PAD FOR CAPACITOR Search Results

1206 pads layout

Contextual Info: TECHNICAL INFORMATION SOLDER PAD GEOMETRY STUDIES FOR SURFACE MOUNT OF CHIP CAPACITORS* Kent Wicker & John Maxwell AVX Corporation Corporate Research Laboratory P.O. Box 867 Myrtle Beach, SC 29577 Abstract: Solder pad geometry for surface mounting chip capacitors were

1206 pads layout

Abstract: 1812 pads layout IPC-SM-782
Contextual Info: TECHNICAL INFORMATION SOLDER PAD GEOMETRY STUDIES FOR SURFACE MOUNT OF CHIP CAPACITORS* Kent Wicker & John Maxwell AVX Corporation Corporate Research Laboratory P.O. Box 867 Myrtle Beach, SC 29577 Abstract: Solder pad geometry for surface mounting chip capacitors were

SPRAGUE 047

Abstract: 572D 591D 592D 594D 595D 597D 695D 194D 195D
Contextual Info: VISHAY SPRAGUE Capacitors Application Note Pad Guidelines for Conformal Coated Tantalum Capacitors PAD DIMENSIONS in inches [millimeters] B C B A CASE CODE WIDTH A PAD METALLIZATION (B) SEPARATION (C) A B C D R S X Y 0.075 [1.9] 0.118 [3.0] 0.136 [3.5] 0.180 [4.6]

CWR11

Abstract: t95 f T95B
Contextual Info: VISHAY SPRAGUE Capacitors Application Note Pad Guidelines for High-Rel COTS Solid Tantalum Capacitors PAD DIMENSIONS in inches [millimeters] B C B A CASE CODE WIDTH A PAD METALLIZATION (B) SEPARATION (C) T95 B C D R S V X, Y, Z 0.120 [3.0] 0.136 [3.5] 0.180 [4.6]

EIA-RS-198

Contextual Info: Surface Mounting Guide MLC Chip Capacitors Component Pad Design Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave

Contextual Info: Recommended Mounting Pad Dimensions for U Series Capacitors These diagrams show the recommended pad layout dimensions for the AVX U series range of RF/Microwave capacitors. D2 D1 D3 D4 D5 Dimensions in millimeters inches Case Size 0402 0603 0805 1210 D1

Contextual Info: Application Information on Solder Pad Design for Surface Mount Chip Capacitor ◄- T - ► TOTAL LENGTH I £9 I_ _ _ L (LENGTH) (SEPARATION) (LENGTH) Recommended Pad Dimensions Dimensions (inches) Chip Size T ffl'ifi Wy! i

Contextual Info: Application Information on Solder Pad Design for Surface Mount Chip Capacitor •4 - T -► TOTAL LENGTH I I L (LENGTH) (SEPARATION) (LENGTH) Recommended Pad Dimensions Dimensions (inches) L W s 0402* 0.021 0.022 0.017 0.059

Contextual Info: Application Information on Solder Pad Design for Surface Mount Chip Capacitor A^XvA TOTAL LENGTH L s L (LENGTH) (SEPARATION) (LENGTH) Recommended Pad Dimensions Dimensions (inches) Chip Size L W s T 0402* 0.021 0.022 0.017 0.059 0504* 0.035 0.050 0.020 0.090

so8 pcb pattern

Abstract: 1206-8 chipfet layout vishay so-8 pin dimensions
Contextual Info: AND8237/D Low VCE sat BJT in 1206A ChipFETt Package Recommended Pad Pattern and Thermal Performance http://onsemi.com APPLICATION NOTE INTRODUCTION Basic Pad Patterns The basic pad layout with dimensions is shown in Figure 2. This is sufficient for low VCE(sat) BJT applications,

293D

Abstract: CTC3 793DX 593D 893D 0346 793DE
Contextual Info: VISHAY SPRAGUE Capacitors Application Note Molded Pad Guidelines for Tantalum Capacitors PAD DIMENSIONS in inches [millimeters] B D C A CASE CODE A MIN. B (NOM.) C (NOM.) D (NOM.) 293D - 593D - 893D - TR3 - TH3 - TF3 - TP3 - 793DE/793DX/CTC3/CTC4 A 0.071 [1.80]

AVX film chip capacitors

Abstract: capacitor .23 pf NOJA106M010RWJ NOSC107M006R0150 w2f 46 w2f 83 NOJA106M006RWJ nojb336m006rwj NOJB226M010RWJ
Contextual Info: 1766-2012.qxp:QuarkCatalogTempNew 9/17/12 5:50 PM Page 1766 Ceramic and Niobium Oxide Chip Capacitors W2F/W3F Series Ceramic Feedthru Capacitors ENCLOSURES W H Common Ground Feedthru Feedthru Pad C Pad L A L T BL W W1 Cost versus Performance is a key requirement for consumer electronic products. A new solid electrolyte capacitor OxiCap

HC9S08JMxx

Abstract: maxTouch MC9S08JM60 SMD-49 daishinku pc game pad usb diagram MC9S08JM60CLDE auto pf power wizard 1.0 module for generator MC9S08JM60 c code example sot23-5 SMD CODE E5 cdc SMD
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3761 Rev. 0, 11/2008 Using Freescale Devices for Contactless Touch Applications Touch Pad Demonstrator Board by: Luděk Šlosarčík Rožnov Czech System Center Czech Republic The touch pad demonstrator board is a development

LDR 10mm

Abstract: pwmcm
Contextual Info: TAS5122 www.ti.com SLES088A − AUGUST 2003 − REVISED SEPTEMBER 2003 30ĆW STEREO DIGITAL AMPLIFIER POWER STAGE FEATURES D 2 x 30 W BTL Into 6 Ω at 1 kHz (DFD Pad-Up Package) − DCA Package (Pad-Down) Recommended for Lower-Power Applications APPLICATIONS

4-Pin, Microtech connector

Abstract: endevco accelerometer triaxial accelerometer sensor accelerometer endevco 2560 4-Pin Microtech connector 4-Pin, Microtech connector, endevco 3027AM4 CALIBRATOR ENDEVCO 28959 F current output accelerometer accelerometer endevco
Contextual Info: ISOTRON Seat Pad Accelerometer ENDEVCO MODEL 2560 Model 2560 • Triaxial Seat-Pad Accelerometer • Low-Impedance Output • High Output 100 mV/g , High Resolution (Milli-g) • Ideal for Whole Body Motion per ISO 2631 and ISO 7096 • Removable Triaxial

AES17

Abstract: DFB1310A SMAJ28A TAS5010 TAS5026 TAS5122 TAS5122DCA TAS5122DFD eg g wakefield engineering 16 pin Audio processor ic for 5.1 home theatre
Contextual Info: TAS5122 www.ti.com SLES088C − AUGUST 2003 − REVISED NOVEMBER 2003 30ĆW STEREO DIGITAL AMPLIFIER POWER STAGE FEATURES D 2 x 30 W BTL Into 6 Ω at 1 kHz (DFD Pad-Up Package) − DCA Package (Pad-Down) Recommended for Lower-Power Applications APPLICATIONS

bidirectional clipper

Abstract: DIGITAL DSP HEARING AIDS telecoil 400pf sa3400 Automatic Gain Control AGC Hearing Aids circuit diagram of digital hearing aid hearing instrument WDRC DSP
Contextual Info: AYRE SA3291 Pre-configured Wireless DSP System for Hearing Aids Description Semiconductor Components Industries, LLC, 2012 September, 2012 − Rev. 1 1 http://onsemi.com 32 PAD HYBRID CASE TBD PAD CONNECTION 20 1 VIN1 N/C GND VIN2 2 TIN N/C MGND 3 VREG

SLAA117

Contextual Info: TAS5122 www.ti.com SLES088 − AUGUST 2003 30ĆW STEREO DIGITAL AMPLIFIER POWER STAGE FEATURES D 2 x 30 W BTL Into 6 Ω at 1 kHz (DFD Pad-Up Package) − DCA Package (Pad-Down) Recommended for Lower-Power Applications APPLICATIONS D DVD Receiver D Home Theatre

bonding

Abstract: VG-50
Contextual Info: Application Note for Dual-Gate FETs Bonding Diagram bonding wires are 1-mil diameter Au wires Drain Bonding Wire "Gate 2" Bonding Wires (2 plcs, 1 wire per pad) Source Bonding Wires (2 plcs, 2 wires per pad) Gate Bonding Wire Single Bias Configuration Dual Bias Configuration

SA3410GEVK

Abstract: wireless hearing aid hear Aid based Circuit Diagram SA3410GEVB circuit diagram of digital hearing aid hearing instrument WDRC DSP
Contextual Info: AYRE SA3291 Pre-configured Wireless DSP System for Hearing Aids Description Semiconductor Components Industries, LLC, 2012 October, 2012 − Rev. 2 1 http://onsemi.com 32 PAD HYBRID CASE TBD PAD CONNECTION 20 1 VIN1 N/C GND VIN2 2 TIN N/C MGND 3 VREG 4

hearing instrument WDRC DSP

Contextual Info: AYRE SA3291 Preconfigured Wireless DSP System for Hearing Aids Description Semiconductor Components Industries, LLC, 2014 April, 2014 − Rev. 4 1 http://onsemi.com 32 PAD HYBRID CASE TBD PAD CONNECTION 20 1 VIN1 N/C GND VIN2 2 TIN N/C MGND 3 VREG 4 VC

circuit diagram of digital hearing aid

Abstract: SA3400GEVB hearing instrument WDRC R3910-CFAB-E1B Hearing Aid Circuit Diagram hearing aid device specification PACK500 Hearing aids dsp musical fidelity e1 dsp hearing aid
Contextual Info: RHYTHM R3910 Pre-configured DSP System for Hearing Aids Description Semiconductor Components Industries, LLC, 2012 October, 2012 − Rev. 1 1 http://onsemi.com 25 PAD HYBRID CASE TBD PAD CONNECTION 17 18 VIN1 1 VREG TIN 16 19 N/C 2 MGND DAI 15 20 N/C 3

Contextual Info: RHYTHM R3910 Preconfigured DSP System for Hearing Aids Description Semiconductor Components Industries, LLC, 2014 April, 2014 − Rev. 6 1 http://onsemi.com 25 PAD HYBRID CASE TBD PAD CONNECTION 17 18 VIN1 1 VREG TIN 16 19 N/C 2 MGND DAI 15 20 N/C 3 GND

Contextual Info: RHYTHM R3910 Pre-configured DSP System for Hearing Aids Description Semiconductor Components Industries, LLC, 2013 October, 2013 − Rev. 5 1 http://onsemi.com 25 PAD HYBRID CASE TBD PAD CONNECTION 17 18 VIN1 1 VREG TIN 16 19 N/C 2 MGND DAI 15 20 N/C 3