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    PACKAGES CASE TO 18 Search Results

    PACKAGES CASE TO 18 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGES CASE TO 18 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    tqfp 44 thermal resistance

    Abstract: tqfp 64 thermal resistance CPGA MQUAD PQFP-128 TQFP 132 PACKAGE Package 48 LCC CQFP 240
    Text: Thermal Resistance of Packages 4401035 NC Thermal Resistance of Packages Similarly, thermal resistance from junction to case is denoted by θ JC , and defined by θ JC = T j – T c ⁄ P d ; here, T c is the case temperature (˚C) at the external surface of the package.


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    MC9S08SH8/4

    Abstract: MC9S08QB8
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


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    PDF EB806: MC9S08AC128, MC9S08SH8/4 MC9S08QB8

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


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    PDF EB806: MC9S08LL16

    MC9S08SH8/4

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original
    PDF EB806: MC9S08SH8/4

    MC9S08SH8/4

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original
    PDF EB806: MC9S08SH8/4

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original
    PDF EB806:

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


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    PDF EB806:

    mc9s08sh

    Abstract: MC9S08SH8
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


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    PDF EB806: mc9s08sh MC9S08SH8

    MC9S08SH8/4

    Abstract: MC9S08JM60 c code example
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original
    PDF EB806: MC9S08SH8/4 MC9S08JM60 c code example

    MC9S08SH8/4

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original
    PDF EB806: MC9S08SH8/4

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original
    PDF EB806:

    MC9S08QB8

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original
    PDF EB806: MC9S08QB8

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


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    PDF EB806: MC9S08QE32

    MC9S08SH8, instructions set

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


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    PDF EB806: MC9S08SH8, instructions set

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


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    PDF EB806: MC9S08GT16A

    1262-33

    Abstract: IXTP44N10T IXTH200N10T ixtp76n075 IXTA60N10T IXTQ130N10T IXTP98N075T IXTP130N10T IXTP240N055T IXTP64N055T
    Text: TrenchMV 55V-100V Power MOSFETs The ISOPLUS™ Advantage All IXYS ISOPLUS packages are manufactured with an internal direct-copper-bonded (DCB) isolated substrate, are UL certified and provide integral backside case isolation. These packages provide high isolation capability (up to 2500V), improve creepage distance and dramatically reduce total thermal resistance.


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    PDF 5V-100V) O-247 PLUS220 ISOPLUS220TM PLUS220SMD O-252 O-220 O-263 1262-33 IXTP44N10T IXTH200N10T ixtp76n075 IXTA60N10T IXTQ130N10T IXTP98N075T IXTP130N10T IXTP240N055T IXTP64N055T

    ACT86G

    Abstract: No abstract text available
    Text: MC74AC86, MC74ACT86 Quad 2−Input Exclusive−OR Gate Features • Outputs Source/Sink 24 mA • Pb−Free Packages are Available http://onsemi.com PDIP−14 N SUFFIX CASE 646 14 1 SOIC−14 D SUFFIX CASE 751A MAXIMUM RATINGS Rating Symbol Value Unit DC Supply Voltage Referenced to GND


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    PDF MC74AC86, MC74ACT86 MC74AC86/D ACT86G

    74AC

    Abstract: MC74AC86 MC74AC86N MC74AC86NG MC74ACT86 MC74ACT86N
    Text: MC74AC86, MC74ACT86 Quad 2−Input Exclusive−OR Gate Features • Outputs Source/Sink 24 mA • Pb−Free Packages are Available* http://onsemi.com PDIP−14 N SUFFIX CASE 646 14 1 SOIC−14 D SUFFIX CASE 751A MAXIMUM RATINGS Rating Symbol Value Unit DC Supply Voltage Referenced to GND


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    PDF MC74AC86, MC74ACT86 PDIP-14 SOIC-14 TSSOP-14 MC74AC86/D 74AC MC74AC86 MC74AC86N MC74AC86NG MC74ACT86 MC74ACT86N

    BRX49 equivalent

    Abstract: 2N5064 equivalent BRX49 pinout BRX45 BRX47 BRX49 BRX49 2N5061 "Silicon Controlled Rectifiers" 2N3005 2n5062 datasheet free download
    Text: SCRs Silicon Controlled Rectifiers Metal/Plastic Packages 0.8 to 110 Amperes RMS 15 to 1200 Volts IT (AMPS) o 0.8 @ TC ( C) 55 55 55 55 60 ITSM (AMPS) 6.0 6.0 6.0 6.0 10 TO-92 CASE TO-18 TO-92 Pinout Pinout CGA AGC VRRM (VOLTS) 15 2N876 2N884 30 2N877 2N885


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    PDF 2N876 2N884 2N877 2N885 2N3001 2N3005 2N5060 BRX44* 2N878 2N886 BRX49 equivalent 2N5064 equivalent BRX49 pinout BRX45 BRX47 BRX49 BRX49 2N5061 "Silicon Controlled Rectifiers" 2N3005 2n5062 datasheet free download

    BRX49 equivalent

    Abstract: BRX49 BRX49 pinout 2n1771 data sheet 2N4172 2N1778 circuit G C106B1 2N3670 2n3668 C103B
    Text: SCRs Silicon Controlled Rectifiers Metal/Plastic Packages 0.8 to 110 Amperes RMS 15 to 1200 Volts IT (AMPS) o 0.8 @ TC ( C) 55 55 55 55 60 ITSM (AMPS) 6.0 6.0 6.0 6.0 10 TO-92 CASE TO-18 TO-92 Pinout Pinout CGA AGC VRRM (VOLTS) 15 2N876 2N884 30 2N877 2N885


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    PDF 2N876 2N884 2N877 2N885 2N3001 2N3005 2N5060 BRX44* 2N878 2N886 BRX49 equivalent BRX49 BRX49 pinout 2n1771 data sheet 2N4172 2N1778 circuit G C106B1 2N3670 2n3668 C103B

    BRX49 pinout

    Abstract: BRX49 equivalent BRX49 brx46 BRX47 BRX49 2N6565 2N5061 BRX45 2N3005 2N5063
    Text: SCRs Silicon Controlled Rectifiers Metal/Plastic Packages 0.8 to 110 Amperes RMS 15 to 1200 Volts IT (AMPS) o 0.8 @ TC ( C) 55 55 55 55 60 ITSM (AMPS) 6.0 6.0 6.0 6.0 10 TO-92 CASE TO-18 TO-92 Pinout Pinout CGA AGC VRRM (VOLTS) 15 2N876 2N884 30 2N877 2N885


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    PDF 2N876 2N884 2N877 2N885 2N3001 2N3005 2N5060 BRX44* 2N878 2N886 BRX49 pinout BRX49 equivalent BRX49 brx46 BRX47 BRX49 2N6565 2N5061 BRX45 2N3005 2N5063

    MTM13N50E

    Abstract: MTM13N50 40N20 MOSFET IRF250 TM12P10 55n10 mtm6n80 15N20 MTM7N50 mtm15n40e
    Text: TT TMOS TMOS Power MOSFETs Metal Packages — TO-204AA/AE 0 40" 060" TO-204AA CASE 1-07 Table 6 — P-Channel Voss Volts Min 100 RDS(on) ID (Ohms) (Amps) Max TO-204AE CASE 197A-03 Table 7 — N-Channel Device •d (cont) Amps Pd * (Watts) Max VDSS (Volts)


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    PDF O-204AA/AE O-204AA O-204AE 97A-03 TM12P10 TM20P10 MTM6N100E MTM6N80E IRF440 IRF450 MTM13N50E MTM13N50 40N20 MOSFET IRF250 55n10 mtm6n80 15N20 MTM7N50 mtm15n40e

    BC108A

    Abstract: bc109
    Text: BC107 to 109 _ A .F. SILICON PLANAR EPITAXIAL TRANSISTORS General purpose NPN transistors in TO-18 metal packages w ith the collector connected to the case. PNP com plem ents are BC177, BC178 and BC179. QUICK REFERENCE D ATA Collector-emitter voltage VgE = 0


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    PDF BC107 BC177, BC178 BC179. BC107A BC107B BC108C BC108A BC108B bc109

    Untitled

    Abstract: No abstract text available
    Text: SCRS Silicon Controlled Rectifiers Metal/Plastic Packages 0.8 to 110 Amperes RMS 15 to 1200 Volts 0.8 IT (AMPS) @ Tc (°C) ITSM (AMPS) 55 55 55 55 60 60 6.0 6.0 6.0 6.0 10 10 11 TO-18 CASE TO-92 TO-92-18R VRRM (VOLTS) 15 2N876 2N884 30 2N877 2N885 2N3001


    OCR Scan
    PDF O-92-18R 2N876 2N884 2N877 2N885 2N3001 2N3005 2N5060 BRX44 2N878