PACKAGE AND THERMAL INFORMATION Search Results

JESD51-2

Abstract: JESD-51 JESD51-9 JESD51-6 G30-88 JESD51-3 JESD51 thermal resistance jesd51 6 SAMSUNG TSOP
Contextual Info: Thermal Characteristics Information 1 Samsung Proprietary • Definition of Thermal Resistance ○ In general, thermal performance of electronic package is represented by two kinds of thermal resistance,θja and θjc. ○ Heat dissipation path in a package and the equivalent thermal resistance

FG676

Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

MS-034-AAn-1

Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

EIA-556-A

Abstract: xilinx packaging label polystyrene EIA-556A
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

ipc-sm-786A

Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

EFTEC-64

Abstract: OPQ0014
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

reflow soldering profile BGA

Abstract: FC-5312
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

Contextual Info: R Q1-2002 DataSource CD-ROM More Information Packages and Thermal Characteristics Packages and Thermal Characteristics Package Drawings Table of Contents Links to individual package drawings Testing, Quality Assurance, and Reliability Quality Assurance and Reliability

hot wire anemometer

Abstract: TA7802 G43-87 THE POWER OF MYTH JESD 51-7, ambient measurement FLUID level measurement kapton 5413 G30-88 G38-87 G42-88
Contextual Info: u Chapter 5 Package Characterization CHAPTER 5 PACKAGE CHARACTERIZATION Introduction Terminology Measurement Methods Thermal Characterization Parameter ψJT Thermal Test Boards Thermal Data Reports Electrical Characterization Methodology Bond Wire Series Inductance and Resistance

"Audio Power Amplifiers"

Abstract: darlington transistor for audio power application Germanium Power Diodes thermal resistance TO metal package aluminum kovar darlington power transistor power led heat sink
Contextual Info: PACKAGE INFORMATION THERMAL DESIGN FOR PLASTIC ICs THERMAL DESIGN FOR PLASTIC INTEGRATED CIRCUITS Proper thermal design is essential for reliable operation of many electronic circuits. Under severe thermal stress, leakage currents increase, materials decompose, and components drift in value or fail.

AUGAT DIP SOCKETS

Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Socket Manufacturers Table 1 lists manufacturers known to offer sockets for Xilinx Package types. This summary does not

shim

Abstract: CR-15 gold embrittlement
Contextual Info: CR-15 Package Handling and Mounting Procedure Introduction Mounting Cavity Design The CR-15 is a high frequency, low thermal resistance package, which should be given special attention during cavity design and package mounting, to insure proper electrical and thermal performance.

Contextual Info: PACKAGE INFORMATION THERMAL DESIGN FOR PLASTIC INTEGRATED CIRCUITS Proper thermal design is essential for reliable operation of many electronic circuits. Under severe thermal stress, leakage currents increase, materials decompose, and components drift in value or fail.

T03A

Abstract: TO-202 transistor mkt 344 Cu50 TRANSISTOR BC 136 MTL 728 MS-026-bcd M03A BD 669 V84A
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages

transistor BC 458

Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and

INTEL740

Abstract: GPI04 md44 MD56 MD57 AB22-AB23 AB24-AB25
Contextual Info: Electrical, Pinout, and Package Information intei Electrical, Pinout, and Package Information This chapter contains Intel740 graphics accelerator absolute maximum ratings, thermal characteristics, and DC characteristics. Pinout and package information are also provided.

UCSP

Abstract: APP3924 MAX9701 MAX9705 MAX9712 MAX9716 MAX9717 MAX9718 MAX9719
Contextual Info: Maxim > App Notes > AUDIO CIRCUITS Keywords: UCSP, Output Power, Thermal Limit, Thermal Shutdown, audio, amplifier Oct 15, 2007 APPLICATION NOTE 3924 Thermal Considerations for a UCSP Package Abstract: The amount of power that an audio amplifier will dissipate is primarily limited by its package and

ASYNC SRAM

Abstract: CY7C1020 CY7C1021 CY7C1021B CY7C1049 CY7C1049B CY7C109 CY7C109B CY7C185 CY7C199
Contextual Info: Thermal Characteristics of SRAMs Introduction This application note introduces thermal characteristics of SRAMs and also provides the thermal values for most of the current SRAMs shipped by Cypress Semiconductor. Thermal resistance is a measure of the ability of a package

SZZA003

Abstract: thermal resistance of low power semiconductor
Contextual Info: Package Thermal Characterization Methodologies Application Report 1999 Printed in U.S.A 0399 SZZA003 Package Thermal Characterization Methodologies SZZA003 March 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products

ocs4

Contextual Info: M80C186EB PACKAGE INFORMATION This section describes the pins, pinouts, and thermal characteristics for the M80C186EB PGA package. For complete package specifications and informa­ tion, see the Intel Packaging Outlines and Dimen­ sions Guide Order Number: 231369 .

Contextual Info: Ecliptek Thermal Resistance - Frequently Asked Questions Rev A 1. What is the definition of 'thermal resistance' of an oscillator package? Thermal resistance is defined as the temperature difference that occurs between the semiconductor element within the package and the package's surface or ambient atmosphere when the device consumes 1 watt [W] of

BGA reflow guide

Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives

"exposed pad" PCB via

Contextual Info: Application Note, Rev. 1.0, November 2008 Thermal Evaluation: Comparison of Standard and Exposed Pad DSO Package Example of SPOC Devices BTS5682E, BTS5672E, BTS5662E Automotive Division by U. Fröhler H. Hopfgartner M. Walder Thermal Evaluation: Standard vs. Exposed Pad DSO Package