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    PACKAGE 12 Search Results

    PACKAGE 12 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE 12 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    pcb design 0,5 mm pitch

    Abstract: PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


    Original     		PDF STD150 pcb design 0,5 mm pitch PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M15 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


    Original     		PDF FPT-48P-M15 48-pin FPT-48P-M15) F48025S-1C-1

    TQFP 80 PACKAGE

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


    Original     		PDF FPT-80P-M15 80-pin FPT-80P-M15) F80028S-1C-1 TQFP 80 PACKAGE

    QFP-120P

    Abstract: 120-pin
    Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M05 EIAJ code :∗QFP120-P-1414-1 120-pin plastic LQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm


    Original     		PDF FPT-120P-M05 QFP120-P-1414-1 120-pin FPT-120P-M05) F120006S-2C-3 QFP-120P

    TQFP120

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M17 EIAJ code :∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape


    Original     		PDF FPT-120P-M17 TQFP120-P-1414-1 120-pin FPT-120P-M17) F120022S-1C-3 TQFP120

    120 M13

    Abstract: FPT-120P-M13 QFP120 QFP120-P-2020-1
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M13 EIAJ code :∗QFP120-P-2020-1 120-pin plastic QFP Lead pitch 0.50 mm Package width x package length 20 × 20 mm Lead shape Gullwing


    Original     		PDF FPT-120P-M13 QFP120-P-2020-1 120-pin FPT-120P-M13) F120013S-2C-3 120 M13 FPT-120P-M13 QFP120 QFP120-P-2020-1

    Untitled

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


    Original     		PDF FPT-100P-M18 100-pin FPT-100P-M18) F100029S-1C-1

    FPT-120P-M04

    Abstract: QFP120
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M04 EIAJ code :∗QFP120-P-2828-4 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing


    Original     		PDF FPT-120P-M04 QFP120-P-2828-4 120-pin FPT-120P-M04) F120005S-3C-2 FPT-120P-M04 QFP120

    Untitled

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS096 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty CD40105BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU


    Original     		PDF SCHS096 12-Jan-2006 CD40105BE CD40105BF CD40105BF3A

    CZ12

    Abstract: CZ16 12-pin
    Text: At a glance IP425xCZ8-4/CZ12-6/CZ16-8 Package Ultra Thin Leadless Package UTLP - HXSON12: plastic thermal enhanced extremely thin small outline package; 12 terminals; body 1.35 x 2.5 x 0.5 mm QFN compatible plastic package with 0.4 mm pitch Applications


    Original     		PDF IP425xCZ8-4/CZ12-6/CZ16-8 HXSON12: IP425xCZ8/CZ12/CZ16: CZ12-6 12-pin CZ16-8 IP4252 IP4251 CZ12 CZ16 12-pin

    Untitled

    Abstract: No abstract text available
    Text: SBOS175 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 4213AM NRND TO-100 LME 4213AM2 OBSOLETE TO-99 LMC 8 4213BM NRND TO-100 LME 10 4213BM1 OBSOLETE


    Original     		PDF SBOS175 12-Jan-2006 4213AM 4213AM2 4213BM 4213BM1 4213SM O-100 O-100

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9861101Q2A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type


    Original     		PDF 12-Jan-2006 5962-9861101Q2A 5962-9861101QCA 5962-9861101QDA SN54128J SN74128D

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-87621012A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type


    Original     		PDF 12-Jan-2006 962-87621012A 5962-8762101EA 5962-8762101FA SN54LS592J SN54LS593J

    SN74LS138N

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 76005012A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type 7600501EA


    Original     		PDF 12-Jan-2006 6005012A 7600501EA 7600501FA 6041012A 7604101EA SN74LS138N

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-86717012A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type


    Original     		PDF 12-Jan-2006 962-86717012A 5962-8671701EA 5962-8671701FA SN54LS595J SN74LS595D

    Untitled

    Abstract: No abstract text available
    Text: SILICON PIN DIODES Selection guide SILICON PIN DIODES Selection Guide PAGE HOW TO SPECIFY A PIN DIODE? 12-5 SURFACE MOUNT PACKAGE - PLASTIC PACKAGE SWITCHING SILICON PIN DIODES 12-6 - PLASTIC PACKAGE ATTENUATING SILICON PIN DIODES 12-8 - LOW COST SQUARE CERAMIC PACKAGE PIN DIODES


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 84151012A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type 8415101RA


    Original     		PDF 12-Jan-2006 4151012A 8415101RA 8415101SA 4152012A 8415201RA 8415201SA 4153012A

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-86717012A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type


    Original     		PDF 12-Jan-2006 962-86717012A 5962-8671701EA 5962-8671701FA SN54LS595J SN74LS595D

    Untitled

    Abstract: No abstract text available
    Text: MMSZ4688 5% TOLERANCE General Description: Features: Half watt, General purpose, Medium Current Surface Mount Zener in the SOD-123 package. The SOD-123 package has the same footprint as the glass mini-melf LL-34 package & provides a convenient alternative to the Leadless package.


    Original     		PDF MMSZ4688 OD-123 LL-34)

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) JM38510/30602B2A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type


    Original     		PDF 12-Jan-2006 JM38510/30602B2A JM38510/30602BEA JM38510/30602BFA SN54195J SN54LS195AJ

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) JM38510/30109B2A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type


    Original     		PDF 12-Jan-2006 JM38510/30109B2A JM38510/30109BEA JM38510/30109BFA JM38510/30109SEA JM38510/30109SFA

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 17-May-2014 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) TBD Call TI Call TI -55 to 125 Device Marking (4/5)


    Original     		PDF 17-May-2014 962-87809012A 5962-8780901RA SNJ54HC640J SN54HC640J SN54HC645J SN74HC640DW

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 JM38510/00903BCA OBSOLETE CDIP J 14 TBD Call TI Call TI JM38510/30605B2A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type Package Type Package Drawing Pins Package Eco Plan (2)


    Original     		PDF 12-Jan-2006 JM38510/00903BCA JM38510/30605B2A JM38510/30605BCA JM38510/30605BDA JM38510/30605SCA

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type 7604001EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type 7604001FA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type Package Drawing Pins Package Eco Plan (2)


    Original     		PDF 12-Jan-2006 7604001EA 7604001FA JM38510/07601BEA JM38510/07601BFA JM38510/30601B2A