MMC VERSION 4.2 Search Results

mmc_write

Abstract: onenand xsr SAMSUNG NAND FTL KFAT XSR Porting Guide SAMSUNG NAND FLASH TRANSLATION LAYER samsung xsr abstract fore system m.a hindi K9K2G16U0M
Contextual Info: TFS4 Porting Guide 2007.08.16 , Version 1.4.2 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC(or HSMMC) host device driver.

samsung tfs4

Abstract: samsung xsr Flash Translation Layer XSR Extended Sector Remapper XSR Porting Guide onenand xsr FAT32 NAND XSR SAMSUNG NAND FLASH TRANSLATION LAYER S3C2410
Contextual Info: TFS4 v1.5.0 Porting Guide 2006.05.02 , Version 1.5.0 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC (or HSMMC) host device driver.

samsung xsr

Abstract: FAT32 SAMSUNG NAND FTL XSR Porting Guide onenand xsr samsung tfs4 Nucleus RTOS 0x00000025 samsung sector remapper SAMSUNG NAND FLASH TRANSLATION LAYER
Contextual Info: TFS4 v1.6 Porting Guide 2006.05.29, Version 1.6 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC (or HSMMC) host device driver.

48-PIN

Abstract: FR30 GIO10 W86L488 W86L488AY W86L488Y ase qfn 48
Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge Preliminary W86L488 W86L488 Data Sheet Revision History Pages Version on Web Dates Version 1 08/2002 0.50 First published. 2 12/2002 0.60 Add QFN package. Main Contents 1.Modify pin function of CLK, ACLK,

K9F1G08U0A

Abstract: SAMSUNG 413 K9F1G08U0M SAMSUNG 413 K9K1G08U0A 48-LQFN 2936A K9F5608U0C Flash Memory mmc "Flash Memory select" CSDN cdi schematics
Contextual Info: W86L157 WINBOND MMC CARD CONTROLLER -I- Publication Release Date: December 2, 2004 Revision 0.7 W86L157 Preliminary Revision History VERSION ON WEB PAGES DATES VERSION 1 - 2/2004 0.5 First published. 2 16 4/6/2004 0.6 Add 48-pin LQFN package 3 18, 19 12/2/2004

"MMC CARD COMMANDS"

Abstract: 48-PIN FR30 GIO10 W86L488 W86L488AY W86L488Y MMC Electronics America CSD1146
Contextual Info: Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 Preliminary W86L488 W86L488 Data Sheet Revision History Pages Version on Web Dates Version 1 Aug. 2002 0.50 First published. 2 Dec. 2002 0.60 Add QFN package. 3 P6, P8, P10, P11, P24, P25, P26, P41, P42,

iCreate Technologies

Abstract: icreate
Contextual Info: i5141-TG i5141-TG SD/MMC Memory Card Controller Datasheet Version 1.1 iCreate Technologies Corporation 2006/9/28 2006 iCreate Technologies Corporation Page 1 / 20 iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.

DIM800DCM12-A000

Abstract: 4E26
Contextual Info: DIM800DCM12-A000 DIM800DCM12-A000 IGBT Chopper Module Replaces July 2002 version DS5548-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5548- KEY PARAMETERS

bi-directional switches IGBT

Abstract: DIM800DCM12-A000
Contextual Info: DIM800DCM12-A000 DIM800DCM12-A000 IGBT Chopper Module Replaces July 2002 version DS5548-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5548- KEY PARAMETERS

DIM800DCM12-A000

Contextual Info: DIM800DCM12-A000 DIM800DCM12-A000 IGBT Chopper Module Replaces July 2002 version DS5548-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5548- KEY PARAMETERS

DIM400DDM12-A000

Contextual Info: DIM400DDM12-A000 DIM400DDM12-A000 Dual Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5532-1.3 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates

DIM1600FSM12-A000

Contextual Info: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5533-1.2 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates

DIM2400ESM12-A000

Contextual Info: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5536-1.3 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates

A8827

Contextual Info: i5140-N i5140-N SD/MMC Memory Card Controller Datasheet Version 1.1 iCreate Technologies Corporation 2006/3/8 2006 iCreate Technologies Corporation Page 1 / 21 iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.

DIM800FSM12-A000

Contextual Info: DIM800FSM12-A000 DIM800FSM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue March 2002, version DS5531-1.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates

Contextual Info: DIM800DCM12-A000 DIM800DCM12-A000 IGBT Chopper Module Replaces July 2002 version DS5548-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5548- KEY PARAMETERS

DIM800DDM12-A000

Contextual Info: DIM800DDM12-A000 DIM800DDM12-A000 Dual Switch IGBT Module Preliminary Information Replaces issue March 2002, version DS5528-1.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates

Contextual Info: DIM1200FSM12-A000 DIM1200FSM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5547-1.3 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates

DIM2400ESM12-A000

Contextual Info: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5536-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5529-3.0 March 2003

DIM1600FSM12-A000

Abstract: 6x transistor
Contextual Info: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5533-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5533-3.0 March 2003

DIM1200FSM17-A000

Contextual Info: DIM1200FSM17-A000 DIM1200FSM17-A000 Single Switch IGBT Module Replaces May 2002, version DS5456-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5456-3.1 July 2002

bi-directional switches IGBT

Abstract: DIM800DDM17-A000
Contextual Info: DIM800DDM17-A000 DIM800DDM17-A000 Dual Switch IGBT Module Replaces March 2002, version DS5433-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5433-4.1 July 2002

12v to 1000v inverters circuit diagrams

Abstract: bi-directional switches IGBT ups circuit diagram using igbt DIM2400ESM17-A000
Contextual Info: DIM2400ESM17-A000 DIM2400ESM17-A000 Single Switch IGBT Module Replaces March 2002, version DS5447-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5447-4.1 July 2002

bi-directional switches IGBT

Abstract: 12v to 1000v inverters circuit diagrams DIM1200FSM17-A000 ic 4800 8 pin
Contextual Info: DIM1200FSM17-A000 DIM1200FSM17-A000 Single Switch IGBT Module Replaces May 2002, version DS5456-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5456-3.1 July 2002