MicroLeadFrame Packages Pad Landing Recommendations
Abstract: 3641B atmel Reflow soldering die paddle IPC-SM-782 atmel touch pattern MLF 6x6 amkor exposed pad
Text: MicroLeadFrame Packages Pad Landing Recommendations 1. Introduction This application note provides PCB designers with a set of guidelines for successful board mounting of Atmel’s DataFlash memories housed in the MicroLeadFrame package. The MicroLeadFrame package MLF® is a near CSP plastic encapsulated
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3641B
MicroLeadFrame Packages Pad Landing Recommendations
atmel Reflow soldering
die paddle
IPC-SM-782
atmel touch pattern
MLF 6x6
amkor exposed pad
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DUAL ROW QFN leadframe
Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
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PCB design for 0.2mm pitch csp package
Abstract: led matrix 8x8 mini circuits 0.3mm pitch csp package E30JA Amkor CSP mold compound Soldering guidelines and SMD footprint design led 3mm 8x8 matrix mlf 0.3mm pitch MLF 6x6 guideline pad dimension 1210
Text: Application Notes for Surface Mount Assembly of Amkor’s MicroLeadFrame MLF® Packages December 2003 Page 1 December 2003 Rev. E Contents 1.0 Introduction 3 2.0 Surface Mount Consideration 3 3.0 PCB Design Requirements 4 3.1 4 4 8 8 10 3.2 3.3 Page 2
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qfn 48 7x7 stencil
Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size
Text: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical
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PIC16F73
Abstract: PIC16C73B PIC16C72A AC164031 PIC16F76
Text: PICmicro Microcontrollers in Small-Scale MLF Packages Ideal For Applications Where Space is Vital Microchip Technology Inc. is producing a number of the company’s popular PICmicro® OTP and Flash microcontrollers in a new competitively-priced, space-saving MicroLeadframe MLF package.
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directC16F73;
PIC16F76.
20-lead
40-lead
PIC16F73
PIC16C73B
PIC16C72A
AC164031
PIC16F76
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"ESD Protection"
Abstract: "USB Transceiver" MIC2550 MIC2551 IEC-610004-4-2
Text: USB Transceiver Simplifies Design, Lowers System Cost The Good Stuff ◆ ESD protection compliant to IEC-610004-4-2 Level 3 ◆ 1.6V to 3.6V system I/O interface ◆ Re-enumerate device class under software control ◆ Compliant to USB 2.0 for full speed and low speed
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IEC-610004-4-2
MIC2550
16-lead
MIC2551
MIC2550
MIC2551
"ESD Protection"
"USB Transceiver"
IEC-610004-4-2
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L512 led
Abstract: Adjustable Current Regulator With Enable Control
Text: MIC2210 Micrel MIC2210 Dual µCap LDO with Open-Drain Driver Final General Description Features The MIC2210 is a dual µCap low dropout regulator with an open-drain driver and power-on reset circuit. The first regulator is capable of sourcing 150mA, while the second regulator can source up to 300mA and includes a power-on reset
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MIC2210
MIC2210
150mA,
300mA
150mA
100mA)
L512 led
Adjustable Current Regulator With Enable Control
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PIP201-12M
Abstract: No abstract text available
Text: PIP201-12M Power MOSFETs are getting smarter with Philips Intelligent Power PIP , our latest development in power semiconductor architectures. The new devices are a family of integrated powertrain solutions designed specifically for DC/DC buck converter applications. PIP devices provide high output
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PIP201-12M
PIP201-12M
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PIP202-12M
Abstract: No abstract text available
Text: PIP202-12M Power MOSFETs are getting smarter with Philips Intelligent Power PIP , our latest development in power semiconductor architectures.The new devices are a family of integrated powertrain solutions designed specifically for DC/DC buck converter applications. PIP devices provide high output current in a small surface mount power package and provide
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PIP202-12M
PIP202-12M
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PIP201-12M
Abstract: No abstract text available
Text: Power MOSFETs are getting smarter with Philips Intelligent Power PIP , our latest development in power semiconductor architectures.The new devices are a family of integrated powertrain solutions designed specifically for DC/DC buck converter applications. PIP devices provide high output current in a small
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PIP201-12M
PIP201-12M
301601/pdf/2pp/0302
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Amkor Technology MLF
Abstract: MIC2288 MIC2289 MIC2290 MIC2292 MIC2293 "White LED Drivers"
Text: Power and System Management for Battery Powered Applications Organic Boost Regulators 2mm x 2mm MLF TM VIN OFF ON VIN VOUT 2" OEL PANEL OFF • >1A Switch Current MIC2288 • 1.2MHz PWM Operation 1" OEL PANEL MIC 2290 ON • >500mA Switch Current (MIC2290)
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MIC2288)
500mA
MIC2290)
600mA
150mA
/300mA
Amkor Technology MLF
MIC2288
MIC2289
MIC2290
MIC2292
MIC2293
"White LED Drivers"
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lqfp 64 Shipping Trays
Abstract: DS310H
Text: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging
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marking 016L
Abstract: MLF-16 SY58016LMI
Text: 3.3V 10Gbps DIFFERENTIAL CML LINE DRIVER/RECEIVER WITH INTERNAL TERMINATION FEATURES • ■ ■ ■ ■ ■ ■ ■ SY58016L FINAL DESCRIPTION Accepts up to 10.7Gbps data < 45ps edge rate Gain ≥ 4V/V CML/PECL differential inputs CML outputs Internal 50Ω input termination
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10Gbps
SY58016L
16-pin
SY58016L
10Gbps.
marking 016L
MLF-16
SY58016LMI
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SY89322V
Abstract: SY89329V SY89329VMITR
Text: Precision Edge 3.3V/5V 800MHz LVTTL/LVCMOS-to-DIFFERENTIAL LVPECL TRANSLATOR Micrel SY89329V Precision Edge™ SY89329V FEATURES • Guaranteed AC performance over temp and voltage: • DC-to-800MHz fMAX • <100ps IN-to-OUT tpd ■ Ultra-low jitter design:
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800MHz
SY89329V
DC-to-800MHz
100ps
10pspp
SY89329V
M9999-050604
SY89322V
SY89329VMITR
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MLF 132
Abstract: No abstract text available
Text: SY84402L 4.25Gbps VCSEL Driver General Description Features The SY84402L is a 3.3V VCSEL driver for applications up • 3.3V power supply to 4.25Gbps. The driver comes in a 2mm x 2mm MLF • Operates from 100Mps up to 4.25Gbps package which makes it less than half the size of any other
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SY84402L
25Gbps
SY84402L
25Gbps.
100Mps
100k-compatible
MIC300X
MLF 132
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VT 1165
Abstract: 402L MLF-10
Text: SY84402L 4.25Gbps VCSEL Driver General Description Features The SY84402L is a 3.3V VCSEL driver for applications up ∑ 3.3V power supply to 4.25Gbps. The driver comes in a 2mm x 2mm MLF ∑ Operates from 100Mps up to 4.25Gbps package which makes it less than half the size of any other
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SY84402L
25Gbps
SY84402L
25Gbps.
100Mps
25Gbps
100k-compatible
MIC300X
VT 1165
402L
MLF-10
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SY89322V
Abstract: SY89329V SY89329VMGTR SY89329VMITR
Text: Precision Edge ® SY89329V Precision Edge 3.3V/5V 800MHz LVTTL/LVCMOS-to-DIFFERENTIAL LVPECL TRANSLATOR Micrel, Inc. SY89329V FEATURES • Guaranteed AC performance over temp and voltage: • DC-to-800MHz fMAX • <100ps IN-to-OUT tpd ■ Ultra-low jitter design:
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SY89329V
800MHz
DC-to-800MHz
100ps
10psPP
SY89329V
M9999-072005
SY89322V
SY89329VMGTR
SY89329VMITR
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100EPT23
Abstract: 100ep58 100ept22 SY89223L SY89306 SY89307V SY89321L SY89322V SY89323L SY89329V
Text: Throw Away Those Big and Costly 100EL16s & 100EP16s! New PECL Buffers Available in 2mm x 2mm Package What PECL buffer would you rather use? Big "EL16s" or Tiny SY89206 SY89306 30mm2 Footprint Actual size 4mm2 Footprint Choose the Smallest Buffers or Translators for Your Designs
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100EL16s
100EP16s!
EL16s"
SY89206
SY89306
30mm2
SY89216V/SY89206
SY89316V/SY89306
SY89307V
SY89222L
100EPT23
100ep58
100ept22
SY89223L
SY89306
SY89307V
SY89321L
SY89322V
SY89323L
SY89329V
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MIC2103
Abstract: No abstract text available
Text: Micrel Linear and Power Solutions Broad Portfolio of DC/DC Switchers Fully Integrated/Triple Output MIC23450/MIC23451 - 3MHz PWM 2A/1A Triple Buck Regulator with HyperLight Load • Three independent 2A MIC23450 or 1A (MIC23451) outputs • Enhanced thermal
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MIC23450/MIC23451
MIC23450)
MIC23451)
MIC23303/MIC23603
12-Pin
MIC3205
MIC2103
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MIC2205
Abstract: MIC2206
Text: Ah, The Sweet Sound of. Nothing Micrel's Low Noise, High Efficiency, Buck Regulator for Cell Phones Remember the good old days when chipset designers used LDOs to solve their portable power needs? LDOs were quiet, simple, easy to use. Then, along came lower output voltages and with them, DC-to-DC converters – highly efficient, but noisy and sensitive to placement.
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MIC2205
com/ad/mic2205.
600mA
MIC2206
MIC2206
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LDO 1V output
Abstract: MIC2205 MIC2206
Text: Low-Noise, High-Efficiency: The Best of Both Worlds in the Tiniest Footprint Micrel's Low-Noise High-Efficiency PWM Buck Regulators Remember the good old days when chipset designers used LDOs to solve their portable power needs? LDOs were quiet, simple, easy to use. Then, along came
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MIC2205
MIC2206
600mA
MIC2205
MIC2206
MLF-10L
LDO 1V output
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CML1005
Abstract: SY55855V SY89325V SY89325VMI SY89325VMITR
Text: Precision Edge SY89325V Precision Edge™ 3.3V/5V 1.5Gbps DIFFERENTIAL CML/PECL/LVPECL-to-LVDS TRANSLATOR Micrel SY89325V FEATURES • Guaranteed AC performance over temp and voltage: • DC-to >1.5Gbps data rate throughput • >750MHz clock fMAX • <50ps within-device skew
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SY89325V
750MHz
10pspp
SY89325V
750MHz,
M9999-060304
CML1005
SY55855V
SY89325VMI
SY89325VMITR
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Untitled
Abstract: No abstract text available
Text: Precision Edge SY89325V ® Precision Edge 3.3V/5V 1.5Gbps DIFFERENTIAL CML/PECL/LVPECL-to-LVDS TRANSLATOR Micrel, Inc. SY89325V FEATURES • Guaranteed AC performance over temp and voltage: • DC-to >1.5Gbps data rate throughput • >750MHz clock fMAX • <50ps within-device skew
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SY89325V
750MHz
10psPP
350mV
SY89325V
M9999-072005
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