PAD DIMENSION Search Results

Contextual Info: C18 Pad 1 Bonding Pad 4 Pls 16 [0.406] 14 [0.356] SQ. 1 [0.025] Bond only on crosshatched area Pad 2 Pad 3 Pad 4 6 [0.152] 4 [0.102] Back Contact Dimensions in mils [mm] Give us a call at 888-641-SEMI 7364 web: http://www.aeroflex.com/metelics, email: metelics-sales@aeroflex.com

USE8530DT23SLF

Abstract: uselectronics
Contextual Info: U.S.Electronics Inc. USE8530DT23SLF Magnetic Transducer DIMENSIONS Dummy Pad 8.70 6.60 3.00 4-1.05 8.50 3.25 2.75 Polarity Pad - 1.20 8.50 Polarity pad (+) 3.50 0.80 Sound Emmision Hole 1.20 PAD LAYOUT 1.70 6.20 1.70 3.10 ELECTRICAL SPECIFICATIONS Model NO

QSMO-4610

Abstract: QSMO-4620
Contextual Info: SURFACE MOUNT CRYSTAL CLOCK OSCILLATOR QSMO - 4600 SERIES Hy-Q International 5.0 4 CARRIER TAPE AND REEL DIMENSIONS 0.95 1.0 2.54 3 13.5 2.0 TYP. 3.2 1.5 MARKING 2.0 2.0 1 2 Ø21 1.0 PAD CONNECTIONS PAD 1: E/D PAD 2: Vss PAD 3: OUT PAD 4: VDD 120.0˚ 1.4 Ø80

Contextual Info: Mounting Pad Geometries Dimensions in mm. DPAK Cuitral Mmleandaccor Corp. b— 420 H Mounting Pad Geometries (Dimensions in mm.) HD DIP PAD GEOM 421 Central Mounting Pad Geometries (Continued) (Dimensions in mm.) SMA * 2 .0 ► \_ I -i-

hy-q

Contextual Info: SURFACE MOUNT CRYSTAL OSCILLATOR QSMO - 4700 Hy-Q International CARRIER TAPE AND REEL DIMENSIONS 3.2 1.2 1.2 3 4 2 1 MARKING 2.5 9.0 2.0 TYP. 2.0 0.7 2.0 Ø21 1.3 0.4 PAD CONNECTIONS PAD 1: E/D PAD 2: Vss 1.3 120.0˚ 1.3 Ø80 Ø180 1.3 PAD 3: OUT PAD 4: VDD

USEDST-16C3S

Abstract: USE-DST-16C3
Contextual Info: U.S.Electronics Inc. USEDST-16C3S Magnetic Transducer DIMENSIONS Dummy Pad 8.80 6.60 1.80 4-1.10 4-0.80 0.53 1.0 6.5 10.0 3.25 3.25 2.5 Polarity Pad - 1.20 8.50 Polarity pad (+) 3.0 0.40 Sound Emmision Hole 0.87 PAD LAYOUT 1.70 4.80 ELECTRICAL SPECIFICATIONS

USEDST-16C3S-ALF

Contextual Info: U.S.Electronics Inc. USEDST-16C3S-ALF Magnetic Transducer DIMENSIONS Dummy Pad 8.80 6.60 0.53 4-0.80 1.80 4-1.10 6.5 10.0 1.0 2.5 Polarity Pad - 1.20 8.50 Polarity pad (+) 0.40 3.0 Sound Emmision Hole 0.87 PAD LAYOUT 1.70 5.80 ELECTRICAL SPECIFICATIONS

J412

Abstract: TELEDYNE RELAYS j412 j422d J412D J411T ER422DD ER412DD ER134 J116C J422
Contextual Info: Appendix A: Spacer Pads Pad designation and bottom view dimensions Height Ø.150 [3.81] REF Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for Centigrid .156 [3.96] (REF) Dim H MAX .256 [6.5] (REF) “M9” Pad for Centigrid®

J412

Abstract: ER432T J412D j422d ER412T ER134D er411d j412dd J114D J134
Contextual Info: Appendix A: Spacer Pads Pad designation and bottom view dimensions Height Ø.150 [3.81] REF Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for Centigrid .156 [3.96] (REF) Dim H MAX .256 [6.5] (REF) “M9” Pad for Centigrid®

FR4 SUBSTRATE SHEET

Abstract: 0343
Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

DS1822X

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

0660H

Contextual Info: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES. SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION 5. SPECIAL NOTE: OFFSET PAD DESIGN DO NOT SHRINK OR GROW LAND PAD

13,56 MHz RFID antenna

Abstract: RFID power supply mini laptop 13.56 MHz RFID tag rfid 13.56 MHz RFID specifications RFID Tracking Pad how to design 13.56 MHz RFID tag mini usb RFID interface
Contextual Info: Mini RFID Tracking Pad 3M Mini RFID Tracking Pad The 3M Mini RFID Tracking Pad is the latest RFID Tracking Pad from 3M. Designed ™ for compatibility, the mini tracking pad will work with systems that already have a 3M tracking pad. With enhanced aesthetics, the new mini tracking pad looks great

ADN2845

Abstract: 18-PAD
Contextual Info: a 18-Pad Bare Die Dimensions shown in micrometers and millimeters 1 ADN2845 PAD PITCH: 200␮m DIE SIZE: 1140␮m ؎20␮m ؋ 1340␮m (؎20␮m) DIE THICKNESS: 0.25mm SINGLE PAD SIZE: 92␮m ؋ 92␮m DOUBLE PAD SIZE: 151␮m ؋ 92␮m 1140␮m (؎20␮m)

16.8Mhz oscillator

Abstract: "Crystal Oscillator" 4mhz CRYSTAL 8MHZ
Contextual Info: Hy-Q International 7.0 1.0 1.7 4 5.0 VOLTAGE CONTROLLED TEMPERATURE COMPENSATED CRYSTAL OSCILLATOR VCTCXO QSMO - 5100 3 3 2 1.2 4 MARKING 1 6.0 2 1 2.54 0.8 1.5 SUGGESTED PAD LAYOUT PAD CONNECTIONS PAD 1: Vcontrol PAD 3: OUTPUT PAD 2: GROUND PAD 4: VCC Ø1.5 TYP.

MRGF

Abstract: LP73 UR73D LA73 LT73 NT73 RF73 RK73 RN73 SG73
Contextual Info: Appendix E pad dimensions standard soldering pad dimensions The optimum soldering pad dimensions may differ depending on soldering conditions, however, the following land dimensions are generally recommended. WK73 RK73 SG73 RN73 RN73H SR73 LT73 NT73 PT72 LA73

4510

Abstract: HY-Q 4510 datasheet 4540 top marking QSMO-4510 QSMO-4520 QSMO-4530 QSMO-4540
Contextual Info: SURFACE MOUNT CLOCK OSCILLATOR QSMO - 4500 Hy-Q International 3.2 MAX 5.08±0.2 14.0 MAX 4 9.8 MAX 1.2±0.1 TYP. 3 3 5.08±0.2 6.2±0.2 MARKING 1 SUGGESTED PAD LAYOUT TOP VIEW 4 2 1 2 3 4 5.08 ±0.2 PAD CONNECTIONS 1 SERIES NUMBER PAD 1 PAD 2 PAD 3 PAD 4

CTC 1351

Abstract: CTC 1351 transistor transistor ctc 1351 CTC 1351 data sheet smooth l725 Oriole Alcoa full tension sleeve STR S 6531 L726 P724
Contextual Info: BURNDY Transmission TABLE OF CONTENTS ACSR Conductor Accessories Deadends Single Pad . . . . . . . . . . . . . . . . . . I-3 Deadends Double Pad . . . . . . . . . . . . . . . . . I-4 Deadends Single Pad EHV . . . . . . . . . . . . . . I-5 Deadends Double Pad EHV . . . . . . . . . . . . . I-6

QSMO-6240

Abstract: QSMO-6210 QSMO-6220 QSMO-6230 QSMO-6250
Contextual Info: SURFACE MOUNT VOLTAGE CONTROLLED CRYSTAL OSCILLATOR VCXO QSMO - 6200 SERIES Hy-Q International 7.5 5 6 5.0 1.8 4 MARKING 1 2 SUGGESTED PAD LAYOUT 1.4 TYP. 1.9 4 3 6 1 5 2 2.6 2.0 TYP. 3 4.2 PAD CONNECTIONS PAD 3: VSS PAD 1: Vcont PAD 2: E/D or NC PAD 4: OUT

QSMO-6110

Abstract: QSMO-6120 QSMO-6130 QSMO-6140 QSMO-6150
Contextual Info: SURFACE MOUNT VOLTAGE CONTROLLED CRYSTAL OSCILLATOR VCXO QSMO - 6100 SERIES Hy-Q International 7.5 5 6 5.0 1.8 4 MARKING 1 2 SUGGESTED PAD LAYOUT 1.4 TYP. 1.9 4 3 6 1 5 2 2.6 2.0 TYP. 3 4.2 PAD CONNECTIONS PAD 3: VSS PAD 1: Vcont PAD 2: E/D or NC PAD 4: OUT

Contextual Info: Mounting Pads and Kits DF1 PAD 0.020" Typ. 0.015" Typ. SF1 PAD 0.015" Typ. 0.020" Typ. 0.015" Typ. 0.078" 0.035" DF2 PAD 0.035" 0.035" 0.026" Typ. 0.026" TFR1 PAD 0.010" SF2 PAD 0.030" 0.026" Typ. 0.026" Typ. 0.026" Typ. 0.010" 0.108" 0.075" 0.050" 0.050"

TLM563D

Contextual Info: Package Details - TLM563D Mechanical Drawing Lead Code: Reference individual device data sheet. Part Marking: 2-3 Character Alpha/Numeric Code *Exposed pad P1 common to pin 6 *Exposed pad P2 common to pin 3 Mounting Pad Geometry Dimensions in mm Central

DS2430AX

Abstract: FR4 substrate 0537
Contextual Info: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR F R 4 SUBSTRATE APPLICATION TABLE 1. PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS

FR4 SUBSTRATE SHEET

Abstract: DS75X 3ao2
Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. NON-SOLDER MASK DEFINED LANDING PAD 4. UNDERFILL OR GLOB TOP RECOMMENDED FOR F R - 4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1: SUBSTRATE CONNECTIONS AND PAD COORDINATES MILLIMETERS INCHES PAD# NAME CENTER X