JEDEC MO-153
Abstract: MO-153-BD-1 MO-153BD-1
Text: Plastic Packages for Integrated Circuits Thin Shrink Small Outline Plastic Packages TSSOP M38.173 N INDEX AREA E 0.25(0.010) M E1 2 INCHES GAUGE PLANE -B1 38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-153-BD-1 ISSUE F) B M SYMBOL
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MO-153-BD-1
JEDEC MO-153
MO-153BD-1
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Untitled
Abstract: No abstract text available
Text: Product Color Information Plastic Enclosures: Beige Blue Black Grey Painted Diecast Aluminum Enclosures: Black Watertight - 1590Z Series Grey RAL 7001 General Purpose Metal Enclosures: Black Contempra Grey (RAL 7032) Blue ASA 61 Grey NOTE: This color chart page is included for reference only. It was created with printers ink and gives
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1590Z
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Untitled
Abstract: No abstract text available
Text: 1C 5 1 /5 3 SERIES S0P/QFP/QFN ICC /QF1(PLCC)/TCP FEATURES • • S ockets tor SOP, QFP and other surface-m ount 1C packages. Custom designs also available for m ulti-lead, fine-pitch and other special packages. SPECIFICATIONS PERFORMANCE Contact our Sales Department for detail. Specifications differ by the contact
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Avantek amplifier
Abstract: transistor tt 2206 TT 2206 Avantek, Inc. GPD 35C05 LMM 2057 GPD-201 Avantek rf amplifier GPD-1001 GPD-405 GPD-331
Text: AVANTEK INC EOE O a v a n tek D • i m i l t t 0QQ7343 Selection G uide 4 GPD Series PRODUCT DESCRIPTION The GPD and G PM amplifiers, available in TO-12 4-pin and TO-39 (3-pin) packages, are designed for applications which require the highest performance-to-cost ratio or where size is
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CA85035
TWX910-338-2206
Avantek amplifier
transistor tt 2206
TT 2206
Avantek, Inc. GPD
35C05
LMM 2057
GPD-201
Avantek rf amplifier GPD-1001
GPD-405
GPD-331
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Untitled
Abstract: No abstract text available
Text: THICK FILM CONFORMAL SIPs, HIGH PROFILE 4 THROUGH 14 PIN • High profile offers increased power handling ■ Wide assortment of pin packages enhances design flexibility ■ Ammo-pak packaging available n Recomrr ended for rosin flux and solvent clean or no clean
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4600H
250ppm/
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eel -16
Abstract: RS481
Text: TAPE AND REEL SPECIFICATIONS SUBMINIATURE PACKAGES OPTOELECTRONICS Ordering In fo rm atio n To order Q E B or Q SB subminiature products on tape and reel include the appropriate standard product part num ber and suffix code to specify the lead form and packaging method.
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QEB363
RS-481.
000/R
RS-481
eel -16
RS481
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R1C11
Abstract: r6c1
Text: Configuration selection generates starting addresses at either zero or 3FFFF, to be compatible with different microprocessor addressing conventions. The Master Serial Mode generates CCLK and receives the configuration data in serial form from configuration data in serial form from a
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TsE 151
Abstract: transistor irfp IRFP152 IRFP150 IRFP 150fi IRFP P CHANNEL IRFP150FI IRFP151 IRFP transistors
Text: _ 30E D m 7CJ2C1537 GQS^ÖSS 2 • ^ T 7'3 0 |-|3 7 SCS-THOMSON Mmi[LEg¥[E«P g§ L 1 _ S" TH0MS0N TYPE IRFP150 IRFP150FI IRFP151 IRFP151FI IRFP152 IRFP152FI IRFP153 IRFP153FI Vpss 100 V 100 V 60 V 60 V 100 V 100 V 60 V 60 V IRFP 150/FI-151/FI IRFP 152/FI-153/FI
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7CJ2C1E37
150/FI-151/FI
152/FI-153/FI
IRFP150
IRFP150FI
IRFP151
IRFP151FI
IRFP152
IRFP152FI
IRFP153
TsE 151
transistor irfp
IRFP
150fi
IRFP P CHANNEL
IRFP transistors
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Untitled
Abstract: No abstract text available
Text: 1. 5 P o w e r P C 6 0 3 e M i c r o p r o c e s s o r Pi n A s s i g n m e n t s The following sections contain the pinout diagrams for the 603e. Note that the 603e is offered in both ceramic quad flat pack CQFP and ceramic ball grid array (CBGA) packages.
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PID6-603e
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Untitled
Abstract: No abstract text available
Text: THICK FILM CONFORMAL SIPs ULTRALOW PROFILE, 4 THROUGH 12 PIN • Low profile is compatible with DIPs ■ Wide assortment of pin packages enhances design flexibility ■ Recommended for rosin flux and solvent clean or no clean flux processes Model 4600U Resistor Networks
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4600U
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xc4413
Abstract: P23S Xilinx XC4013 XC4410 P181 V8 XC4406 XC4405 XC4403 xc442 XC4400
Text: £ XILINX* XC4400 Hardwire Array Family Preliminary Product Specification Features Description • Mask-programmed versions of Programmable Logic Cell Arrays FPGA The XC4400 Series Hardwire Arrays are advanced maskprogrammed versions of the XC4000 programmable de
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XC4000/E
XC4000E
PG299
xc4413
P23S
Xilinx XC4013
XC4410
P181 V8
XC4406
XC4405
XC4403
xc442
XC4400
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XC5402
Abstract: XC5406 XC5410
Text: f l XILINX XC5400 Hardwire Array Family Preliminary Product Specification Features Description • Mask Programmed version of the XC5200 Field Programmable Gate Array FPGA - Specifically designed for easy XC5200 conversion - Significant cost reduction for high volume
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XC5200
pBG352
BG225
BG352
XC5402
XC5406
XC5410
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Untitled
Abstract: No abstract text available
Text: THICK FILM CONFORMAL SIPs, LOW PROFILE 4 THROUGH 16 PIN • Low profile is compatible with DIPs ■ Wide assortment of pin packages enhances design flexibility ■ Ammo-pak packaging available ■ Recommended for rosin flux and solvent clean or no clean flux processes
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4600X
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5200 FPGA
Abstract: PC8421
Text: SIXILINX* XC5400 Hardwire Array Family Preliminary Product Specification Features Description • Mask Programmed version of the XC 5200 Reid Programmable G ate Array FPGA - Specifically designed for easy XC 5200 conversion - Significant cost reduction for high volume
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BG225
BG352
5200 FPGA
PC8421
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xc4413
Abstract: ATIC 164 D2 XC4013 PG223 xc4405 cn/A/U 237 BG
Text: f i XILINX XC4400 Hardwire Array Family Preliminary Product Specification Features Description • Mask-programmed versions of Programmable Logic Cell Arrays FPGA The XC4400 Series H ardw ire Arrays are advanced maskprogrammed versions of the XC4000 programmable de
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XC4000/E
XC4000E
gener147
xc4413
ATIC 164 D2
XC4013 PG223
xc4405
cn/A/U 237 BG
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Untitled
Abstract: No abstract text available
Text: KMM37 2 V 4 0 0 B K D R A M Mo d u l e ELECTRO NICS KMM372V400BK/BS / KMM372V41OBK/BS Fast Page Mode 4Mx72 DRAM DIMM with ECC, 4K & 2K Refresh, 3.3V GENERAL DESCRIPTION FEATURES • Part Identification The Samsung KMM372V40 1 0B is a 4M bit x 72 Dynamic RAM high density memory module. The
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KMM37
KMM372V400BK/BS
KMM372V41OBK/BS
4Mx72
KMM372V40
KMM372V400BK
cycles/64ms
300mil
KMM372V41OBK
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Untitled
Abstract: No abstract text available
Text: JIXILINX XC5200 Field Programmable Gate Arrays June 1, 1996 Version 4.0 Preliminary Product Specification Features • Fully supported by XACTsfep Development System - Includes complete support for XACT-Performance™, X-BLOX™, Unified Libraries, Relationally Placed
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XC5200
PQ100
VQ100
TQ144
PG156
PQ160
TQ176
XC5202
XC5204
XC5206
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gc 7137 ad
Abstract: transistor c5200 c5200 transistor TTC 5200 C5200 LC1 D18 P7 HC 148 TRANSISTOR ATIC 164 D2 44 pin
Text: £ XILINX XC5200 Series Field Programmable Gate Arrays Novem ber 5, 1998 Version 5.2 Product Specification Features - • Low-cost, register/latch rich, SRAM based reprogram m able architecture - 0.5|j.m three-layer metal CMOS process technology - 256 to 1936 logic cells (3,000 to 23,000 “gates”)
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XC5200
distribution156
PQ160
TQ176
PG191
HQ208
PQ208
PG223
BG225
HQ240
gc 7137 ad
transistor c5200
c5200 transistor
TTC 5200
C5200
LC1 D18 P7
HC 148 TRANSISTOR
ATIC 164 D2 44 pin
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XC3330A
Abstract: P2M3 XC3390A
Text: ' K x il in x XC3300A/L Hardwire Array Family * Preliminary Product Specification Features Description • Mask-programmed versions of Xiiinx Programmable Logic Cell Arrays XC3000, XC3000A, XC3000L, XC3100, XC3100A - Cost reduction for high volume applications
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XC3300A/L
XC3000A
7XC3100A
55-I/0
A15-I/0
A14-IX)
A13-I/0
A12-1/0
A11-1/0
XC3330A
P2M3
XC3390A
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ic 4082 16 pins
Abstract: ic 4082 ic 4082 and pin configuration
Text: IP X fd t Integrated Ete1i'ice Technology, Inc. Inf7MBV4150 128K x 64/256K x 72 SYNC HR ON OUS PIPELINED BU RST SRAM 256K x 72 BU RST Z B T SRAM MODULE FAMILY IDT7MBV4151 IDT7MBV4152 FEATURES: DESCRIPTION: • Pin compatible module family for pipelined burst SRAM and
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64/256K
Inf7MBV4150
IDT7MBV4151
IDT7MBV4152
160-lead
66MHz,
IDT7MBV4150/51/52
BV4150
7MBV4151
ic 4082 16 pins
ic 4082
ic 4082 and pin configuration
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XC3342
Abstract: No abstract text available
Text: f i XI LI N X XC3300A/L Hardwire Array Family Preliminary Product Specification Features Description • The Xilinx XC3300A/L family of H ardwire Arrays are mask programmed versions of the Xilinx XC3000A/L/XC3100A FPGAs. In high-volume applications where the design is
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XC3000,
XC3000A,
XC3000L,
XC3100,
XC3100A
XC3300A/L
XC3000A/L/XC3100A
XC3342
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CMP01CP
Abstract: CMP01EZ CMP-01 cmp01ep cmp01cj CMP01CZ CMP01EJ CMP01Z CMP01J CMP-01CJ
Text: Fast Precision Comparator CMP-01 AN ALO G DEVICES GENERAL DESCRIPTION fea tu r es • • • • • a • a • • • • Fast Response Time . 180nsMax High Input Slaw R
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CMP-01
CMP-01
13-bit
CMP01CP
CMP01EZ
cmp01ep
cmp01cj
CMP01CZ
CMP01EJ
CMP01Z
CMP01J
CMP-01CJ
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XCS200 FPGA
Abstract: No abstract text available
Text: HXILINX XC5200 Series Field Programmable Gate Arrays December 10, 1997 Version 5.0 Product Specification Features • • Low-cost, process-optimized, register/latch rich, SRAM based reprogrammable architecture - 0.5pm three-layer metal CMOS process technology
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XC5200
XC5202
XC5204
XC5206
XC5210
XC5215
PQ100
VQ100
TQ144
PG156
XCS200 FPGA
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ATIC 164 D2 44 pin
Abstract: ATIC 164 D2 48 pin ATIC 164 D3
Text: H X IL IN X XC5200 Field Programmable Gate Arrays June 1, 1996 Version 4.0 Prelim inary Product Specification Features • • High-density family of Field-Program m able Gate Arrays (FPGAs) • Design- and process-optimized for low cost - 0.6-nm three-layer metal (TLM) process
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XC5200
PQ100
VQ100
XC5202
XC5204
XC5206
XC5210
XC5215
TQ144
PG156
ATIC 164 D2 44 pin
ATIC 164 D2 48 pin
ATIC 164 D3
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