Micron Technology
Abstract: No abstract text available
Text: Micron DRAM Products Overview August 2013 John Quigley – Micron FAE 2012 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings are not to scale. Micron and
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20Note/DRAM/TN4102
TN-41-04:
TN-41-13:
TN-46-02:
TN-46-06:
TN-46-11:
TN-46-14:
TN-47-19:
TN-47-20:
Micron Technology
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Untitled
Abstract: No abstract text available
Text: L S I L OG I C CORP fil De 5304004 0000S43 4 | ' DfT •.T.-46-.13-47 LSA2008 Two Micron HCMOS Structured A rray LSI LOGIC CORPORATION PRELIMINARY General Description The LSA2008 is a member of the 2-micron drawn, (1.4-micron effective HCMOS family of Structured
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0000S43
LSA2008
16x16
36-BIT
EsE35
16-Bit
Telex-172153
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Untitled
Abstract: No abstract text available
Text: 4’8 M EGx32 MICRON I SDRAM DIMMs TECHNOLOGY, INC. MT2LSDT432U, MT4LSDT832UD SYNCHRONOUS DRAM MODULE For the latest full-length data sheet, please refer to the Micron Web site: www. micron, com/mti/msp/html/ datasheet.html FEATURES PIN ASSIGNMENT Front View
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MT2LSDT432U,
MT4LSDT832UD
100-pin,
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XH018
Abstract: No abstract text available
Text: 0.18 m Process Family: XH018 0.18 Micron Modular Analog Mixed HV Technology DESCRIPTION The XH018 series is X-FAB’s 0.18 micron Modular Mixed Signal HV CMOS Technology. Based upon the industrial standard single poly with up to six metal layers 0.18 micron
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XH018
XH018
18-micron
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dram 88 pin
Abstract: No abstract text available
Text: MICRON TECHNOLOGY INC 55E D MICRON I • blllS4T 0DGSDb3 3T0 ■ MRN MT12D88C25636 256K x 36, 512K x 18 IC DRAM CARD - " T
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MT12D88C25636
88-Pin
dram 88 pin
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Untitled
Abstract: No abstract text available
Text: ADVANCE MICRON I 16’ 32 M E Gx32 SDRAM DIMMs TECHNOLOGY, INC. MT8LSDT1632U, MT8LSDT3232U SYNCHRONOUS DRAM MODULE For the latest full-length data sheet, please refer to the Micron Web site: www. micron, com/mti/msp/html/ datasheet.html FEATURES PIN ASSIGNMENT Front View
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MT8LSDT1632U,
MT8LSDT3232U
100-pin,
128MB
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memory 9652
Abstract: No abstract text available
Text: FOR IMMEDIATE RELEASE Contact: Grant Jones Micron Technology, Inc. 208 368-4400 Web Site URL <http://www.micron.com> Fax-on-demand: (800) 239-0337 MICRON TECHNOLOGY, INC., REPORTS RESULTS FOR THE THIRD FISCAL QUARTER OF 2000 Boise, Idaho, June 22, 2000 - Micron Technology, Inc., today reported quarterly net
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Untitled
Abstract: No abstract text available
Text: 10 75005 NOTES: 1 MATERIALS: HOUSING - LIQUID CRYSTAL POLYMER. UL94 V -0, NATURAL CHICKLET - LIQUID CRYSTAL POLYMER. UL94 V -0, BLACK CONTACT - TIN BRASS 2) CONTACT PLATING FINISH: 0.76 MICRON MIN. SELECT GOLD AND 3.81 MICRON MIN. SELECT PURE TIN OVER 1.27 MICRON MIN. NICKEL OVERALL
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PS-75005-001.
PK-75005-001.
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m25p40vmb6txx
Abstract: M25PX64 M25P40-VMB6 M25P UID M25P40 JESD22-A114A M25P vdfpn8 MLP8 VDFPN8 package
Text: Micron M25P40 Serial Flash Embedded Memory Features Micron M25P40 Serial Flash Embedded Memory M25P40VMB6Txx M25P40VMC6Gx; M25P40VMC6Txx M25P40VMN3Px; M25P40VMN3Txx M25P40VMN6Pxx; M25P40VMN6Txxx M25P40VMP6Gx; M25P40VMP6Txx M25P40VMS6Gx; M25P40VMS6Tx M25P40VMW6Gx; M25P40VMW6Txx
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M25P40
M25P40VMB6Txx
M25P40VMC6Gx;
M25P40VMC6Txx
M25P40VMN3Px;
M25P40VMN3Txx
M25P40VMN6Pxx;
M25P40VMN6Txxx
M25P40VMP6Gx;
m25p40vmb6txx
M25PX64
M25P40-VMB6
M25P UID
JESD22-A114A
M25P
vdfpn8
MLP8
VDFPN8 package
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14020
Abstract: MG2000 MG2001 MG2002 MG2004 MG2010 MG2044 MG2055
Text: MG2 0.5 Micron Sea of Gates Introduction The MG2 series is a 0.5 micron, array based, CMOS product family. Several arrays up to 700k cells cover all system integration needs. The MG2 is manufactured using SCMOS3/2, a 0.5 micron drawn, 3 metal layers CMOS process.
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BOUT12
14020
MG2000
MG2001
MG2002
MG2004
MG2010
MG2044
MG2055
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rpp1k1
Abstract: No abstract text available
Text: 0.18 m Process Family: XT018 0.18 Micron HV SOI CMOS Technology DESCRIPTION The XT018 series is X-FAB’s 0.18 micron Modular High-voltage SOI CMOS Technology. Based on SOI wafers and the industrial standard single poly with up to six metal layers 0.18-micron drawn gate
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XT018
XT018
18-micron
rpp1k1
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Untitled
Abstract: No abstract text available
Text: 10 75005 NOTES: 1 MATERIALS: HOUSING - LIQUID CRYSTAL POLYMER. UL94 V -0, NATURAL CHICKLET - LIQUID CRYSTAL POLYMER. UL94 V -0, BLACK CONTACT - TIN BRASS 2) CONTACT PLATING FINISH: 0.76 MICRON MIN. SELECT GOLD AND 3.81 MICRON MIN. SELECT PURE TIN OVER 1.27 MICRON MIN. NICKEL OVERALL
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PS-75005-001.
PK-75005-001.
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208-MIL
Abstract: mlp8 numonyx
Text: Micron M25P40 Serial Flash Embedded Memory Features Micron M25P40 Serial Flash Embedded Memory M25P40VMB6Txx M25P40VMC6Gx; M25P40VMC6Txx M25P40VMN3Px; M25P40VMN3Txx M25P40VMN6Pxx; M25P40VMN6Txxx M25P40VMP6Gx; M25P40VMP6Txx M25P40VMS6Gx; M25P40VMS6Tx M25P40VMW6Gx; M25P40VMW6Txx
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M25P40
M25P40VMB6Txx
M25P40VMC6Gx;
M25P40VMC6Txx
M25P40VMN3Px;
M25P40VMN3Txx
M25P40VMN6Pxx;
M25P40VMN6Txxx
M25P40VMP6Gx;
208-MIL
mlp8 numonyx
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Untitled
Abstract: No abstract text available
Text: Micron M25P40 Serial Flash Embedded Memory Features Micron M25P40 Serial Flash Embedded Memory M25P40VMB6Txx M25P40VMC6Gx; M25P40VMC6Txx M25P40VMN3Px; M25P40VMN3Txx M25P40VMN6Pxx; M25P40VMN6Txxx M25P40VMP6Gx; M25P40VMP6Txx M25P40VMS6Gx; M25P40VMS6Tx M25P40VMW6Gx; M25P40VMW6Txx
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M25P40
M25P40VMB6Txx
M25P40VMC6Gx;
M25P40VMC6Txx
M25P40VMN3Px;
M25P40VMN3Txx
M25P40VMN6Pxx;
M25P40VMN6Txxx
M25P40VMP6Gx;
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M25P40-VMB6
Abstract: 208-MIL 208mils MLP8 package M25P40-VMW6G
Text: Micron M25P40 Serial Flash Embedded Memory Features Micron M25P40 Serial Flash Embedded Memory M25P40VMB6Txx M25P40VMC6Gx; M25P40VMC6Txx M25P40VMN3Px; M25P40VMN3Txx M25P40VMN6Pxx; M25P40VMN6Txxx M25P40VMP6Gx; M25P40VMP6Txx M25P40VMS6Gx; M25P40VMS6Tx M25P40VMW6Gx; M25P40VMW6Txx
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M25P40
M25P40VMB6Txx
M25P40VMC6Gx;
M25P40VMC6Txx
M25P40VMN3Px;
M25P40VMN3Txx
M25P40VMN6Pxx;
M25P40VMN6Txxx
M25P40VMP6Gx;
M25P40-VMB6
208-MIL
208mils
MLP8 package
M25P40-VMW6G
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Untitled
Abstract: No abstract text available
Text: Micron M25P40 Serial Flash Embedded Memory Features Micron M25P40 Serial Flash Embedded Memory M25P40VMB6Txx M25P40VMC6Gx; M25P40VMC6Txx M25P40VMN3Px; M25P40VMN3Txx M25P40VMN6Pxx; M25P40VMN6Txxx M25P40VMP6Gx; M25P40VMP6Txx M25P40VMS6Gx; M25P40VMS6Tx M25P40VMW6Gx; M25P40VMW6Txx
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M25P40
M25P40VMB6Txx
M25P40VMC6Gx;
M25P40VMC6Txx
M25P40VMN3Px;
M25P40VMN3Txx
M25P40VMN6Pxx;
M25P40VMN6Txxx
M25P40VMP6Gx;
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36168
Abstract: No abstract text available
Text: MG2 MG2 Sea of Gates Series 0.5 Micron CMOS Introduction The MG2 series is a 0.5 micron, array based, CMOS product family. Several arrays up to 700k cells cover all system integration needs. The MG2 is manufactured using SCMOS3/2, a 0.5 micron drawn, 3 metal layers CMOS
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Bout12,
BOUT12
36168
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Untitled
Abstract: No abstract text available
Text: ADVANCE 16 MEG X 32 SDRAM DIMM MICRON' I TECHNOLOGY, INC. M T 4L S D T 1632U D SYNCHRONOUS DRAM MODULE For the latest full-length data sheet, please refer to the Micron Web site: www. micron, com/mti/msp/html/ datasheet.html FEATURES PIN ASSIGNMENT Front View
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100-pin,
096-cycle
1632U
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4LC4M
Abstract: No abstract text available
Text: 4’8 M EGx32 DRAM DIMMs MICRON I TECHNOLOGY, INC. D P A |\/| MT2LDT432U X , MT4LDT832U (X) _ _ _ I WI f j | j I I I I •I For the latest full-length data sheet, please refer to the Micron Web site: www. micron, com/mti/msp/html/ datasheet.html FEATURES
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MT2LDT432U
MT4LDT832U
100-pin,
096-cycle
100-Pin
4LC4M
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M25P
Abstract: M25P40vmn6p M25PX64 mlp8 micron VFQFPN8
Text: Micron M25P40 Serial Flash Embedded Memory Features Micron M25P40 Serial Flash Embedded Memory M25P40VMB6Txx M25P40VMC6Gx; M25P40VMC6Txx M25P40VMN3Px; M25P40VMN3Txx M25P40VMN6Pxx; M25P40VMN6Txxx M25P40VMP6Gx; M25P40VMP6Txx M25P40VMS6Gx; M25P40VMS6Tx M25P40VMW6Gx; M25P40VMW6Txx
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M25P40
M25P40VMB6Txx
M25P40VMC6Gx;
M25P40VMC6Txx
M25P40VMN3Px;
M25P40VMN3Txx
M25P40VMN6Pxx;
M25P40VMN6Txxx
M25P40VMP6Gx;
M25P
M25P40vmn6p
M25PX64
mlp8 micron
VFQFPN8
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MG2000
Abstract: MG2001 MG2002 MG2004 MG2010 MG2044 MG2055 MATRA MHS, MG2
Text: MG2 MG2 Sea of Gates Series 0.5 Micron CMOS Introduction The MG2 series is a 0.5 micron, array based, CMOS product family. Several arrays up to 700k cells cover all system integration needs. The MG2 is manufactured using SCMOS 3/2, a 0.5 micron drawn, 3 metal layers
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BOUT12
MG2000
MG2001
MG2002
MG2004
MG2010
MG2044
MG2055
MATRA MHS, MG2
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PC5004
Abstract: VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding
Text: V L S I T ech n o lo gy, inc. O.6-MICRON _ ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.6-micron 0.55-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec - 5 V (4.5 to 5.5 V): 190 ps, 2.6 nW/MHz
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55-micron
PC5004
VGC650
VGC6P52
VGC600
IN01D1
NR02D1
QFP 128 bonding
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Untitled
Abstract: No abstract text available
Text: Temic MG2 Semiconductors MG2 Sea of Gates Series 0.5 Micron CMOS Introduction The MG2 series is a 0.5 micron, array based, CMOS prod uct family. Several arrays up to 700k cells cover all sys tem integration needs. The MG2 is manufactured using SCMOS3/2, a 0.5 micron drawn, 3 metal layers CMOS
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BOUT12
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Untitled
Abstract: No abstract text available
Text: 4’ 8 M EGx64 MICRON I n 'm m n'zSE£ NONBUFFERED DRAM DIMMs D RAM MT4LDT464A X , MT8LDT864A (X) _ _ _ I WI f j | j I I I 1* 1 V y W •— ■— For the latest full-length data sheet, please refer to the Micron Web site: www. micron, com/mti/msp/html/
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MT4LDT464A
MT8LDT864A
168-pin,
096-cycle
168-PIN
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