7.3728
GSX-852
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PDF
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7.3728
Abstract: GSX-852 400D 16.0MHz
Text: SM Crystal - Ceramic Lid GSX-852 Specifications Product Parameters GSX-852 Frequency range: 7.3728 ~ 60.0MHz 4.65 max ACTUAL SIZE 1.60 (max) SOLDER PAD LAYOUTS 3.00 2.00 1.50 2.50 1.50 4.00 ˿ ˿ 3 5 specify Temperature stability: ±30ppm ±50ppm ±100ppm
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GSX-852
30ppm
50ppm
100ppm
20ppm
100ppm)
GSX-852/551EF
7.3728
GSX-852
400D
16.0MHz
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PDF
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Untitled
Abstract: No abstract text available
Text: CERAM IC MICROWAVE FILTERS SAW FILTERS & RESONATORS DIMENSIONS & SUGGESTED PAD LAYOUTS SC33PACKAGE Terminals : Input : Output O th e rs: Ground mnffata /kM&nter t* SC33 LOW PROFILE Terminals $ Land Pattern 4 -1 .5 ± 0.15 1 .5 ± 0 .1 5 Sugge ste d Pad Layout
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OCR Scan
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SC33PACKAGE
SL45B
CG01-H
SU511
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PDF
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524 suppressor
Abstract: No abstract text available
Text: CONTENTS POWER SEMICONDUCTOR DIVISION PRODUCT CATALOG 12 Edition GENERAL INFORMATION PACKAGING, ASSEMBLY RECOMMENDATIONS, Introduction .1 AND PAD LAYOUTS . 495
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OCR Scan
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12TMEdition
524 suppressor
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PDF
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