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    PACKAGES X17 Search Results

    PACKAGES X17 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGES X17 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    SIP 400B

    Abstract: 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1
    Text: CHAPTER 2 THROUGH HOLE PACKAGES 2.1 LINEUP OF THROUGH HOLE PACKAGES 2.2 LIST OF THROUGH HOLE PACKAGES 1 Plastic DIP (Dual In-line Package) (2) Ceramic DIP (Dual In-line Package) (3) Plastic SIP (Single In-line Package) (4) Plastic V-DIP (Vertical Dual In-line Package)


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    follow100A7-1 X280RF-100A-2 X280RF-100A1-1 X280RF-100A2-1 X280RF-100A3-1 X280RF-100A4 X280RF-100A5 X364RF-100A-1 X179RP-100A X447RP-50A SIP 400B 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1 PDF

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


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    C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B PDF

    Ablebond 71-1

    Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board
    Text: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages  DC resistance R of leads or pins  Capacitance (C) including lead-to-lead and loading capacitances  Inductance (L) including only self-inductance values for pins traces and wires (PGA) or


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    93-WA-EEP-6 91-WA-EEP-27 91-WA-EEP-31 pp1059-1070 pp357-366 Ablebond 71-1 Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board PDF

    IC51-1284-1433

    Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
    Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:


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    10mA/20mV IC51-0644-820-4 IC51-820-2 KS-9376 IC51-1284-1433 IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158 PDF

    cxd 158

    Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
    Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:


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    10mA/20mV cxd 158 ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003 PDF

    113 marking code transistor ROHM

    Abstract: DTDS14GP DTB133HKA rkm transistor 2SC5274 datasheet FMC1A rkm 33 transistor FMC1A rkm 24 DTD133HKA
    Text: Abbreviated markings on mini-mold transistors Transistors Abbreviated markings on mini-mold transistors !MPT3 labels The label on the MPT3 packages indicates the product, hFE rank, and month of manufacture using 4 letters. Codes B and AF indicate products.


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    PDF

    rkm 33 transistor

    Abstract: g1k bc848b rkm transistor DTB133HKA DTD133HKA MMST8598 TRANSISTOR MARKING CODE R2A rkm 35 transistor 2SA1885 marking W8 transistor
    Text: Abbreviated markings on mini-mold transistors Transistors Abbreviated markings on mini-mold transistors !MPT3 labels The label on the MPT3 packages indicates the product, hFE rank, and month of manufacture using 4 letters. Codes B and AF indicate products.


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    IMB11A IMB16 IMB17A IMD10A IMD14 IMD16A IMH10A IMH11A IMH14A IMH15A rkm 33 transistor g1k bc848b rkm transistor DTB133HKA DTD133HKA MMST8598 TRANSISTOR MARKING CODE R2A rkm 35 transistor 2SA1885 marking W8 transistor PDF

    AF2.5 din 74

    Abstract: P83 T15 J955 XC4028EX pinout 61.35 9 257 J29 P190 transistor p98 PC84 PG120 VQ100
    Text: R XC4000E and XC4000X Series Field Programmable Gate Arrays Device-Specific Pinout Tables Device-specific tables include all packages for each XC4000 and XC4000X Series device. They follow the pad locations around the die, and include boundary scan register locations.


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    XC4000E XC4000X XC4000 XC4002XL XC4002XL DS006 AF2.5 din 74 P83 T15 J955 XC4028EX pinout 61.35 9 257 J29 P190 transistor p98 PC84 PG120 VQ100 PDF

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


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    SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket PDF

    sc5 s dc 6v relay

    Abstract: P48D-70-600 UPD66010 UPD7752 AC03E uPD7520 uPA1601 UPD70208H uPD72020 uPD16503
    Text: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Semi-Custom IC 3 Particular Purpose IC 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 Microwave Device/ Consumer-Use High Frequency Device 7 Optical Device 8 Packages 9 Index 10 October 1997


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    Corpora1-504-2860 X10679EJEV0SG00 sc5 s dc 6v relay P48D-70-600 UPD66010 UPD7752 AC03E uPD7520 uPA1601 UPD70208H uPD72020 uPD16503 PDF

    AF2.5 din 74

    Abstract: P181 Japan K2808 634 p181 715 P181 K1805 J29 P190 xc4005e-TQ144 499 P44 20 g8 p281
    Text: XC4000E and XC4000X Series Field Programmable Gate Arrays November 10, 1997 Version 1.4 4 Device-Specific Pinout Tables Device-specific tables include all packages for each XC4000 and XC4000X Series device. They follow the pad locations around the die, and include boundary scan register locations.


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    XC4000E XC4000X XC4000 XC4003E XC4003E AF2.5 din 74 P181 Japan K2808 634 p181 715 P181 K1805 J29 P190 xc4005e-TQ144 499 P44 20 g8 p281 PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Obsolete/Under Obsolescence R XC4000E and XC4000X Series Field Programmable Gate Arrays Device-Specific Pinout Tables Device-specific tables include all packages for each XC4000 and XC4000X Series device. They follow the pad locations around the die, and include boundary scan register locations.


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    XC4000E XC4000X XC4000 XC4002XL XC4002XL BG256 PDF

    MD300-10A

    Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
    Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP


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    S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA PDF

    S24C MARK

    Abstract: tsop 3602 9020 8-pin SOP SIP 400B nec 1251 P100G thomson 462 t P5VP-340B3-2 J 80222 P28D-100-600A1-1
    Text: Packages Plastic DIP Dual In-line Package Units in mm 8-pin plastic DIP (300mil) 8 5 1 4 14-pin plastic DIP with TAB (300mil) 14 8 1 7 20.32 MAX. 7.62 10.16 MAX. 24.60 MAX. 7.62 4.31 MAX. 6.4 0.9 MIN. 6.4 5.08 MAX. 5.08 MAX. 4.31 MAX. 2.54 0.51 MIN. 2.54


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    300mil) 14-pin P8C-100-300B, P14CT-100-300B-1 X10679EJCV0SG00 S24C MARK tsop 3602 9020 8-pin SOP SIP 400B nec 1251 P100G thomson 462 t P5VP-340B3-2 J 80222 P28D-100-600A1-1 PDF

    uPD3599

    Abstract: transistor nec 2SK2396 MOS FET BUZ 444 MC-7643 nec 3S4M 4305 regulator nec RD2.4S equivalent 2SC4305 NEC 2sA1441 nec NPN transistor SST 117
    Text: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Seimi-Custom IC 3 Particular Purpose 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 GaAs Device/ Silicon Microwave Semiconductor 7 Optical Device 8 Packages 9 Index 10 April 1998 The export of these products from Japan is regulated by the Japanese government. The export of some or all of


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    X10679EJFV0SG00 uPD3599 transistor nec 2SK2396 MOS FET BUZ 444 MC-7643 nec 3S4M 4305 regulator nec RD2.4S equivalent 2SC4305 NEC 2sA1441 nec NPN transistor SST 117 PDF

    740-Family

    Abstract: 9907A M37783 m37602 M37780 FLX160-PRB ic59-64075-G4 M37702E4 m37774 M37798
    Text: Introduction To meet the needs for target systems that vary from customer to customer, Mitsubishi provides a wide selection of MCU packages and various types of accessories. These accessories can be used to connect the target and emulator, as well as mount an evaluation MCU on the target when its package is different from that of the actual


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    64-pin, 80-pin, 100pin PCA7754 PCA7755A PCA7755B PCA7756 SEAL100FP SEAL64FP SEAL80FP 740-Family 9907A M37783 m37602 M37780 FLX160-PRB ic59-64075-G4 M37702E4 m37774 M37798 PDF

    LMX9838

    Abstract: flowchart of bluetooth technology 005F-0060 Bluetooth hv3 005D MC145483 AN-1699 Bluetooth working principle IC 72131 ATDT012-345-6789
    Text: National Semiconductor Application Note AN-1699 Markus Roemer / Sebastien Mathieu September 2007 1.0 Introduction The National Semiconductor LMX9838 Bluetooth Serial Port module is a fully integrated Bluetooth 2.0 baseband controller, 2.4 GHz radio, crystal, antenna, LDO and discrets combined to form a complete small form factor 10 mm x17 mm


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    AN-1699 LMX9838 flowchart of bluetooth technology 005F-0060 Bluetooth hv3 005D MC145483 AN-1699 Bluetooth working principle IC 72131 ATDT012-345-6789 PDF

    Matthey

    Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


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    AP-577 Box5200, Matthey sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap PDF

    msm5232

    Abstract: d2b bus MSM5230 MSM6920 MSM7731-02 2016 RAM MSM66P589 MSM6411 18QFJ 3ch-10bit
    Text: Semiconductor Shortform Catalogue June 1999 Taupo Bay, New Zealand Foreword Strong Partnerships http://www.arm.com/ http://www.rambus.com/ http://www.elan.fr/ http://www.dialogic.com/ http://www.symbionics.co.uk/ http://www.vividsemi.com/ Oki Semiconductor Websites


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    99J595RB msm5232 d2b bus MSM5230 MSM6920 MSM7731-02 2016 RAM MSM66P589 MSM6411 18QFJ 3ch-10bit PDF

    Robinson Nugent pga

    Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


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    AP-577 Box5200, Robinson Nugent pga burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa PDF

    tucker

    Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


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    AP-577 Box5200, tucker CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1 PDF

    blm32a07

    Abstract: MGU297 SSOP16 UDA1361TS UDA1361
    Text: INTEGRATED CIRCUITS DATA SHEET UDA1361TS 96 kHz sampling 24-bit stereo audio ADC Product specification Supersedes data of 2001 Jan 17 2002 Nov 25 Philips Semiconductors Product specification 96 kHz sampling 24-bit stereo audio ADC UDA1361TS FEATURES General


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    UDA1361TS 24-bit 768fs SSOP16) UDA1361TS SCA74 753503/02/pp20 blm32a07 MGU297 SSOP16 UDA1361 PDF

    A1037AK

    Abstract: 1037ak 1514K
    Text: Transistors U M 6 and IM D packages contain two independent transistors in one small surface mount package. UM6 Suffix N * IMD (6 pin type including independent 2 circuits) Package E quivalent circuit A pplication TOP VIEW IMD UM 6 UM T1N G3 E J g n n ri


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    A1037AK A1036Kx2 1514K 1037ak PDF

    Untitled

    Abstract: No abstract text available
    Text: Transistors General Purpose Transistor Isolated Dual Transistors IMX17 •F e a tu re s •E x te r n a l dim ensions (Units: mm) 1) T w o 2 S D 1 4 8 4 K c h i p s i n a n S M T package. 2) 1.9±0.2 |!o-9y.95j tom atic mounting m achine. 3 ) T ransistor e le m e n ts a re in d e p e n ­


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    SC-74 0Dlb713 O-220FN O-220FN O220FP T0-220FP, O-220FP. 7020c PDF