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    PACKAGES SMT Search Results

    PACKAGES SMT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGES SMT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    footprint jedec MS-026 TQFP

    Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
    Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES


    Original     		PDF

    213B

    Abstract: No abstract text available
    Text: Reliability Qualification Report Voltage Controlled Oscillators VCOs Phase-Locked Loops (PLL) Products Qualified All VCO Modules in T Packages All VCO Modules in U Packages All VCO Modules in K Packages All VCO Modules in W Packages All VCO Modules in X Packages


    Original     		PDF PLL250 PLL300 PLL350 PLL400 10-2000Hz 15min grams/30 RQR-104598 213B

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a


    Original     		PDF DS550R

    ky 202

    Abstract: a104b 213B A101B A103B JESD22 SN63 JESD22-A101-B
    Text: Reliability Qualification Report Voltage Controlled Oscillators VCOs - RoHS compliant Phase-Locked Loops (PLL) - RoHS compliant Products Qualified All VCO Modules in –UY Packages All VCO Modules in -TY Packages All VCO Modules in -KY Packages All VCO Modules in -WY Packages


    Original     		PDF 30minute 500hrs 1000hrs JESD22-A101b 1000hrs ky 202 a104b 213B A101B A103B JESD22 SN63 JESD22-A101-B

    JEDEC Matrix Tray outlines

    Abstract: IspLSI PCMCIA copper bond wire micro semi BGD35
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		PDF JESD51, JEDEC Matrix Tray outlines IspLSI PCMCIA copper bond wire micro semi BGD35

    footprint jedec MS-026 TQFP

    Abstract: PL84 tube AS 108-120 x-ray tube datasheet 144 QFP body size drawing of a geometrical isometric sheet superior Natural gas engines x-ray tube datasheet 026 SMT, FPGA FINE PITCH BGA 456 BALL mo-047 texas
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		PDF G46-88 footprint jedec MS-026 TQFP PL84 tube AS 108-120 x-ray tube datasheet 144 QFP body size drawing of a geometrical isometric sheet superior Natural gas engines x-ray tube datasheet 026 SMT, FPGA FINE PITCH BGA 456 BALL mo-047 texas

    ky 202

    Abstract: jesd22-a103b A104B A103B A101B MMIC VCO 213B JESD22 SN63 JESD22-A101-B
    Text: Reliability Qualification Report Voltage Controlled Oscillators VCOs - RoHS compliant Phase-Locked Loops (PLL) - RoHS compliant Products Qualified All VCO Modules in –UY Packages All VCO Modules in -TY Packages All VCO Modules in -KY Packages All VCO Modules in -WY Packages


    Original     		PDF 30minute 500hrs 1000hrs JESD22-A101b 1000hrs ky 202 jesd22-a103b A104B A103B A101B MMIC VCO 213B JESD22 SN63 JESD22-A101-B

    ky 202

    Abstract: A104B JESD22 Method A101-B A101B JESD22-A101-B A103B jesd22-a103b KY Series JESD22 213B
    Text: Reliability Qualification Report Voltage Controlled Oscillators VCOs - RoHS compliant Phase-Locked Loops (PLL) - RoHS compliant Products Qualified All VCO Modules in UY Packages All VCO Modules in TY Packages All VCO Modules in KY Packages All VCO Modules in WY Packages


    Original     		PDF PLL250 PLL300 PLL350 PLL400 30minute 500hrs 1000hrs JESD22-A101b 1000hrs ky 202 A104B JESD22 Method A101-B A101B JESD22-A101-B A103B jesd22-a103b KY Series JESD22 213B

    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES

    Abstract: AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		PDF JESD51, EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP

    amkor CABGA 56

    Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
    Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,


    Original     		PDF

    24 leads qfn 5x5

    Abstract: qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance
    Text: AN0017 Application Note for Molded Plastic QFN Packages GaAs Monolithic Packaged Microwave IC 1. General considerations on plastic molded packages Surface Mount Device type packages SMD* for microwave applications are appearing more and more on the market. The use of such packages requires some


    Original     		PDF AN0017 AN0017-8206 24 leads qfn 5x5 qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance

    vFBGA* 96 bALL

    Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
    Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are


    Original     		PDF

    SOT23 JEDEC standard orientation

    Abstract: SOT23 JEDEC standard MO-223A c 3421 transistor SOT23 JEDEC standard orientation pad size JEDEC 95 sot packages MO-193D 193d Amkor G600 SC sot23
    Text: LEADFRAME data sheet SOT / SC Features: Thermal Resistance: Standard Outline Transistor SOT23 and Single Chip (SC70) Packages: Amkor’s 1.0 mm thick, 3, 5, 6, and 8 lead SOT23 and 5 and 6 lead SC70 packages offer gullwing lead, subminiature, SMT performance


    Original     		PDF MO-193D. SOT23 JEDEC standard orientation SOT23 JEDEC standard MO-223A c 3421 transistor SOT23 JEDEC standard orientation pad size JEDEC 95 sot packages MO-193D 193d Amkor G600 SC sot23

    adapter 56-pin TSOP

    Abstract: 28F001BX 28F010 28F020 28F032SA adapter 48-pin TSOP
    Text: SOCKET ADAPTERS EDI Breadboarding Adapters • ■ ■ Conversion of SMT packages PSOP, SSOP and TSOP into DIP components Gold plated phosphor bronze DIP pins All breadboarding adapters are stock items These adapters permit the use of surface mounted packages, such as PSOP, SSOP


    Original     		PDF 56-lead 56-SOP 56TS/D9-1-SMT/S 28F016SA/SV/XS 56SSO/D9-1-SMT/S 28F032SA 28F200B/C adapter 56-pin TSOP 28F001BX 28F010 28F020 28F032SA adapter 48-pin TSOP

    JESD22-A113

    Abstract: QFN-20 reflow ipc-SM-782 JESD47 JESD-47 QFN-20 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000
    Text: Silicon Laboratories SMT Soldering Guidelines for MCU Products SCOPE: For all of the Silicon Laboratories Microcontroller Products in QFN, TQFP/LQFP, and PDIP packages. I. SMT Soldering Considerations for QFN Packages • See the CARSEM QFN application note, which can be found at http://www.carsem.com/.


    Original     		PDF IPC-SM-782 APR-5000 QFN-24 -QFN11 JESD22-A113 QFN-20 reflow JESD47 JESD-47 QFN-20 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000

    motherboard

    Abstract: AN0005 RO4003 SN63
    Text: AN0005 Application Note for leadless SMD type packages GaAs Monolithic Microwave IC in surface mount technology SMT leadless package Surface mount device (SMD) type packages for micro- and mm-wave applications are appearing more and more on the market. However, the application of such


    Original     		PDF AN0005 AN0005-Aug01 motherboard AN0005 RO4003 SN63

    Untitled

    Abstract: No abstract text available
    Text: DATASHEET Rev. A RGUW2 SERIES 4:1 Ultra Wide Input Voltage Range DIP and SMT Packages Single and Dual Outputs 2 Watt DC/DC Power Converters FEATURES • 2 Watts Maximum Output Power  Single and Dual Outputs  SMT & DIP Packages: 0.74 x 0.50 x 0.33 Inches


    Original     		PDF J-STD-020D 1600VDC 3000VDC 100KHz,

    pcb warpage* in smt reflow

    Abstract: JEDEC SMT reflow profile SMT Process pcb warpage in ipc standard J-STD20
    Text: 2xxxx-APP-001-A September 2006 SMT Lead-Free Packages Application Note Introduction The objective of this application note is to provide the basic SMT design and process requirements necessary to ensure high assembly yield and product reliability for lead-free packages. Mindspeed has taken a proactive role


    Original     		PDF 2xxxx-APP-001-A pcb warpage* in smt reflow JEDEC SMT reflow profile SMT Process pcb warpage in ipc standard J-STD20

    Untitled

    Abstract: No abstract text available
    Text: DATASHEET Rev. A RGUW3 SERIES 4:1 Ultra Wide Input Voltage Range DIP and SMT Packages Single and Dual Outputs 3 Watt DC/DC Power Converters FEATURES • 3 Watts Maximum Output Power  Single and Dual Outputs  SMT & DIP Packages: 0.74 x 0.50 x 0.33 Inches


    Original     		PDF J-STD-020D 1600VDC 3000VDC 100KHz,

    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    SC74A

    Abstract: SC-74A transistor 5 PIN dual transistors UMT5
    Text: Transistors, dual, 5-pin package Transistors, dual, 5-pin package These ROHM packages consist of various connected pairs of transistors in a single 5-pin package. These dual transistor 5-pin packages are available in UMT5 UM5 and SMT5 (FMT, SC-74A) sizes. These packages are similar in size to the UMT3 and SMT3 packages so a


    OCR Scan     		PDF SC-74A) SC74A SC-74A transistor 5 PIN dual transistors UMT5

    Transistor Arrays

    Abstract: transistor SST 126 IMD6 transistor 136 138 140
    Text: "Transistors Surface Mounted Leaded Packages Available-«> Packages Available-110 POWER MOSFET-112 POWER MOSFET- ei MPT • CPT F5 • PSD


    OCR Scan     		PDF ailable-------------------------------110 SFET----------------------------------112 T0-220FP O-247 OT-23) SC-59/Japemw PSIP12Pin. LF12Pin Transistor Arrays transistor SST 126 IMD6 transistor 136 138 140

    Untitled

    Abstract: No abstract text available
    Text: Transistors Packages Packages ROHM has been manufacturing transistors since 1975. In the development of products, we constantly strive to an­ ticipate the needs of our customers. Regarding packages, the demands of the market for compactness, low power consumption, low power dissipation and automatic mounting support are becoming ever greater, and we are


    OCR Scan     		PDF SC-75A SC-70) mak220FP SC-67 O-220FP O-126 O-220, O-220FN O220FP