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    PACKAGING SPECIFICATION Search Results

    PACKAGING SPECIFICATION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGING SPECIFICATION Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: 16 Packaging PAGE PACKAGING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348 Littelfuse packaging specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349-350


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    973057-2

    Abstract: datasheet fr 107 carton box
    Text: 1. GENERAL 1.1 PURPOSE This packaging specification covers the packaging material, packaging method & packaging quantities for E3.2 Bushless Header Assy. 1.2 SCOPE This specification is applicable to the packaging of Bushless Header Assy. part number: 1814733-1


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGING SPECIFICATION 1 Scope This specification covers requirements of packaging material, packaging method for Single Port Inverted Modular Jack assembly, part numbers listed in Table 1. 2 Packaging material 2.1 Tray p/n see Table 1 2.2 label (p/n 292905-5)


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    ASHL-0005- PDF

    v-tek

    Abstract: v-tek tm-220 TM-220 292905 2-292388-9
    Text: PACKAGING SPECIFICATION 1 Scope This specification covers requirements of packaging material, packaging method and labelling for SIM Reader connecter P/N see Table 1 2 2.1 2.2 2.3 2.4 2.5 2.6 Packaging material Carrier tape (p/n see Table 1) Cover tape (p/n see Table 1)


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    p/n1332076-1) ASHL-0005- v-tek v-tek tm-220 TM-220 292905 2-292388-9 PDF

    TRANSISTOR BC 534

    Abstract: No abstract text available
    Text: THROUGH-HOLE PACKAGING REELS, TUBES, AMMO PACKS & TAPING SPECIFICATIONS MINIMUM PACKAGING QUANTITY MINIMUM PACKAGING QUANTITY Available Packaging Device Type 5KP 5W 5KW A-405 DF-M DO-15 D0-201 DO-201AD DO-35 DO-41 E-LINE GBJ GBPC/W GBU KBJ KBP KBPC/W MB/W


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    DO-15 D0-201 DO-201AD DO-35 DO-41 O220AB/AC, ITO-220AB, ITO-220S, O220F AP02008 TRANSISTOR BC 534 PDF

    TYCO electronics marking code date

    Abstract: PN 1016 tyco date code format national marking date code TRACE CODE ON BOX PACKING LABEL national marking code MARKING bj
    Text: Packaging Specification 107-24 22Jul09 Rev BJ Standard Packaging, Packing, Marking and Palletizing Methods 1. SCOPE 1.1. Content This specification covers the standard packaging, packing, marking and palletizing methods used by Tyco Electronics. 1.2. Purpose


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    22Jul09 TEC-107-211: TYCO electronics marking code date PN 1016 tyco date code format national marking date code TRACE CODE ON BOX PACKING LABEL national marking code MARKING bj PDF

    EIA364-1000

    Abstract: EIA-540-BOAE Land Grid Array EIA chip tray
    Text: PRODUCT SPECIFICATION LAND GRID ARRAY, SINGLE CONTACT, SOLDERLESS INTERPOSER SERIES 74988, 75150 AND 75154 Series 74988 with packaging plate Series 75150 (with packaging plate) Series 75154 (shown without packaging plate) REVISION: B ECR/ECN INFORMATION: TITLE:


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    PS-74988-001 EIA364-91. EIA364-1000 EIA-540-BOAE Land Grid Array EIA chip tray PDF

    EIAJ-ETX-7001

    Abstract: TE-17 RB731XN T106 T108 T110 T116 T146 T148 RoHM TE25 tape reel
    Text: Packaging specifications Diodes Packaging specifications surface mounting type zTaping Code Taping Code Package Package Specification Packaging Style, Direction T2R T2R T2L TE61 TL VMN2 VMD2 VMD3 EMD2 EMD3 EMD4 EMD5 TEMD5 EMD6 Embossed tape Embossed tape


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    00ipment EIAJ-ETX-7001 TE-17 RB731XN T106 T108 T110 T116 T146 T148 RoHM TE25 tape reel PDF

    7-174645-6

    Abstract: 1565388-1 AMP 9-176140-0 8-178041-6 6-174820-8
    Text: 107-68278 Packaging Specification 30May07 Rev R 1.25 FP FOR BAG PACKAGE 1. PURPOSE 目的 Define the packaging specification and packaging method of 1.25 FP Series products. 订定 1.25 FP Series 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT/PACKAGING QTY/LEAD FREE LABEL USAGE


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    30May07 QR-ME-030B 7-174645-6 1565388-1 AMP 9-176140-0 8-178041-6 6-174820-8 PDF

    EIAJ-ETX-7001

    Abstract: T106 T108 T110 T116 T146 T148 TE-17 RoHM TE25 tape reel
    Text: Packaging specifications Diodes Packaging specifications surface mounting type zTaping Code Ordering Unit (pcs/reel) Taping Code Package Package Specification Packaging Style, Direction T2R T2R T2R T2L TE61 TL GMD2 VMN2 VMD2 VMD3 EMD2 EMD3 EMD4 EMD5 TEMD5


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    SB200375WE2.5

    Abstract: No abstract text available
    Text: 107-68528 Packaging Specification 16Oct09 Rev G US LABEL SERIES 1. PURPOSE 目的 Define the packaging specifiction and packaging method of US LABEL SERIES. 订定 US LABEL SERIES 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 / PACKAGING QUANTITY 包装数量


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    16Oct09 E91514-000 QR-ME-030B SB200375WE2.5 PDF

    SB200375WE2.5

    Abstract: No abstract text available
    Text: 107-68528 Packaging Specification 25Apr11 Rev J US LABEL SERIES 1. PURPOSE 目的 Define the packaging specifiction and packaging method of US LABEL SERIES. 订定 US LABEL SERIES 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 / PACKAGING QUANTITY 包装数量


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    25Apr11 C87266-000 E-381191-10-9 QR-ME-030C SB200375WE2.5 PDF

    Untitled

    Abstract: No abstract text available
    Text: 107-68479 Packaging Specification 18Jul2013 Rev Y LEAF BATTERY CONN. 3P 1. PURPOSE 目的 Define the packaging specifiction and packaging method of LEAF BATTERY CONN. 3P. 订定 LEAF BATTERY CONN. 3P 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT/PACKAGING QTY 适用范围/包装数量


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    QR-ME-030CConfidential PDF

    Untitled

    Abstract: No abstract text available
    Text: 107-68164 Packaging Specification 30June08 Rev D REC HOUSING,MIS 1. PURPOSE 目的 Define the packaging specifiction and packaging method of REC HOUSING,MIS. 订定 REC HOUSING,MIS 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 / PACKAGING QUANTITY 包装数量


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    30June08 33/4/5/6/11P 7/8/9/10/12/13/14/15P 26/7/11/12P QR-ME-030B PDF

    MR4002

    Abstract: MR500
    Text: 107-68479 Packaging Specification 30Dec09 Rev V LEAF BATTERY CONN. 3P 1. PURPOSE 目的 Define the packaging specifiction and packaging method of LEAF BATTERY CONN. 3P. 订定 LEAF BATTERY CONN. 3P 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT/PACKAGING QTY 适用范围/包装数量


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    30Dec09 QR-ME-030B MR4002 MR500 PDF

    114-78011

    Abstract: 1-1337483-0 TEC-107-115 1-1337473-0 1-1337597-0 1-1337607-0 EB00 self adhesive label 1-1337610-0
    Text: RF COAXIAL CONNECTORS PACKAGING SPECIFICATION Specification No. 107-3275 29 APRIL 2009 REV D 1. SCOPE This specification covers the packaging and labeling requirements for RF Coaxial Connectors. Packaging is to comply with this specification in conjunction with Tyco


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    TEC-107-115. D20090512002130 EB00-0142-03 EB00-0242-02 114-78011 1-1337483-0 TEC-107-115 1-1337473-0 1-1337597-0 1-1337607-0 EB00 self adhesive label 1-1337610-0 PDF

    TEC-107-115

    Abstract: No abstract text available
    Text: RF COAXIAL CONNECTORS PACKAGING SPECIFICATION Specification No. 107-3275 29 JAN 2013 REV E3 1. SCOPE This specification covers the packaging and labeling requirements for RF Coaxial Connectors. Packaging is to comply with this specification in conjunction with Tyco


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    TEC-107-115. D20130110194804 D20090512002130 EB00-0142-03 EB00-0242-02 TEC-107-115 PDF

    A-405

    Abstract: pbu 810
    Text: Through-hole Packaging Reels, Ammo Packs, & Taping Specifications MINIMUM PACKAGING QUANTITY MINIMUM PACKING QUANTITY Available Packaging Bulk Device Type Quantity per Box Quantity per Tube Quantity per Tray 13"Æ Tape & Reel Ammo Pack Quantity per Reel Quantity per Box


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    DO-15 DO-201 DO-201AD DO-35 DO-41 AP02008 A-405 pbu 810 PDF

    DY 007

    Abstract: 343L INNER CARTON LABEL
    Text: PACKAGING SPECIFICATION 1. GENERAL 1,1 Purpose This packaging standard covers the packaging materials, packaging method and packaging quantities of RIMM Socket Assem bly at the time of shipment from plant. 1.2 Scope This packaging standard is applicable to Rimm Socket Assembly of the


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    12S0-DY DY 007 343L INNER CARTON LABEL PDF

    Untitled

    Abstract: No abstract text available
    Text: - a t _ îl|C O Electronics _ . , Packaging Specification 107-90020 10/07/01 Rev. O Packaging Specification Sub D housing 1. SCOPE : TRAY PACKAGING FOR SUB D HOUSING WITH TYCO LABEL 2. USED PACKAGING PHANTOM NUMBERS AND QUANTITIES Packaging Phantom Number


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    F42048V7201C F42048V7126C PDF

    Untitled

    Abstract: No abstract text available
    Text: ttjca Packaging Specification 107-90806 26/okt/2001 Rev. B Electronics Reeled contacts SCOPE : PACKAGING FOR AUTOMOTIVE CONTACTS 1. Packaging for automotive products that are reeled onto Tyco/Electronics EMEA standard cardboard reels 973051 . PACKAGING QUANTITIES AND USE OF ID / SECURING TAPE


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    26/okt/2001 PDF

    capacitor GR

    Abstract: GRH708 GRM235 murata grm39 capacitor GRM420 Murata GRM39
    Text: □ Packaging of Chip Monolithic Ceramic Capacitor GR Series There are three types of packaging for chip monolithic ceram ic capacitors. Please specify the packaging code when ordering. 1. Bulk Packaging Packaging code : PB, PM only for GM250 Packaging quantity : Please refer to the 1st page.


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    GM250) 42-6/G 420/G 430/G 220/G 25-401/GNM LL0306/LL0508/LL0612 42-2/G capacitor GR GRH708 GRM235 murata grm39 capacitor GRM420 Murata GRM39 PDF

    4046 Series IC

    Abstract: GHM 25
    Text: Packaging of High Voltage Type Chip Monolithic Ceramic Capacitor GHM Series Tape carrier packaging for high-voltage type chip monolithic ceram ic capacitors. Packaging code : PT The specifications for the available taping materials,paper and plastic, are as follows.


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    GHMxx25/GHMxx30 GHMxx25/GHMxx30/GHMxx35 GHMXX25 QHMXX30 GHMxx30 GHMXX35 4046 Series IC GHM 25 PDF

    T0220FP-5-V5

    Abstract: No abstract text available
    Text: Packaging Specifications Monolithic 1C ^ Monolithic ICs _ Quick reference of packaging specifications Package Container type DIP/SDIP Tube container SIP/HSIP/ZIP/SZIP Tube container Packaging specification code Tube container SO P/SSO P/HSO P Paper tape on reel


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    T0220FP T0220FP-5-V5 PDF