O2 MARKING Search Results

3D7105

Abstract: tapped SOIC-16
Contextual Info: 3D7105 MONOLITHIC 5-TAP FIXED DELAY LINE SERIES 3D7105 FEATURES • • • • • • • • • • • • PACKAGES IN 1 8 VDD All-silicon, low-power CMOS VDD IN 1 8 VDD IN 1 14 O2 2 7 O1 technology O4 3 6 O3 O1 O2 2 7 N/C N/C 2 13 GND 4 5 O5 TTL/CMOS compatible

Contextual Info: 3D7105 MONOLITHIC 5-TAP FIXED DELAY LINE SERIES 3D7105 FEATURES • • • • • • • • • • • • PACKAGES IN 1 8 VDD All-silicon, low-power CMOS VDD IN 1 8 VDD IN 1 14 O2 2 7 O1 technology O4 3 6 O3 O1 O2 2 7 N/C N/C 2 13 GND 4 5 O5 TTL/CMOS compatible

Contextual Info: 3D7105 MONOLITHIC 5-TAP FIXED DELAY LINE SERIES 3D7105 FEATURES • • • • • • • • • • • • PACKAGES IN 1 8 VDD All-silicon, low-power CMOS VDD IN 1 8 VDD IN 1 14 O2 2 7 O1 technology O4 3 6 O3 O1 O2 2 7 N/C N/C 2 13 GND 4 5 O5 TTL/CMOS compatible

3D7105

Abstract: SOIC-16
Contextual Info: 3D7105 MONOLITHIC 5-TAP FIXED DELAY LINE SERIES 3D7105 FEATURES x x x x x x x x x x x x PACKAGES IN 1 8 VDD All-silicon, low-power CMOS VDD IN 1 8 VDD IN 1 14 O2 2 7 O1 technology O3 O4 3 6 O1 O2 2 7 N/C N/C 2 13 GND 4 5 O5 TTL/CMOS compatible O3 O4 3 6

Contextual Info: SIEMENS • âE3SL05 000^427 74D Silicon Variable Capacitance Diode BB 419 • For VHF tuned circuit applications Type Marking Ordering Code tape and reel BB 419 white 2 Q62702-B499 Pin Configuration Package1) SOD-123 ky- o2 1 i^ i o -1

CM508

Abstract: cmos single chip camera driver kic 125 M38277M8 marking code P60 mitsubishi machine instruction 740 family Mitsubishi part numbering three and half digit 7 SEGMENT LCD DISPLAY DSA003633
Contextual Info: MITSUBISHI MICROCOMPUTERS 3827 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER ●Serial I/O1 . 8-bit ✕ 1 UART or Clock-synchronized ●Serial I/O2 .8-bit ✕ 1 (Clock-synchronized) ●PWM output . 8-bit ✕ 1

Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW THICK FILM R-NETWORK CONCAVE TERMINATIONS CN STRUCTURE 1 2 3 4 5 6 Ceramic substrate Ag / Pd Ru O2 Glass Ni / Solder plating Epoxy overcoating IDENTIFICATION COATING COLOR TYPE CN MARKING Black White, 3 digits TYPE DESIGNATION HOW TO ORDER

SMD MARKING CODE

Abstract: SMD MARKING CODE 39 ALL SMD CODe smd marking IL Resonators SMD marking marking code 39 SMD MARKING CODE saw smd marking 31 ROC434D52-OG SMD rob
Contextual Info: SAW Resonators RO Series ¡iSMD 5x5¡j System Center Freq. MHz IL(Typ.) (dB) Tolerance (KHz) Part Number Package Marking Code Remote 303.825 1.50 ¡Ó75 ROC303D82-O1 SMD 5x5 RO1 Remote 303.875 1.50 ¡Ó75 ROC303D87-O2 SMD 5x5 RO2 Remote 315.00 1.50 ¡Ó75

Contextual Info: MOTOROLA Order this document by BAW56LT1/D SEMICONDUCTOR TECHNICAL DATA M onolithic Dual Switching Diode Common Anode BAW56LT1 Motorola Preferred Device CATHODE ►I ANODE 3 O1 — O2 CATHODE MAXIMUM RATINGS EACH DIODE Rating Symbol Value Unit Reverse Voltage

CN1E2

Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW THICK FILM R-NETWORK CONVEX TERMINATIONS CN-K • CN-A STRUCTURE 1 2 3 4 5 6 Ceramic substrate Ag / Pd Ru O2 Glass Ni / Sn - Pb Sn : Pb = 90:10 Glass overcoating IDENTIFICATION TYPE BODY COLOR MARKING CN1E CN1J, CN2A, CN2B

CN1J

Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW THICK FILM R-NETWORK CONCAVE TERMINATIONS CN STRUCTURE 1 2 3 4 5 6 Ceramic substrate Ag / Pd Ru O2 Glass Ni / Sn - Pb 90:10 Epoxy overcoating IDENTIFICATION COATING COLOR TYPE CN MARKING Black White, 3 digits TYPE DESIGNATION (HOW TO ORDER)

Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS SINGLE COMMON CNB STRUCTURE 1 2 3 4 5 6 Ceramic substrate Ag / Pd Ru O2 Glass Ni / Solder plating Glass layer CNB2B5Z IDENTIFICATION #1 TYPE COATING COLOR MARKING CNB Black White, 3 digits „•” marks pin #1

AC125G

Contextual Info: SLV74AC125 Quad Buffer with 3-State Outputs Features • Outputs Source/Sink • AEC−Q100 Qualified and PPAP Capable Grade 3 • These Devices are Pb−Free and are RoHS Compliant http://onsemi.com MARKING DIAGRAMS 14 1 VCC A2 B2 O2 A3 B3 O3 14 13 12 11

Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS SINGLE COMMON CNB STRUCTURE 1 2 3 4 5 6 Ceramic substrate Ag / Pd Ru O2 Glass Ni / Sn - Pb Sn:Pb=90:10 Glass layer CNB2B5Z IDENTIFICATION #1 TYPE COATING COLOR MARKING CNB Black White, 3 digits + mark für pin #1

CN1E2

Abstract: CN1E4 CN1J4 CN1j
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW THICK FILM R-NETWORK CONVEX TERMINATIONS CN-K • CN-A STRUCTURE 1 2 3 4 5 6 Ceramic substrate 96% Al2O3 Ag / Pd Ru O2 Glass Ni / Solder plating Glass overcoating (CN1F8 = epoxy overcoating) IDENTIFICATION TYPE BODY COLOR

LVDS to MIPI DSI

Abstract: MIPI DSI to lvds mipi DSI LCD controller MDDI to MIPI datasheet ci 666 MIPI Specification MIPI DSI MIPI DSI lvds MIPI DSI Device Controller 4F2 diode
Contextual Info: DSILC6-4xx ESD Protection for high speed interface Main applications I/O3 VCC Where transient over-voltage protection in ESD sensitive equipment is required, such as: • ■ ■ ■ ■ I/O4 I/O2 GND I/O1 Computers Printers Communication systems Cell phone handsets and accessories

dsilc6-4xx

Abstract: kv 21 fs 140 4F2 diode SMIA cell phone camera SMP75-8
Contextual Info: DSILC6-4xx ESD Protection for high speed interface Main applications I/O3 VCC Where transient over-voltage protection in ESD sensitive equipment is required, such as: • ■ ■ ■ ■ I/O4 I/O2 GND I/O1 Computers Printers Communication systems Cell phone handsets and accessories

Contextual Info: 1SS394 TOSHIBA TOSHIBA DIODE HIGH SPEED SWITCHING APPLICATION SILICON EPITAXIAL SCHOTTKY BARRIER TYPE 1SS394 Unit in mm + 2.5 - 0.5 0.3 + 0.25 1.5 - 0 .15 , Small Package Low Forward Voltage : Vp 2 —0.23V (Typ.) @Ip = 5mA —Q o o + i Ü - -o2 MAXIMUM RATINGS (Ta = 25°C)

Contextual Info: EEPROM AS8ER128K32 Austin Semiconductor, Inc. 128K x 32 EEPROM PIN ASSIGNMENT Radiation Tolerant EEPROM Memory Array Top View RES\ A0 A1 A2 A3 A4 A5 CS3\ GND CS4\ WE1\ A6 A7 A8 A9 A10 Vcc 68 Lead CQFP AVAILABLE AS MILITARY SPECIFICATIONS • I/O0 I/O1 I/O2

act125g

Abstract: AC125G MC74ACT125DG 74AC ACT125 MC74AC125 MC74AC125D MC74AC125N MC74AC125NG MC74ACT125
Contextual Info: MC74AC125, MC74ACT125 Quad Buffer with 3−State Outputs Features • Outputs Source/Sink • ′ACT125 Has TTL Compatible Inputs • Pb−Free Packages are Available* http://onsemi.com VCC A2 B2 O2 A3 B3 O3 14 13 12 11 10 9 8 PDIP−14 N SUFFIX CASE 646 14

Contextual Info: DSILC6-4xx ESD Protection for high speed interface Main applications I/O3 VCC Where transient over-voltage protection in ESD sensitive equipment is required, such as: • ■ ■ ■ ■ I/O4 I/O2 GND I/O1 Computers Printers Communication systems Cell phone handsets and accessories

Contextual Info: EEPROM AS8ER128K32 Austin Semiconductor, Inc. 128K x 32 EEPROM PIN ASSIGNMENT Radiation Tolerant EEPROM Memory Array Top View RES\ A0 A1 A2 A3 A4 A5 CS3\ GND CS4\ WE1\ A6 A7 A8 A9 A10 Vcc 68 Lead CQFP AVAILABLE AS MILITARY SPECIFICATIONS • I/O0 I/O1 I/O2

AC125G

Abstract: act125g 74AC ACT125 MC74AC125 MC74AC125D MC74AC125N MC74AC125NG MC74ACT125 MC74ACT125DTR2G
Contextual Info: MC74AC125, MC74ACT125 Quad Buffer with 3−State Outputs Features • Outputs Source/Sink • ′ACT125 Has TTL Compatible Inputs • Pb−Free Packages are Available http://onsemi.com VCC A2 B2 O2 A3 B3 O3 14 13 12 11 10 9 8 PDIP−14 N SUFFIX CASE 646 14

act125g

Abstract: AC125G
Contextual Info: MC74AC125, MC74ACT125 Quad Buffer with 3-State Outputs Features • Outputs Source/Sink • ′ACT125 Has TTL Compatible Inputs • Pb−Free Packages are Available http://onsemi.com VCC A2 B2 O2 A3 B3 O3 14 13 12 11 10 9 8 PDIP−14 N SUFFIX CASE 646 14 1