QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 20; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.51 x 2.4; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 20; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.51 x 2.4; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type C; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 21; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.4 x 2.2; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type C; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 21; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.4 x 2.2; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 20; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.1 x 2.5; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type C; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 20; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.1 x 2.5; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type C; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 20; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.1 x 2.5; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 20; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.1 x 2.5; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 20; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.1 x 2.5; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type C; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 20; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.4 x 2.2; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 20; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.1 x 2.5; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 20 x 20; Top Interface: Clam Shell ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.1 x 2.5; Part Description: QFP Prototyping Adapter;
QFP (w/SMT Lands) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type C; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 3; Top Interface: Surface Mount Lands; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (in.): 0.5; Land Pattern InsideX (in.): 1.08; Land Pattern OutsideX (in.): 1.24; Land Pattern InsideY (in.): 1.08; Land Pattern OutsideY (in.): 1.24; Adapter Size Length X Width (in.): 1.4 x 3; Part Description: QFP Prototyping Adapter;
QFP (w/SMT Lands) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type C; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 3; Top Interface: Surface Mount Lands; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (in.): 0.5; Land Pattern InsideX (in.): 1.08; Land Pattern OutsideX (in.): 1.24; Land Pattern InsideY (in.): 1.08; Land Pattern OutsideY (in.): 1.24; Adapter Size Length X Width (in.): 1.4 x 3; Part Description: QFP Prototyping Adapter;
QFP (w/SMT Lands) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type C; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 2.2; Top Interface: Surface Mount Lands; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (in.): 0.5; Land Pattern InsideX (in.): 1.08; Land Pattern OutsideX (in.): 1.24; Land Pattern InsideY (in.): 1.08; Land Pattern OutsideY (in.): 1.24; Adapter Size Length X Width (in.): 1.8 x 2.2; Part Description: QFP Prototyping Adapter;
QFP (w/SMT Lands) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type C; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 2.2; Top Interface: Surface Mount Lands; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (in.): 0.5; Land Pattern InsideX (in.): 1.08; Land Pattern OutsideX (in.): 1.24; Land Pattern InsideY (in.): 1.08; Land Pattern OutsideY (in.): 1.24; Adapter Size Length X Width (in.): 1.8 x 2.2; Part Description: QFP Prototyping Adapter;
QFP (w/SMT Lands) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 2.1; Top Interface: Surface Mount Lands; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (in.): 0.5; Land Pattern InsideX (in.): 1.115; Land Pattern OutsideX (in.): 1.255; Land Pattern InsideY (in.): 1.115; Land Pattern OutsideY (in.): 1.255; Adapter Size Length X Width (in.): 2.1 x 2.1; Part Description: QFP Prototyping Adapter;
QFP (w/SMT Lands) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 2.1; Top Interface: Surface Mount Lands; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (in.): 0.5; Land Pattern InsideX (in.): 1.115; Land Pattern OutsideX (in.): 1.255; Land Pattern InsideY (in.): 1.115; Land Pattern OutsideY (in.): 1.255; Adapter Size Length X Width (in.): 2.1 x 2.1; Part Description: QFP Prototyping Adapter;
QFP (w/ZIF Sockets) Prototyping Adapters; Top Package Code: QFE208SB; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.5; Bottom Pitch (mm): 2.54; Top Pin Count: 208; Bottom Pin Count: 208; Bottom Array Size: 21 x 21; Top Interface: Open Top ZIF Socket; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (mm): 30.6; Devices Supported: N/A; Adapter Size Length X Width (in.): 2.3 x 2.3; Part Description: QFP Prototyping Adapter;