PCN0515
Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently
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PCN0515
HC-100
UL-94
1x1011
PCN0515
sumitomo G770
G770* sumitomo
G770 mold compound
G770 sumitomo
Unbiased HAST 130, 85 RH, 100 Hrs
G770
G770* G770 mold compound Sumitomo 1000
thermal conductivity of sumitomo g770
G770 HC
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