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    OZ 9966 Search Results

    OZ 9966 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TW9966AT-LC1-GRT Renesas Electronics Corporation 4-Channel Analog Video Decoders and Analog Video Encoder for Automotive Applications Visit Renesas Electronics Corporation
    TW9966AT-LC1-GR Renesas Electronics Corporation 4-Channel Analog Video Decoders and Analog Video Encoder for Automotive Applications Visit Renesas Electronics Corporation
    67996-620 Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch Visit Amphenol Communications Solutions
    51939-966LF Amphenol Communications Solutions PwrBlade®, Power Connectors, 1P 8S 1P Right Angle Header, Solder To Board Visit Amphenol Communications Solutions
    67996-606 Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch Visit Amphenol Communications Solutions

    OZ 9966 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: 14-4904-18 REPLACEMENT FOR SN74LS12 DIP 14 PACKAGE FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		PDF SN74LS12 C36000 ASTM-B16085 MIL-P-81728 QQN-290.

    Untitled

    Abstract: No abstract text available
    Text: 14-4904-18 REPLACEMENT FOR SN74LS12 DIP 14 PACKAGE FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		PDF SN74LS12 C36000 ASTM-B16085 MIL-T-10727 MIL-P-81728 QQ-N-290.

    OZ 9966

    Abstract: No abstract text available
    Text: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		PDF C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. OZ 9966

    Untitled

    Abstract: No abstract text available
    Text: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		PDF 24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290.

    75als162

    Abstract: OZ 9966 18071
    Text: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		PDF 24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. OZ 9966 18071

    Untitled

    Abstract: No abstract text available
    Text: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		PDF C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290.

    Untitled

    Abstract: No abstract text available
    Text: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		PDF MC68HC11E9 C36000 ASTM-B16-00. SAEAMS-QQ-N-290.

    MC68HC11E9

    Abstract: No abstract text available
    Text: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		PDF MC68HC11E9 C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290.

    Untitled

    Abstract: No abstract text available
    Text: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		PDF C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290.

    sdip-29

    Abstract: amp plcc socket dsip
    Text: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		PDF MC68HC11E9 C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. sdip-29 amp plcc socket dsip

    Untitled

    Abstract: No abstract text available
    Text: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		PDF 24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290.

    Untitled

    Abstract: No abstract text available
    Text: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		PDF 24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290.

    Untitled

    Abstract: No abstract text available
    Text: ADAPTER FOR MOTOROLA MC145158-2 FROM 16 PIN SOIC DW PACKAGE TO PLCC 20 PIN PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		PDF MC145158-2 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. 20-301550-X0 1112610-T 1112578-T 1112610-T

    Untitled

    Abstract: No abstract text available
    Text: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		PDF C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290.

    Untitled

    Abstract: No abstract text available
    Text: 4121-106-18-N 64 PIN .5MM TQFP TO .65MM QFP ADAPTER FEATURES: • A cost effective means of upgrading without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		PDF 4121-106-18-N C36000 ASTM-B16085 MIL-P-81728 QQN-290.

    sdip-29

    Abstract: No abstract text available
    Text: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		PDF MC68HC11E9 C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. sdip-29

    Untitled

    Abstract: No abstract text available
    Text: ADAPTER FOR MOTOROLA MC145158-2 FROM 16 PIN SOIC DW PACKAGE TO PLCC 20 PIN PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		PDF MC145158-2 C36000 ASTM-B-16-00. SAE-AMS-QQ-N-290. 20-301550-X0 1112610-T 1112578-T 1112610-T

    Untitled

    Abstract: No abstract text available
    Text: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		PDF C36000 ASTM-B-16-00. SAE-AMS-QQ-N-290.

    OZ 9966

    Abstract: No abstract text available
    Text: 1111841-X .5MM 8 AND 10 PIN MSOP TO .3 DIP ADAPTERS FEATURES: • A cost effective means of upgrading to MSOP .5MM package SOIC. without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		PDF 1111841-X C36000 ASTM-B16085 MIL-T-10727 MIL-P-81728 QQ-N-290. OZ 9966

    Untitled

    Abstract: No abstract text available
    Text: ADAPTER FOR MOTOROLA MC145158-2 FROM PLCC 20 PIN FN PACKAGE TO SOIC DW PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		PDF MC145158-2 C36000 ASTM-B-16-85. MIL-P-81728 QQN-290. 20-301550-X0 1109639-T 1109901-T

    OZ 9966

    Abstract: QQN-290
    Text: 1111841-X .5MM 8 AND 10 PIN MSOP TO .3 DIP ADAPTERS FEATURES: • A cost effective means of upgrading to MSOP .5MM package SOIC. without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		PDF 1111841-X C36000 ASTM-B16085 MIL-P-81728 QQN-290. OZ 9966 QQN-290

    OZ 9966

    Abstract: MC12009
    Text: 16-304633-18 20 PIN PLCC TO 16 PIN DIP ADAPTER FOR MOTOROLA MC12009 AND OTHERS FEATURES: • A cost effective means of upgrading to PLCC Package without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		PDF MC12009 C36000 ASTM-B-16-85. MIL-P-81728 QQ-N-290. OZ 9966

    Aromat hb2e

    Abstract: hb2e AROMAT HB2E RELAY aromat
    Text: 08-305984-10 Adapter for Replacing Old Aromat HB2E Relay w/ SM Type TXSS FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		PDF C36000 ASTM-B16085 MIL-P-81728 QQN-290. Aromat hb2e hb2e AROMAT HB2E RELAY aromat

    hb2e

    Abstract: Aromat relay pcb layout Aromat relay hb2e AROMAT HB2E RELAY AROMAT
    Text: 08-305984-10 Adapter for Replacing Old Aromat HB2E Relay w/ SM Type TXSS FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		PDF C36000 ASTM-B16085 MIL-P-81728 QQN-290. hb2e Aromat relay pcb layout Aromat relay hb2e AROMAT HB2E RELAY AROMAT