Infineon technology roadmap for mosfet
Abstract: LFPAK88 Acbel schematic diagram switching power supply BLDC TRW schematic diagram inverter air conditioner schematic diagram for split air conditioner TRIAC 20A 600V inverter schematic ims 1600 triac 4A, 600V, 5mA triac 0,8A, 600V, 5mA
Text: NXP PowerMOS, BIPOLAR and Motor Control Smaller, Faster, Cooler June 05, 2014 Nicolas Rescanieres Field Application Engineer South of France NXP PowerMOS 1 Agenda MosFET in automotive and industrial Bipolar Motor Control Agenda MosFET in automotive and industrial
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KMZ60
KMA210
KMA215
Infineon technology roadmap for mosfet
LFPAK88
Acbel schematic diagram switching power supply
BLDC TRW
schematic diagram inverter air conditioner
schematic diagram for split air conditioner
TRIAC 20A 600V
inverter schematic ims 1600
triac 4A, 600V, 5mA
triac 0,8A, 600V, 5mA
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Untitled
Abstract: No abstract text available
Text: Powering Cortex M0 MCUs with NXP LDOs Ultra small, highly effective power supplies for driving Cortex M0 microcontrollers NXP’s low dropout regulators LDOs are ideal for powering microcontrollers in many applications. In particular, our advanced linear portfolio is optimized for applications with
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NX1117
LD6835
LD6815
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HDMI to ethernet chip
Abstract: dfn2510 lvds displayport IP4786 LVDS to hdmi IP4786CZ32 USB3 esd protection HDMI to USB3.0 chip DFN2110-9 DFN5050-32
Text: NXP solutions for consumer and computing interfaces Best-in-class protection and signal conditioning As the leading supplier of ESD protection ICs, NXP now offers ESD and surge protection, as well as signal conditioning, with added features such as level shifting. Designed for today’s most
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LFPAK footprint
Abstract: PowerPAK 1212-8 stencil LFPAK footprint Renesas PSMN8R2-80YS POWERPAK SO8 LFPAK56 DFN 3.3X3.3 PSMN7R0-30MLC PSMN012-60YS SOT223 nxp
Text: Ultra-reliable LFPAK56 and LFPAK33 Tougher just got smaller NXP’s LFPAK – Designed for reliability Designing a complex automotive system, a high efficiency industrial power supply or a slimline portable PC ? NXP has a range of smaller, faster, cooler MOSFETs to help you deliver maximum reliability.
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LFPAK56
LFPAK33
LFPAK56,
LFPAK footprint
PowerPAK 1212-8 stencil
LFPAK footprint Renesas
PSMN8R2-80YS
POWERPAK SO8
DFN 3.3X3.3
PSMN7R0-30MLC
PSMN012-60YS
SOT223 nxp
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prtr5v0u6s
Abstract: csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY
Text: Dark Green − NXP‘s transfer to halogen-free products Why Dark Green? We as NXP are deeply committed to developing eco-friendly products and integrating environmental safety aspects in all manufacturing processes. For our packaging technology this meant a shift to lead-free and halogen-free “Dark Green”, years
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2002/95/EC.
PMBTA42
PMEG3005EL
PMEG6010EP
PMR780SN
PTVS12VS1UR
PZU13y
PMBTA42DS
PMEG3005ET
PMEG6010ER
prtr5v0u6s
csp1040
TSSOP20 FOOTPRINT
ip4065cx11
smd transistor GY sot89
IP4065CX11/LF
BV 9y transistor smd
IP4058CX8/LF
IP4280CZ10
smd transistor GY
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circuit diagram wireless spy camera
Abstract: PDTB123Y IP4303CX4 dual cc BAW62 3267 tsop6 PCMF2DFN1 BST60 PUMD4 PDTB123E PDTA143
Text: Discrete Semiconductors Selection Guide 2014 Protection and signal conditioning devices, diodes, bipolar transistors, MOSFETs and thyristors. NXP’s next generation of packaging DFN Discrete Flat No-lead packages – high performance on smallest footprint
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DFN1006D-2
OD882D)
DFN1010D-3
OT1215)
DFN2020MD-6
OT1220)
DFN1608D-2
OD1608)
DSN0603
OD962)
circuit diagram wireless spy camera
PDTB123Y
IP4303CX4
dual cc BAW62
3267 tsop6
PCMF2DFN1
BST60
PUMD4
PDTB123E
PDTA143
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SOD962
Abstract: DFN1006B-3 DFN1410-6 DFN2510 SOT1157 DFN1608D-2 DFN1006 SOT1061 SOT891 SOD-16
Text: 120412-A3-NXP-Poster_DFN_RZ:Layout 1 12.04.2012 17:41 Seite 1 Our extensive Discrete Flat No-leads portfolio Ultra small >> Medium power >> 2 Pins The first DFN packages with solderable side pads DSN0603-2* DFN1006D-2 DFN1006-2 SOD962 (SOD882D) (SOD882)
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DSN0603-2*
OD962)
DFN1006D-2
OD882D)
DFN1006-2
OD882)
DFN1608D-2
OD1608)
DFN1006B-3
OT883B)
SOD962
DFN1006B-3
DFN1410-6
DFN2510
SOT1157
DFN1608D-2
DFN1006
SOT1061
SOT891
SOD-16
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WLCSP24
Abstract: sot663 sot23 SOT886 SOD123W sod962 DFN5050 sot1194 SOD-128 SOD-16
Text: 230312-A3-NXP-Poster_General_RZ:Layout 1 26.03.2012 16:10 Seite 1 Our extensive package range provides maximum flexibility Very small Small Medium power 2 Pins Ultra small SOD962 WLCSP2 SOD882D SOD882 SOD523 SOD1608 DSN0603-2 0.7 x 0.52 x 0.4 (DFN1006D-2)
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OD962
DSN0603-2)
OD882D
DFN1006D-2)
OD882
DFN1006-2)
OD523
OD1608
DFN1608D-2)
OD323
WLCSP24
sot663 sot23
SOT886
SOD123W
sod962
DFN5050
sot1194
SOD-128
SOD-16
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TL431 SOT323
Abstract: No abstract text available
Text: AN11045 Next generation of NXP low VCEsat transistors: improved technology for discrete semiconductors Rev. 3 — 28 February 2013 Application note Document information Info Content Keywords Breakthrough In Small Signal BISS transistor, low VCEsat, load switch,
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AN11045
TL431 SOT323
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NX3008NBKMB
Abstract: IP4303CX4 PCMF2DFN1
Text: Safeguard sensitive ICs - Increase battery life - Save space With NXP key products as recommended in this brochure Interface / Function Description Product type Package NFC antenna protection 18 / 24 V Birectional low capacitance ESD protection diode PESD18VF1BL
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PESD18VF1BL
PESD24VF1BL
PESD18VF1BSF
PESD24VF1BSF
DFN1006
DSN0603
DFN2520
DFN4020
NX3008NBKMB
IP4303CX4
PCMF2DFN1
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IP4223CZ6
Abstract: power one pmp 7.24 IP4058CX8/LF ip4065cx11 IP4056CX8/LF 2 x 40w amplifier DIODE BAT86 replacement BAS85 Spice KEC SOT-23 bav99 IP4059CX5/LF
Text: NXP has fully embraced ecological and environmental issues, from maintaining certified environmental management systems General Applications selection guide 2008 to communicating our environmental policy to employees and other stakeholders. Extending this ‘profitable green’ ideal to our
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OD882
OT883
PVR100AD-B12V
PVR100AD-B2V5
PVR100AD-B3V0
PVR100AD-B3V3
PVR100AD-B5V0
PVR100AZ-B12V
PVR100AZ-B2V5
PVR100AZ-B3V0
IP4223CZ6
power one pmp 7.24
IP4058CX8/LF
ip4065cx11
IP4056CX8/LF
2 x 40w amplifier
DIODE BAT86 replacement
BAS85 Spice
KEC SOT-23 bav99
IP4059CX5/LF
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PQMD12
Abstract: No abstract text available
Text: Small & Powerful NXP MOSFETs and bipolar transistors in DFN1010 First 3 A transistors in a 1.1 mm² leadless plastic package This new product series, housed in tiny leadless packages and ideal for use in tightfootprint power management and load switches, includes small yet powerful high-Ptot
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DFN1010
OT963
DFN1010B-6
DFN0806
PQMD12
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NXP PN544 user manual
Abstract: PN544 user manual NXP PN544 PN544 PN544 NFC controller data sheet nfc PN544 NXP PN544 Antenna Design Guide PN544 NFC controller nxp pn544 antenna design PN544 hardware design guide
Text: Application guide Portable devices and mobile handsets Introduction Your partner for portable devices and mobile handsets NXP Semiconductors is a recognized leader in portable and mobile applications. We offer a comprehensive portfolio of best-in-class solutions
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Abstract: No abstract text available
Text: NXP NFC antenna protection diodes PESD18VF1BL and PESD18VF1BSF High-performance, small form-factor devices protect the NFC antenna The best ESD protection for NFC systems - from the global leader in ESD protection and Near-Field Communication NFC . Features
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PESD18VF1BL
PESD18VF1BSF
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Abstract: No abstract text available
Text: NXP low VF Schottky rectifier single & dual in DFN2020-3 1 and 2 A Schottky rectifiers in leadless medium-power package These low VF Schottky rectifiers, the first to be housed in the leadless medium-power DFN2020-3 (SOT1061) package, offer high forward current capability with low forward
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DFN2020-3
OT1061)
AEC-Q101
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Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of DFN2520-9 package SOT1333-1 D1 9x C (8x) Ay solder land occupied area P1 DIMENSIONS in mm P1 Ay C D1 0.50 2.30 1.07 0.30 www.nxp.com Dimensions in mm 2010 NXP B.V. 13-05-08 13-05-21
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DFN2520-9
OT1333-1
sot1333-1
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Untitled
Abstract: No abstract text available
Text: Standard Linear Products NXP_05_0217_Update Standard Linear Catalogue_939775017369.indd 1 05/12/12 12:10 Mid-voltage Low-voltage The Standard Linear Portfolio NXP’s standard linear portfolio for low-voltage applications Low-voltage LDOs High frequency DC/DC solutions
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Abstract: No abstract text available
Text: AN10909 Low VCEsat transistors in medium power load switch applications Rev. 2 — 13 March 2013 Application note Document information Info Content Keywords NXP low VCEsat transistors, performance in load switch applications Abstract Different low VCEsat transistors in load switch applications. Evaluation of
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AN10909
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BZA456A
Abstract: PCMF2DFN1
Text: Application guide: ESD protection For automotive and industrial applications: car infotainment, body control modules, video cameras, industrial computers and test&measurement equipment Introduction NXP – your partner for ESD protection ESD protection has been a topic of concern for electronic system design for
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NXP PN65n
Abstract: NXP PN544 PN544 hardware design guide NXP PN544 Antenna Design Guide nfc PN65N PN544 PN544 NFC controller nxp pn544 antenna design PN544 NFC PN544 nxp
Text: Application guide Portable devices and mobile handsets Enhancing the user experience, simplifying the design Introduction Your partner for portable devices and mobile handsets NXP Semiconductors is a recognized leader in portable and mobile applications. We offer a comprehensive portfolio of best-in-class solutions
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IP4294
Abstract: DFN2510A-10 sot1176
Text: NXP ESD protection device IP4294CZ10 ESD protection for USB 3.0 SuperSpeed USB and eSATA data lines Designed to protect even the most sensitive high-speed differential interfaces, this device delivers a unique combination of strong system-level ESD protection with an extremely low «line-to-ground»
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IP4294CZ10
DFN2510A-10
OT1176)
IP4294
DFN2510A-10
sot1176
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Slp1006P2
Abstract: dfn1006 SOD882 BAS16LD DFN1006H4-2L LLP1006-2L SOD882D PESD5V0S1BLD
Text: NXP SOD882D package with strong, visible side pads First leadless package with tin-plated, solderable side pads This new, ultra-small leadless plastic package is the industry’s first to offer solderable side pads. it measures only 1.0 x 0.6 x 0.37 mm and delivers very high mechanical stability.
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OD882D
AEC-Q101
OD882
Slp1006P2
dfn1006
SOD882
BAS16LD
DFN1006H4-2L
LLP1006-2L
SOD882D
PESD5V0S1BLD
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Untitled
Abstract: No abstract text available
Text: NXP ESD protection device PUSB3F96 ESD protection for USB 3.0 SuperSpeed USB and eSATA data lines Designed for use with high-speed differential interfaces, this device delivers 10 kV of contact ESD protection, a pass-band up to 8 GHz, extremely low crosstalk, and passthrough routing for simpler board layouts.
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PUSB3F96
DFN2510A-10
OT1176)
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SOD882D
Abstract: infocus shear force SOD882
Text: NXP SOD882D package with reduced height and innovative pad design First leadless package with tin-plated, solderable side pads This new, ultra-small leadless plastic package is the industry’s first to offer solderable side pads. ` It measures only 1.0 x 0.6 x 0.37 mm and delivers very high mechanical stability.
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OD882D
AEC-Q101
OD882
SOD882D
infocus
shear force
SOD882
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