NUGENT PIN SOCKET Search Results

Contextual Info: Robinson Nugent- Screw Machine Terminal Strips I Solderless Backplane Socket r SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit

P50E-080S-TG

Abstract: P25E-050S-TG P50E-080P1 DIN-64-CPB-SR1-TR P50E-080P1-S1-TG DIN-64CPB-SR1-TR P25E-080S-TG 9063256 P50E-100S-TG DIN-96CPC-SR1-TR
Contextual Info: Robinson Nugent PC Boardmount Connectors and Sockets CPCI PAK-2¨ Connectors Compact PCI Connectors RN PAK-50¨ P25E and P50E Series 50 MIL IDC Sockets Two piece 2 mm ´ 2 mm pin and receptacle connector system. Meets IEC61076-4-101 Level 11 requirements and

Robinson Nugent ice

Abstract: Robinson Nugent s2
Contextual Info: Board-to-Board Robinson Nugent CPP Series * Variety of pin lengths to meet specific board stacking applications * Mates with both ICE and ICT Series dip sockets * CPP Series consists of .118" profile body How to Order CPP Series CPP Series CPP — XX X Number of Contacts:

Contextual Info: FINE PITCH CONNECTORS Introduction to PAK-5 and PAK-8SMT Connectors PAK-5 and PAK-8™ represent the newest high density, SMT fine pitch board to board interconnect system from Robinson Nugent, Inc. As electronic systems continue to downsize and the need for higher pin

robinson nugent

Abstract: straddle PCMCIA Robinson Nugent socket Robinson Nugent 2.0 Robinson Nugent 2.0 mm Robinson Nugent socket connector
Contextual Info: PCMCIA_ SELECTION GUIDE MEMPAK” Receptacles Part Number MCS 068 SM A 1 TP TR30 .Contact Plating TR30-30 microinch ROBEX Memory Card Socket. Number of Contacts. 68 Position Body Style_ SM-Straddle Mount SS-Single sided, Single row SD-Single sided, Dual row

Contextual Info: DIMMPAK — Introduction to DIMS Robinson Nugent has developed a full range of Dual Inline Memory Sockets DIMSs to support increas­ ing demands for high density Dual Inline Memory Module (DIMM) technology. Our DIMS product series effectively provides a high density packaging system for designers of high speed, memory intensive

Contextual Info: FINE PITCH SOCKETS SOP Sockets REMARKS 1 2) Use a screen thickness of 0.2mm or 0.3mm during cream solder printing. When infrared reflow soldering the peak surface temperature of the PC board should not exceed 245°C. Recommended conditions for the reflow

Robinson Nugent socket

Contextual Info: &QF7. HIGH DENSITY Introduction to DIMS Robinson Nugent has developed a full range of Dual Inline Memory Sockets DIMSs to support increas­ ing demands for high density Dual Inline Memory Module (DIMM) technology. Our DIMS product series effectively provides a high density packaging system for designers of high speed, memory intensive

Contextual Info: DIN CONNECTORS_ Inverse R-Form DIN Solder-to-Board Socket Connectors DIN-RS Series — - 9 PC board mount socket applications include telecom, computer, data process­ ing, test and measurement and industrial equipment * Standard pin counts: 48, 64, 96,120,

S3L 54

Contextual Info: DIN CONNECTORS_ Standard C-Form DIN Solder-to-Board Socket Connectors DIN-CS Series • Solder terminals for PCB or flexible cable mount • Standard pin counts: 48, 64, 96,120 and 150 • New! .090" terminals for “no clean” solder flux applications

BT224

Abstract: Robinson Nugent idc Robinson Nugent IDS robinson nugent Robinson Nugent din socket 16 pin
Contextual Info: IDC CONNECTORS Sockets .100 X.100 2.54 x 2.54 Grid IDS-NPK/IDS-PK Series • IDS-NPK sockets offer total compatibility to MIL-C-83503 and BT-224 • IDS-PK sockets incorporate center polarization to meet DIN-41651 • For quick disconnect with all .025"

Contextual Info: Sockets HIGH DENSITY_ ^ Pin Grid Array Sockets with Heat Sink Tabs PGHS Series • High temp molded insulator body compatible with IR and vapor phase soldering • Precision screw machine sockets for high reliability • “Ultra Low Force” 6-finger contact

Robinson Nugent

Abstract: Robinson Nugent SCREW MACHINE SOCKET Motorola 68040
Contextual Info: HIGH DENSITY Pin Grid Array Socket with Heat Sink Tabs PGHS Series CLIP HEAT SINK • High temp molded insulator body compatible with IR and vapor phase soldering MICROPROCESSOR • Precision screw machine sockets for high reliability PGA SOCKET • “Ultra Low Force” 6-finger contact

Contextual Info: DIN CONNECTORS_ Standard C-Form DIN Press-fit Backpanel Socket Connectors DIN-CS Series * FLEXPRESS contacts permit solderless mounting * 96 position socket for VME, Multi-Bus II, and VXI Backpanels * Expanded sizes 120 and 150 position

MO-52

Contextual Info: R obinson — N u gen t- Sockets Sockets ELASTIC LEADED CHIP CARRIER SOCKETS PLCC-SMT Series Low profile; .200" maximum height Designed for automatic assembly Socket footprint same as device Open frame allows visual inspection of solder joints

Contextual Info: HIGH DENSITY Pin Grid Array Headers PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements SOCKETS * Mates with PGA Series "A" SQUARE Grid Size Dimension A 8x8 .800“ 20 . 32 9x9 .900" (22 . 86)

Contextual Info: HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermitte solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press tails

Contextual Info: HIGH DENSITY Pin Grid Array Sockets . ^ ^ 7 . PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermittent solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press-fit

Contextual Info: PRODUCTION DIP _ Thin Body Screw Machine Sockets ICT Series * Very low profile options available * Four finger Beryllium Copper contact ac­ cepts short 1C leads * Pin socket design prevents solder wicking and flux entrapment * Side/end stackable SOCKETS

Contextual Info: HIGH DENSITY_ PGA Interstitial Sockets PGA-INT Series 9 .050" staggered design mates with n high density devices 9 Molded high temperature body mate - Suitable for infrared and vapor ph soldering applications 9 Screw machine reliability 9 Uses RN’s ultra-low force contact

Contextual Info: Dual Read Out DIMM Sockets DIMS Series • Effectively provides double density pack­ aging in single density footprint * Durability - 60 cycles minimum * Vertical entry allows insertion/removal without disturbing “neighboring DIMMs” • Superior shock and vibration performance

Contextual Info: RN ICPAK —Nuaent SOP Sockets REMARKS 1 Use a screen thickness of 0.2mm or 0.3mm during cream solder printing. 2) When infrared reflow soldering the peak surface temperature of the PC board should not exceed 245°C. Recommended conditions for the reflow

Robinson Nugent socket

Abstract: Robinson Nugent socket 16 pin
Contextual Info: D Kl u A ri n IM r « i \ £ 2mm Sockets P2 Series High temp, surface mount compatible Right angle socket offers variable standoff heights and locator posts to address 2.5" disc drive requirements Top and bottom inverse entry option gives greater flexibility for PCB stacking

Robinson Nugent latching socket

Abstract: Robinson Nugent cable to board
Contextual Info: Robinson Nugent 50 mil Connectors — ^P25E Series Socket 9 Accepts 30 AWG, 25 mil flat cable 9 Designed to mate with P50 Series IDC board mount connectors 9 Latching eject mechanism facilitates mating and unmating 9 3-dimensional mating 9 Daisy chain capability