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    AMD Xilinx XC4008-5MQ208C

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    AMD Xilinx XC4013-5MQ208C

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    Bristol Electronics XC4013-5MQ208C 16 1
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    TE Connectivity XRMQ208K0001

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    TE Connectivity XRMQ208N00+01

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    MQ208 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MQ208

    Abstract: MQ240
    Text: R Metal Quad MQ208, MQ240 Package PK054 (v1.0) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


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    PDF MQ208, MQ240) PK054 MQ208 MQ240

    XC4010-5PG191M

    Abstract: XC4005-5PG156M PA44-48U adapter datasheet pa44-48u SDP72 xilinx 1736a 5962-9230503MXC XC4010-5CB196B SDP-UNIV-44 XC4010-5CB196M
    Text: XCELL THE QUARTERLY Issue 19 Fourth Quarter 1995 JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS GENERALFEATURES R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: 100,000+ Gates . 2 Guest Editorial . 3


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    SDP-UNIV-44

    Abstract: sdp72 PA44-48U adapter datasheet XC6200 ALL-07 guide pa44-48u allpro 88 PLCC44 pinout design book Micromaster
    Text: XCELL THE QUARTERLY Issue 18 Third Quarter 1995 JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS GENERALFEATURES R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: PCI Compliance . 2 Guest Editorial: Chuck Fox on Developing New PLD Solutions . 3


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    t4 p131

    Abstract: P118-P119 P181 p135 P28 E8 P-197 P143 P144 p147 PQ160
    Text: XC4013 and XC4013E Pinout Table Pin Name VCC I/O A8 I/O(A9) I/O I/O I/O I/O I/O(A10) I/O(A11) VCC I/O I/O I/O I/O GND I/O I/O I/O I/O I/O(A12) I/O(A13) I/O I/O I/O I/O I/O(A14) SGCK1(A15;I/O) VCC GND PGCK1(A16;I/O) I/O(A17) I/O I/O I/O(TDI) I/O(TCK) I/O I/O


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    PDF XC4013 XC4013E PQ160 MQ208 PG223 BG225 PQ240 t4 p131 P118-P119 P181 p135 P28 E8 P-197 P143 P144 p147 PQ160

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


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    PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    XC5200

    Abstract: XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100
    Text: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


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    PDF XC5200 16-Bit 24-Bit 16-to-1 XC5210-5 XC5210-3 XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100

    FG676

    Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


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    PDF Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100

    1156-BALL

    Abstract: bga 896 411PI BF957 132-ball package
    Text: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns


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    PDF Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


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    PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002

    OSC52

    Abstract: XC3000 XC3100A XC4000A XC4000E XC4025 XC5200 vq100 xilinx xc3000 xact reference guide
    Text: book : cover 1 Wed Jul 3 10:08:16 1996 R Release Document XACTstep Version 5.2/6.0 Synopsys October 1995 Read This Before Installation book : cover 2 Wed Jul 3 10:08:16 1996 Synopsys Xilinx Development System book : online i Wed Jul 3 10:08:16 1996 Installing Online Documentation


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    XC3030A

    Abstract: XC3020A XC3020L XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
    Text: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


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    PDF PQ100 TQ100 VQ100 CB100 PG120 PP132 PG132 TQ144 PG144 PG156 XC3030A XC3020A XC3020L XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L

    Denso L 918 8

    Abstract: Denso L 918 P-PGA-132 MQFP-208 XC4000 XC4000E XC5000 XC1765D 145C XC1700D
    Text: The Reliability Data Program October 1, 1996 Expanded Version Index • • • • • • HTOL High Temperature Operating Life . 85/85 (Bias Moisture Life). PCT (Unbiased Pressure Pot).


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    PDF PLCC-20, Denso L 918 8 Denso L 918 P-PGA-132 MQFP-208 XC4000 XC4000E XC5000 XC1765D 145C XC1700D

    XC3020A

    Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
    Text: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


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    PDF TQ144 PG144 PG156 PQ160 CQ164 CB164 PP175 PG175 TQ176 PG184 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L

    XC2064

    Abstract: XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204
    Text: 10 44 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA CERAMIC QFP PLASTIC PQFP


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    PDF XC2064 XC2018 XC2064L XC2018L XC4002A XC4003A XC4004A XC4005A XC4003H XC4005H XC2064 XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204

    XC2018 PC84

    Abstract: DS401 XC3042 pc84 CORE i3 ARCHITECTURE CORE i3 INTERNAL ARCHITECTURE XC3020 PG120 PG156 xc4005 pg156 XC7000
    Text: R Release Document Xilinx Synopsys Interface Version 3.3 Software, Interface, and Libraries June 1995 Read This Before Installation R Software Versions Program Version Program Version APR 5.1 XDelay 5.1 APRLOOP 5.1 XDM 5.1 HM2RPM 5.1 XEMake 5.1 LCA2XNF 5.1


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    PSR4000

    Abstract: CCL-HL832 HL832
    Text: REV I S I ONS LTR 48X 0.45 ( 6 : A DESCRIPTION RELEASE TO D O C U M E N T C O N T R O L E.C.N. DATE 12450 04/19/2000 BY/APP'D T L / WL 1 ( 48X ( 44X T 0.3) □ □ □ □ o □ a a □ □ _P 0.5) X_° a (6 a_ "a ! □ Q - I a □ I □ T' □ a DIMENSIONS ARE IN MILLIMETERS


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    PDF CCL-HL832 PSR4000 MQ-208, SOMKT-SLB48B HL832

    Untitled

    Abstract: No abstract text available
    Text: XC4000, XC4000A, XC4000H Logic Cell Array Families f l XILINX Product Description Features D e sc rip tio n • Third Generation Field-Programmable Gate Arrays - Abundant flip-flops - Flexible function generators - On-chip ultra-fast RAM - Dedicated high-speed carry-propagation circuit


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    PDF XC4000, XC4000A, XC4000H XC4000 PG156 PG191 C4005H PG299 IL-STD-883C

    I-CUBE

    Abstract: P103t zener diode phc 16 ZENER diode p317 AB P89 zener PLK3210 hk30 transistor 4287 AB zener phc 12 kck 223
    Text: SH5 I-Cube* IQX Family Data Sheet Description Features The IQX family of SRAM-based bit-oriented switching devices is manufactured using a 0.6vim CMOS process. These devices offer clock speed of up to 150 MHz and fastest pin-to-pin delay of 6 ns. • SRAM-based, in-system programmable


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    PDF D-11-014W I-CUBE P103t zener diode phc 16 ZENER diode p317 AB P89 zener PLK3210 hk30 transistor 4287 AB zener phc 12 kck 223

    XC2064

    Abstract: XC3030A xc3142 PP175 Xilinx XC3090 xc2064 fpga xact xc3090 XC3190 Xilinx XC3090A X04008
    Text: Component Availability Pins 44 Type Plastic PLCC Plastic DIP Plastic VQFP Plastic PLCC Ceramic PGA Plastic PLCC Ceramic PGA Plastic PQFP Plastic TQFP Code PC44 PD48 VQ64 PC 68 PG68 PC84 PG84 PQ100 TQ100 ✓ ✓ ✓ ✓ ✓ ✓ XC2064 48 64 68 XC2O10 ✓ ✓


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    PDF XC2064 XC2O10 XC2064L XC2O10L XC3020 XC3030 XC3042 XC3064 XC3090 XC3020A XC3030A xc3142 PP175 Xilinx XC3090 xc2064 fpga xact xc3090 XC3190 Xilinx XC3090A X04008

    CB4CLE

    Abstract: XC4010-5PG191 XC4010-5PG191C cb4ce M16-1E X3242 cb4ce code COMPM8 XILINX 4003A XC4000
    Text: YU m !V A a i Liiva XC4000, XC4000A, XC4000H Logic Cell Array Families Product Description - 288 macros, 34 hard macros, RAM/ROM compiler Description Features • Third Generation Field-Programmable Gate Arrays - Abundant flip-flops - Flexible function generators


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    PDF XC4000, XC4000A, XC4000H 4010D XC4020 4003H XC4005H MIL-STD-883C CB4CLE XC4010-5PG191 XC4010-5PG191C cb4ce M16-1E X3242 cb4ce code COMPM8 XILINX 4003A XC4000

    Untitled

    Abstract: No abstract text available
    Text: XC4000 Logic Cell Array Family flX IU N X Product Description, August 1992 DESCRIPTION FEATURES Third Generation Field-Programmable Gate Arrays - Abundant flip-flops - Flexible function generators - On-chip ultra-fast RAM - Dedicated high-speed carry-propagation circuit


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    PDF XC4000 XC4000

    CCL-HL832

    Abstract: PSR4000 h d 2001 HL832HS HL-832
    Text: REVISIONS 24X (2.5 0.45 ) C2 4 X 0 . 2 5 ) A RELEASE E.C.N. DATE 350 06/28/2001 TO DOCUMENT C O N TR O L BY/APP ' D TL/AT □ cm T □ □ □ ( 20X DESCRI PTION LTR □ □ 0.5) (3.5) T □ □ □ □ DIMENSIONS ARE IN MILLIMETERS □ □ RECOMMENDED LAND PATTERN


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    PDF HL832-H/S PSR4000 MQ-208, SOMKT-SLD24A CCL-HL832 h d 2001 HL832HS HL-832

    PSR4000

    Abstract: CCL-HL832 taiyo PSR4000 psr-4000 CCL-HL-832 PSR4000 aus5
    Text: REV I S I ONS 40X 0.45 ( 40X 0.3) V□ i □ -*— & -i— & ( 36X 0.5) LTR (4.5) J □ A oG D o o !o cp o □ □ □ □ e - + -e - - & o o d> o □ O !O □ 0 (H ~ )o □ DESCRIPTION RELEASE TO D O C U M E N T C O N T R O L E.C.N. DATE 12377 03/01/2000


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    PDF CCL-HL832 PSR4000 MQ-208, MKT-SLB40A taiyo PSR4000 psr-4000 CCL-HL-832 PSR4000 aus5

    CCL-HL-832

    Abstract: PSR-4000 CCL-HL832 PSR4000 taiyo PSR4000
    Text: 96X ( 96X r 0.45 0.3) J 1=1 ' I ! I o _ a _ ! I o a Q-E3Q-E3J a a - i— 0.5) LTR A a I a a a a a a ( 88X REV I S I ONS (5) I I ! I (1 DESCRIPTION RELEASE TO D O C U M E N T C O N T R O L E.C.N. DATE 12334 12/13/1999 BY/APP'D TL/GN TYP) l a a a a a a a


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    PDF CCL-HL832 PSR4000 MQ-208, SOMKT-SLB96A CCL-HL-832 PSR-4000 taiyo PSR4000