MICROLEADFRAME AMKOR Search Results

MicroLeadFrame Packages Pad Landing Recommendations

Abstract: 3641B atmel Reflow soldering die paddle IPC-SM-782 atmel touch pattern MLF 6x6 amkor exposed pad
Contextual Info: MicroLeadFrame Packages Pad Landing Recommendations 1. Introduction This application note provides PCB designers with a set of guidelines for successful board mounting of Atmel’s DataFlash memories housed in the MicroLeadFrame package. The MicroLeadFrame package MLF® is a near CSP plastic encapsulated

DUAL ROW QFN leadframe

Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Contextual Info: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Contextual Info: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses

PCB design for 0.2mm pitch csp package

Abstract: led matrix 8x8 mini circuits 0.3mm pitch csp package E30JA Amkor CSP mold compound Soldering guidelines and SMD footprint design led 3mm 8x8 matrix mlf 0.3mm pitch MLF 6x6 guideline pad dimension 1210
Contextual Info: Application Notes for Surface Mount Assembly of Amkor’s MicroLeadFrame MLF® Packages December 2003 Page 1 December 2003 Rev. E Contents 1.0 Introduction 3 2.0 Surface Mount Consideration 3 3.0 PCB Design Requirements 4 3.1 4 4 8 8 10 3.2 3.3 Page 2

qfn 48 7x7 stencil

Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size
Contextual Info: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical

PIC16F73

Abstract: PIC16C73B PIC16C72A AC164031 PIC16F76
Contextual Info: PICmicro Microcontrollers in Small-Scale MLF Packages Ideal For Applications Where Space is Vital Microchip Technology Inc. is producing a number of the company’s popular PICmicro® OTP and Flash microcontrollers in a new competitively-priced, space-saving MicroLeadframe MLF package.

"ESD Protection"

Abstract: "USB Transceiver" MIC2550 MIC2551 IEC-610004-4-2
Contextual Info: USB Transceiver Simplifies Design, Lowers System Cost The Good Stuff ◆ ESD protection compliant to IEC-610004-4-2 Level 3 ◆ 1.6V to 3.6V system I/O interface ◆ Re-enumerate device class under software control ◆ Compliant to USB 2.0 for full speed and low speed

L512 led

Abstract: Adjustable Current Regulator With Enable Control
Contextual Info: MIC2210 Micrel MIC2210 Dual µCap LDO with Open-Drain Driver Final General Description Features The MIC2210 is a dual µCap low dropout regulator with an open-drain driver and power-on reset circuit. The first regulator is capable of sourcing 150mA, while the second regulator can source up to 300mA and includes a power-on reset

PIP201-12M

Contextual Info: PIP201-12M Power MOSFETs are getting smarter with Philips Intelligent Power PIP , our latest development in power semiconductor architectures. The new devices are a family of integrated powertrain solutions designed specifically for DC/DC buck converter applications. PIP devices provide high output

PIP202-12M

Contextual Info: PIP202-12M Power MOSFETs are getting smarter with Philips Intelligent Power PIP , our latest development in power semiconductor architectures.The new devices are a family of integrated powertrain solutions designed specifically for DC/DC buck converter applications. PIP devices provide high output current in a small surface mount power package and provide

PIP201-12M

Contextual Info: Power MOSFETs are getting smarter with Philips Intelligent Power PIP , our latest development in power semiconductor architectures.The new devices are a family of integrated powertrain solutions designed specifically for DC/DC buck converter applications. PIP devices provide high output current in a small

Amkor Technology MLF

Abstract: MIC2288 MIC2289 MIC2290 MIC2292 MIC2293 "White LED Drivers"
Contextual Info: Power and System Management for Battery Powered Applications Organic Boost Regulators 2mm x 2mm MLF TM VIN OFF ON VIN VOUT 2" OEL PANEL OFF • >1A Switch Current MIC2288 • 1.2MHz PWM Operation 1" OEL PANEL MIC 2290 ON • >500mA Switch Current (MIC2290)

lqfp 64 Shipping Trays

Abstract: DS310H
Contextual Info: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging

marking 016L

Abstract: MLF-16 SY58016LMI
Contextual Info: 3.3V 10Gbps DIFFERENTIAL CML LINE DRIVER/RECEIVER WITH INTERNAL TERMINATION FEATURES • ■ ■ ■ ■ ■ ■ ■ SY58016L FINAL DESCRIPTION Accepts up to 10.7Gbps data < 45ps edge rate Gain ≥ 4V/V CML/PECL differential inputs CML outputs Internal 50Ω input termination

SY89322V

Abstract: SY89329V SY89329VMITR
Contextual Info: Precision Edge 3.3V/5V 800MHz LVTTL/LVCMOS-to-DIFFERENTIAL LVPECL TRANSLATOR Micrel SY89329V Precision Edge™ SY89329V FEATURES • Guaranteed AC performance over temp and voltage: • DC-to-800MHz fMAX • <100ps IN-to-OUT tpd ■ Ultra-low jitter design:

MLF 132

Contextual Info: SY84402L 4.25Gbps VCSEL Driver General Description Features The SY84402L is a 3.3V VCSEL driver for applications up • 3.3V power supply to 4.25Gbps. The driver comes in a 2mm x 2mm MLF • Operates from 100Mps up to 4.25Gbps package which makes it less than half the size of any other

VT 1165

Abstract: 402L MLF-10
Contextual Info: SY84402L 4.25Gbps VCSEL Driver General Description Features The SY84402L is a 3.3V VCSEL driver for applications up ∑ 3.3V power supply to 4.25Gbps. The driver comes in a 2mm x 2mm MLF ∑ Operates from 100Mps up to 4.25Gbps package which makes it less than half the size of any other

SY89322V

Abstract: SY89329V SY89329VMGTR SY89329VMITR
Contextual Info: Precision Edge ® SY89329V Precision Edge 3.3V/5V 800MHz LVTTL/LVCMOS-to-DIFFERENTIAL LVPECL TRANSLATOR Micrel, Inc. SY89329V FEATURES • Guaranteed AC performance over temp and voltage: • DC-to-800MHz fMAX • <100ps IN-to-OUT tpd ■ Ultra-low jitter design:

100EPT23

Abstract: 100ep58 100ept22 SY89223L SY89306 SY89307V SY89321L SY89322V SY89323L SY89329V
Contextual Info: Throw Away Those Big and Costly 100EL16s & 100EP16s! New PECL Buffers Available in 2mm x 2mm Package What PECL buffer would you rather use? Big "EL16s" or Tiny SY89206 SY89306 30mm2 Footprint Actual size 4mm2 Footprint Choose the Smallest Buffers or Translators for Your Designs

MIC2103

Contextual Info: Micrel Linear and Power Solutions Broad Portfolio of DC/DC Switchers Fully Integrated/Triple Output MIC23450/MIC23451 - 3MHz PWM 2A/1A Triple Buck Regulator with HyperLight Load • Three independent 2A MIC23450 or 1A (MIC23451) outputs • Enhanced thermal

MIC2205

Abstract: MIC2206
Contextual Info: Ah, The Sweet Sound of. Nothing Micrel's Low Noise, High Efficiency, Buck Regulator for Cell Phones Remember the good old days when chipset designers used LDOs to solve their portable power needs? LDOs were quiet, simple, easy to use. Then, along came lower output voltages and with them, DC-to-DC converters – highly efficient, but noisy and sensitive to placement.

LDO 1V output

Abstract: MIC2205 MIC2206
Contextual Info: Low-Noise, High-Efficiency: The Best of Both Worlds in the Tiniest Footprint Micrel's Low-Noise High-Efficiency PWM Buck Regulators Remember the good old days when chipset designers used LDOs to solve their portable power needs? LDOs were quiet, simple, easy to use. Then, along came

CML1005

Abstract: SY55855V SY89325V SY89325VMI SY89325VMITR
Contextual Info: Precision Edge SY89325V Precision Edge™ 3.3V/5V 1.5Gbps DIFFERENTIAL CML/PECL/LVPECL-to-LVDS TRANSLATOR Micrel SY89325V FEATURES • Guaranteed AC performance over temp and voltage: • DC-to >1.5Gbps data rate throughput • >750MHz clock fMAX • <50ps within-device skew

Contextual Info: Precision Edge SY89325V ® Precision Edge 3.3V/5V 1.5Gbps DIFFERENTIAL CML/PECL/LVPECL-to-LVDS TRANSLATOR Micrel, Inc. SY89325V FEATURES • Guaranteed AC performance over temp and voltage: • DC-to >1.5Gbps data rate throughput • >750MHz clock fMAX • <50ps within-device skew