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    Abstract: No abstract text available
    Text: PDF: 2003 Jun 19 Philips Semiconductors PC board footprint HBCC16; SOT639-2 FOOTPRINT REFLOW SOLDERING handbook, full pagewidth PA = OA = 3.40 (2x) 1.35 (2×) 0.675 (2×) solder lands solder resist 0.50 (8×) 0.075 clearance 0.150 0.35 (4×) 0.30 Cu + SP


    Original     		PDF HBCC16; OT639-2 MGX374