SOL16-P
Abstract: HQFP64-P SOL18 package SOL20 package PACKAGE DIMENSIONS SOP14 HSOP16 HSON-6P HZIP25-P QFP48 package
Text: [ 7 ] IC/LSI Package Dimensions [ 7 ] IC/LSI Package Dimensions Unit: mm DIP8-P-300-2.54 DIP14-P-300-2.54 DIP16-P-300-2.54A DIP18-P-300-2.54D 1271 [ 7 ] IC/LSI Package Dimensions Unit: mm DIP20-P-300-2.54A DIP42-P-600-2.54 HQFP64-P-1010-0.50 HSON6-P-0303-0.95
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Original
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
DIP20-P-300-2
DIP42-P-600-2
HQFP64-P-1010-0
HSON6-P-0303-0
HSOP16-P-300-1
HSOP20-P-450-1
SOL16-P
HQFP64-P
SOL18 package
SOL20 package
PACKAGE DIMENSIONS
SOP14
HSOP16
HSON-6P
HZIP25-P
QFP48 package
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT724-1 A X c y HE v M A Z 11 20 A2 A A3 A1 θ Lp L 10 1 1/2 e e bp detail X w M 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
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Original
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SSOP20:
OT724-1
MO-137
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PDF
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JEP95
Abstract: MO-137 SSOP20 marx
Text: ZMD-Standard August 2003 Package SSOP20 3,9 mm MDS 767 Dimensions in millimetres Based on JEDEC JEP95: MO-137 1 Dimensions View X bp A A2 X 1 10 e D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,73 Amin 1,54 bPmin 0,20 A1min 0,10 bPmax 0,30
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Original
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SSOP20
JEP95:
MO-137
QS-000767-HD-01
JEP95
MO-137
SSOP20
marx
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PDF
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JEP95
Abstract: MO-150 SSOP20 QS-000757-HD-02 marx
Text: ZMD-Standard February 2000 Package SSOP20 5,3 mm MDS 757 Supersedes Edition 11.99 Dimensions in millimetres Based on JEDEC JEP95: MO-150 1 Dimensions A A2 X View X k x 45° 0,1 1 Z bp e 0,15 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax
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Original
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SSOP20
JEP95:
MO-150
QS-000757-HD-02
JEP95
MO-150
SSOP20
QS-000757-HD-02
marx
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PDF
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SSOP20
Abstract: MO-137
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT724-1 A X c y HE v M A Z 11 20 A2 A A3 A1 θ Lp L 10 1 1/2 e e bp detail X w M 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
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Original
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SSOP20:
OT724-1
MO-137
SSOP20
MO-137
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PDF
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MO-137
Abstract: SSOP20 package SSOP20 sot724
Text: PDF: 2001 Jul 04 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT724-1 A X c y HE v M A Z 11 20 A2 A A3 A1 θ Lp L 10 1 1/2 e e bp detail X w M 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
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Original
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SSOP20:
OT724-1
MO-137
MO-137
SSOP20 package
SSOP20
sot724
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PDF
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SMD MARKING CODE 071 A01
Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods
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Original
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LCC-26P-M09
LCC-28P-M04
LCC-28P-M05
LCC-28P-M06
LCC-28P-M07
LCC-28C-A04
LCC-32P-M03
LCC-40P-M01
LCC-42P-M01
SMD MARKING CODE 071 A01
smd code 38P
LGA 1155 PIN diagram
MARKING CODE SMD IC A08
L QUAD Aluminum nitride
smd marking m05
LGA 1155 Socket PIN diagram
pitch 0.4 QFP 256p
marking code smd fujitsu
Texas Instruments epoxy Sumitomo
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 pin 1 index A A 3 A1 θ Lp L 1 10 w M bp e detail X 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.
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Original
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SSOP20:
OT339-1
MO-150
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 pin 1 index A A 3 A1 θ Lp L 1 10 e detail X w M bp 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.
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Original
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SSOP20:
OT266-1
MO-152
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PDF
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SSOP20-C3
Abstract: No abstract text available
Text: PACKAGE DIMENSIONS SSOP20-C3 Ｇ Ｄ － Ｖ ０ ２ ０ ０ ３ Ａ － ０ UNIT : mm Ver.2008-08-28
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Original
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SSOP20-C3
SSOP20-C3
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PDF
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SSOP20
Abstract: SSOP20 package
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A A 3 A1 pin 1 index θ Lp L 1 10 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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Original
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SSOP20:
OT266-1
SSOP20
SSOP20 package
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PDF
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jedec MO-150
Abstract: MO-150 SSOP20
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A A 3 A1 pin 1 index θ Lp L 1 10 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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Original
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SSOP20:
OT339-1
MO-150
jedec MO-150
MO-150
SSOP20
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PDF
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SSOP20
Abstract: No abstract text available
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A A 3 A1 pin 1 index θ Lp L 1 10 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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Original
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SSOP20:
OT266-1
MO-152
SSOP20
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PDF
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MO-150-AE
Abstract: SOT-339-1
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A A 3 A1 pin 1 index θ Lp L 1 10 w M bp e detail X 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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Original
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SSOP20:
OT339-1
OT339-1
MO-150AE
MO-150-AE
SOT-339-1
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PDF
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20P2F-A
Abstract: SSOP20-P 20P2F
Text: Under development Preliminary specification Specifications in this manual are tentative and subject to change. R8C/14, R8C/15 Group Appendix 1. Package Dimensions 20P2F-A Recommended EIAJ Package Code SSOP20-P-255-0.65 Plastic 20pin 255mil SSOP Weight g –
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Original
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R8C/14,
R8C/15
20P2F-A
SSOP20-P-255-0
20pin
255mil
20P4B
SDIP20-P-300-1
300mil
20P2F-A
SSOP20-P
20P2F
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PDF
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TO-92 Package Dimensions
Abstract: QFP64 package DMP8 Package emp8 Package dimension FFP16-C1 QFP80-C2 SSOP10 Package Vsp8 Package dimension 335max TVSP10
Text: PACKAGE DIMENSIONS DIP8 8.8±0.3 5 1 4 6.4±0.2 8 7.62 2.54 0.46±0.1 2.8MIN 1.0±0.2 0.51MIN 0.74MAX 4.7MAX 1.5±0.2 +0.15 0.25 - 0.05 0 ~ 15º UNIT: mm UNIT: mm PACKAGE DIMENSIONS DIP14 19.0±0.3 8 1 7 6.4±0.2 14 7.62 1.5±0.2 2.54 0.46±0.1 2.8MIN 0.51MIN
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Original
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51MIN
74MAX
DIP14
03MAX
DIP14-D1
32MAX
39MAX
54MIN
06MAX
TO-92 Package Dimensions
QFP64 package
DMP8 Package
emp8 Package dimension
FFP16-C1
QFP80-C2
SSOP10 Package
Vsp8 Package dimension
335max
TVSP10
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PDF
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SSOP20-P-225
Abstract: packing
Text: Tape Packing Specifications Package Type Packing Type Specification Package Appearance Tape Packing Package dimensions unit: mm Appearance Packing Quantity 12.7 Ammo Pack 2000 devices / carton TPE6 18 A SSIP3-P-1.27 TO-92MOD 12.7 4 TE16L 700 devices / reel
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Original
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O-92MOD
TE16L
O-220SM
TE24L
TE12L
SSOP10-P225-1
SSOP-10PIN
SSOP20-P225-1
SSOP-20PIN
SSOP20-P-225
packing
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PDF
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PACKAGE DIMENSIONS
Abstract: SSOP10 SSOP14 SSOP20
Text: PACKAGE DIMENSIONS 3. PACKAGE DIMENSIONS SSOP10 +0.3 3.50 -0.1 0 – 10º 0.5 ±0.2 4.4 ±0.2 6.4 ±0.3 6 10 1 5 0.50 +0.1 0.15 -0.05 0.1 ±0.1 1.15 ±0.1 0.9MAX 0.1 0.2±0.1 0.1 M UNIT :mm SSOP14 +0.3 5.0 - 0.1 0 – 10º 1 0.5±0.2 6.4 ±0.3 4.4±0.2 8 7
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Original
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SSOP10
SSOP14
67MAX
SSOP20
45MAX
SSOP20-B2
FLP10-C1
PACKAGE DIMENSIONS
SSOP10
SSOP14
SSOP20
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PDF
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SSOP20
Abstract: SSOP20 package
Text: PACKAGE DIMENSIONS SSOP20-B2 5.0 +0.3 -0.1 0 ~ 10º 0.5±0.2 6.4±0.3 11 4.4±0.2 20 10 1 0.5 0.15±0.1 0.1±0.1 1.15±0.1 0.4MAX 0.1 0.20±0.1 0.1 M UNIT : mm
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Original
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SSOP20-B2
SSOP20
SSOP20 package
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PDF
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SSOP20
Abstract: SSOP20 package
Text: PACKAGE DIMENSIONS SSOP20 +0.3 6.5 -0.1 1 10 0.5±0.2 11 4.4±0.2 20 6.4±0.3 0 ~ 10º 0.65 +0.1 0.15 -0.05 0.1±0.1 1.15±0.1 0.45MAX 0.1 0.22±0.1 0.1 M UNIT : mm
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Original
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SSOP20
45MAX
SSOP20
SSOP20 package
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PDF
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SSOP20
Abstract: SSOP20 package
Text: PACKAGE DIMENSIONS SSOP20-F1 0 ~ 10º 8.9±0.3 20 0.5±0.2 7.8±0.3 5.4±0.2 11 1 10 0.8 +0.1 0.15 -0.05 0.10 0.36±0.1 0.12 M +0.1 0.05 - 0.05 1.8±0.1 0.85TYP UNIT : mm
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Original
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SSOP20-F1
85TYP
SSOP20
SSOP20 package
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PDF
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TK10487M
Abstract: MFP20 7BRE-7437Z SSOP-20 TK10487 0487M DB3-E025
Text: TK10487M TABLE OF CONTENTS 1.Purpose 2.TOKO Part Number 3.Function 4.Applications 5.Structure 6.Package Outline 7.Absolute Maximum Ratings 8.Electrical Characteristics 9.Test Circuit 10.Pin Assignment Block Diagram 11.Package Outline Dimensions/Marking 12.Cautions
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OCR Scan
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TK10487M
DB3-E025
TK10487M.
TK10487*
QH7-B114.
DP3-F022.
TK10487M
MFP20
7BRE-7437Z
SSOP-20
TK10487
0487M
DB3-E025
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PDF
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LGA-16
Abstract: QFN-20 skyworks LGA16 SKYWORKS SOT-23 6l 118 lga package
Text: Semiconductor Plastic Package Selection Guide ^ CÏ Q. ? 30 PART NUMBER REFERENCE PACKAGE TYPE ACTUAL SIZE PACKAGE DIMENSIONS mm (LEAD INCLUSIVE)* -050 Chip Scale ♦ 0.68 x 0.56 x 0.3 -334 LGA-6 %» 1.5 x 1.2 x 0.8 -079 SC-79 % 1.6 x 0.8 x 0.6 -011 SOD-323
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OCR Scan
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OT-143
SSOP-16
QFN-32
SC-79
OD-323
SC-70
QFN-20
TSSOP-20
SSOP-20
LGA-16
QFN-20 skyworks
LGA16
SKYWORKS SOT-23 6l
118 lga package
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PDF
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DB3-C106
Abstract: compandor SSOP-20 TK10651 TK10651M CCITT p53
Text: TK10651M SPECIFICATION TABLE OF CONTENTS 1.Purpose 2.TOKO Part Number 3.Funct ion 4.Applications 5.Structure 6.Package Out 1ine 7.Absolute Maximum Ratings 8.Electrical Characteristics 9.Test Circuit 10.Pin Assignment 11.Block Diagram 12.Package Outline Dimensions/Marking
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OCR Scan
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TK10651M
DB3-C106
TK10651M.
TK10651*
QH7-B008.
DP3-F022.
DB3-C106
compandor
SSOP-20
TK10651
TK10651M
CCITT p53
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PDF
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