PACKAGE TO 39 Search Results

TO8 package

Abstract: SM19 TO -8 package
Contextual Info: Amplifier Outline Drawings TO-8 Package T4 TO-8B Package (T8) TO-12 Package (T7) TO-39 Package (T10) .500” Fiatpack (FP4) .625”Gullwing (SG4) - 460- Amplifier Outline Drawings .450” Sq. Surface Mount (SM-3) .375” Sq. Surface Mount (SM-11) .188 j— a ( .050 db.015

SD1101BD

Abstract: SD1100 SD1100CHP SD1100DD SD1100HD SD1101 SD1101CHP SD1101DD SD1101HD VP0540
Contextual Info: TOPAZ SEM ICONDUCTOR OSE D $ | 1 ìOfiSSEb 1 1 | GOOlGEb , S O I 4 1 SEMICONDUCTOR N-CHANNEL ENHANCSMENT-MQDE HIGH-VOLTAGE D-MOS POWES FETS ORDERING INFORMATION Sorted Chips In Conductive Waffle Pack TO-226AA TO-92 Package TO-206AA (TO-18) Package TO-205AF (TO-39) Package

DSE 130 -06A

Abstract: DSE 130 -12A DSE 130 -10A SD1107CHP SD1107DD SD1107HD SD1117CHP SD1117DD SD1117HD SD1107BD
Contextual Info: TO PAZ S E M I C O N D U C T O R 05E D | T ü ö S E E b D0Q1G34 b | SD 1107, SD Ì 117 SEMICONDUCTOR N-CHANNEL ENHANCEMENT-MODE D-MOS POWER FETs ORDERING INFORMATION Configuration Sorted Chips- in Waffle Pack T0-206AA TO-18 Package TO-205AF (TO-39! Package TO-226AA (TO-92) Package

Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company Hermetically Sealed Metal Can Package TO-39 Outline Package Drawing and Packaging Information Continental Device India Limited Data Sheet Page 1 of 3 TO-39 Metal Can Package

Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company Hermetically Sealed Metal Can Package TO-39 Outline Package Drawing and Packaging Information Continental Device India Limited Data Sheet Page 1 of 3 TO-39 Metal Can Package

14 pin ic dip

Abstract: 004U
Contextual Info: mi it t i mi Sem elab Mil / A erospace Division LINEAR ICs — BS 9000 QUALIFIED PRO DUCT - OUTLINES K Package O'0 -3 H Package TO-39) 22.23 G Package (TO-257) OH lOMSl, <ii +_ J Package (8 Pin Ceram ic DIP) 0*5?i0 102 (3.018:0.00*1 2.13* ~ ir 'A A A A

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

SO8C

Abstract: TNY264G PI-275 TO220-7 smd transistor 8c P08A 0403 20 PIN SMD IC TNY264 eDIP-12 p08c
Contextual Info: Package Information Package Design Specifications, Tape & Reel and Assembly Information Package Design Specifications TO-220-7C Y Package .165 (4.19) .185 (4.70) .390 (9.91) .420 (10.67) .146 (3.71) .156 (3.96) .108 (2.74) REF + .045 (1.14) .055 (1.40) .234 (5.94)

eSOP-12

Abstract: TNY264G P08A TNY264 kose eSIP-7C PI-52 forced draft cooling tower eDIP-12 TL183
Contextual Info: Package Information Package Design Specifications, Tape & Reel and Assembly Information Package Design Specifications TO-220-7C Y Package .165 (4.19) .185 (4.70) .390 (9.91) .420 (10.67) .146 (3.71) .156 (3.96) .108 (2.74) REF + .045 (1.14) .055 (1.40) .234 (5.94)

TO-251 footprint

Abstract: motorola triac catalog DO204AH Packages thyristor T 218 N Thyristor catalog RCA THYRISTOR isolated gate Thyristor
Contextual Info: M1 Package Dimensions M1 This section contains the dimensions for the following packages: • F Package — TO-202AB, Type 1 Non-isolated • Y Package — DO-35 or DO-204AH • R Package — TO-220AB (Non-isolated) • L Package — TO-220AB (Isolated)

Contextual Info: TO-39 Metal-Can Package Transistors PNP 42

Contextual Info: TO-39 Metal-Can Package Transistors NPN 40

PLN 2032

Abstract: TO-226A to-237
Contextual Info: TELEDYNE COMPONENTS aaE j> o aii?t.Qa ûüab44i a T-31-25 SD3300, SD3301 SE M IC O N D U C TO R N-CHANNEL ENHANCEMENT-MODE D-MOS POWER FETs ORDERING INFORMATION SD33Q0CHP SD3301CHP TO-205AF TO-39 Hermetic Package SD3300Ht> SD3301HB TO-226AA (TO-92) Plastic Package

2n5153

Contextual Info: PNP Power Silicon Transistor 2N5151, 2N5151L & 2N5153, 2N5153L Features • Available in JAN, JANTX, and JANTXV per MIL-PRF-19500/545 • TO-5 Package: 2N5151L, 2N5153L TO-39 TO-205AD Package: 2N5151, 2N5153 Maximum Ratings (TC = +25°C unless otherwise noted)

2N5153 JANS

Abstract: 2n5153
Contextual Info: PNP Power Silicon Transistor 2N5151, 2N5151L & 2N5153, 2N5153L Features • Available in JAN, JANTX, JANTXV and JANS per MIL-PRF-19500/545 • TO-5 Package: 2N5151L, 2N5153L TO-39 TO-205AD Package: 2N5151, 2N5153 Maximum Ratings (TC = +25°C unless otherwise noted)

Contextual Info: NPN Power Silicon Transistor 2N5152, 2N5152L & 2N5154, 2N5154L Features • Available in JAN, JANTX, JANTXV and JANS per MIL-PRF-19500/544 • TO-5 Package: 2N5152L, 2N5154L TO-39 TO-205AD Package: 2N5152, 2N5154 Maximum Ratings (TC = +25°C unless otherwise noted)

2n5154

Abstract: 2N5152
Contextual Info: NPN Power Silicon Transistor 2N5152, 2N5152L & 2N5154, 2N5154L Features • Available in JAN, JANTX, JANTXV and JANS per MIL-PRF-19500/544 • TO-5 Package: 2N5152L, 2N5154L TO-39 TO-205AD Package: 2N5152, 2N5154 Maximum Ratings (TC = +25°C unless otherwise noted)

MA8000

Abstract: MAZS200 MA8000 Series
Contextual Info: Ultra Small Package SS Mini 2-pin ZenerDiode Series MAZS Series • Features ■ Package Outlines 1) 2) 3) 4) Ultra Small Package – SS Mini (2-pins) 1608 – Type Package Power dissipation: Ptot=150mW Vz series: 2.4 V to 39 V (Rank classification is available)

BLX65S

Abstract: TO39 package
Contextual Info: ASI BLX65S NPN SILICON HIGH FREQUENCY TRANSISTOR DESCRIPTION The ASI BLX65S is Designed for 12.5 V Class C Amplifier Applications in the 100 to 500 MHz Frequency Range. PACKAGE STYLE TO-39 FEATURES INCLUDE: • Economical TO-39 Package • 8 dB Typical Gain

0403 20 PIN SMD IC

Abstract: MS-001-AB SO8C tny264g P08A R0308 eSIP-7C TO-220-7C TO-263-7C tny2* 7 pin
Contextual Info: Package Information Package Design Specifications, Tape & Reel and Assembly Information Package Design Specifications TO-220-7C .165 4.19 .185 (4.70) .390 (9.91) .420 (10.67) .146 (3.71) .156 (3.96) .108 (2.74) REF + .045 (1.14) .055 (1.40) .234 (5.94)

Contextual Info: ITI I N E TO-3 PACKAGE 1=7 1 TO-5 PACKAGE TO-39 is TO-5 with 0.50 Min leads 305 370 . >3 M*» MOOfFMED TO-3 PACKAGE (60mil pins) D R A W IN G S U 1 009 125 S E A T IN G P L A N E _ I \ . 450 250 “T I SO M IN 1s a M A X IV ^ B O T H ENDS 03 4 n?a 'V Collector is connected to case.

2SC4911

Abstract: 2SC5073 2SC5072 equivalent 2sc3722k T147 2SC4619 2SC3082K 2SC4723 2sc4997 equivalents 2sa1455k
Contextual Info: Transistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to TO-220, Pc=35W transistors. EM3 • UNIT • SMT Three types are available to allow the most suitable package depending on size specifications.

2SC 1885

Abstract: 2sc low noise
Contextual Info: T ransistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to TO-220, Pc=35W transistors. EM3 • UMT • SMT Three types are available to allow the most suitable package depending on size specifications.

2SC5072

Abstract: 2sc5073 25d13 25D-13
Contextual Info: Transistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to TO-220, Pc=35W transistors. EM3 • UNIT • SMT Three types are available to allow the most suitable package depending on size specifications.