METHOD 101 Search Results

HD-BNC

Abstract: AMPHENOL Spanner Amphenol HD-BNC 4028 BE
Contextual Info: 2. REV MECHANICAL: A. DURABILITY: 4. ENVIRONMENTAL: A. THERMAL SHOCK PER MIL-STD-202 METHOD 107 TEST CONDITION B EXCEPT HIGH TEMP @200 C B. VIBRATION: MIL-STD-202 METHOD 204 TEST CONDITION B C. SHOCK: MIL-STD-202 METHOD 213 TEST CONDITION B D. CORROSION: MIL-STD-202 METHOD 101

HD-BNC

Abstract: 4028 BE 800REF
Contextual Info: 2. REV MECHANICAL: A. DURABILITY: 4. ENVIRONMENTAL: A. THERMAL SHOCK PER MIL-STD-202 METHOD 107 TEST CONDITION B EXCEPT HIGH TEMP @200 C B. VIBRATION: MIL-STD-202 METHOD 204 TEST CONDITION B C. SHOCK: MIL-STD-202 METHOD 213 TEST CONDITION B D. CORROSION: MIL-STD-202 METHOD 101

Option Information

Contextual Info: Work-In-Progress Option Information www.vishay.com Vishay Siliconix MIL-PRF-38535 Class Level B Process Flow MIL-STD-883/M5004 INTERNAL VISUAL METHOD 2010 CONDITION B TEMP CYCLE METHOD 1010 CONDITION C CONSTANT ACCELERATION METHOD 2001 CONDITION E PRE-BURNIN ELECTRICAL

no-go

Contextual Info: HVCMOS IC Process Option Flows RB PRODUCT FLOW 1 (SIMILAR TO MIL-STD-883 CLASS B) RC PRODUCT FLOW COMMERICAL PRODUCT FLOW Preseal Visual Method 2010, Condition B Preseal Visual Method 2010, Condition B Temperature Cycle (2) Method 1010, Condition C, 10 Cycles, -65°C to + 150°C

an5241

Abstract: ADJD-J823 new bright J82-3 AV02-1422EN new bright R288-2
Contextual Info: ADJD-J823 Method of Fast Brightness Change Using BRIGHT Register of ADJD-J823 Application Note 5398 Introduction Description of Method This application note describes a method to speed up brightness change using BRIGHT register of the ADJD-J823 color management controller. This method is an extension

LAMBDA lrs

Abstract: lrs-55-28 LRS-57-28 LRS-55-5 Lambda LRS-54-20 lrs 50-5 lrs-52-6 LRS-53-28 LRS-55-24 LRS-57-5
Contextual Info: PART IA-AC-TO-DC SWITCHING POWER SUPPLIES CD Passed environmental tests in accordance with MIL-STD-810C. Low Pressure — Method 500.1, Proc. I. High Temperature — Method 501.1, Proc. I & II. Low Temperature — Method 502.1, Proc. I. Temperature Shock — Method 503.1, Proc. I.

UP Board Exam Date Sheet 2012 for Intermediate

Abstract: sem 5025 MIL-STD-883H INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION QML-38535 INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION report MARKING CODE 883H
Contextual Info: MIL-STD-883H METHOD 5001 PARAMETER MEAN VALUE CONTROL 1. PURPOSE. The purpose of this method is to define a technique for assuring a conformance to a maximum or minimum mean of a parameter measured in any test method listed in section 3000 and 4000 of this standard. This method

Contextual Info: Environmental / Mechanical Specifications F5 C A L IB E R E L E C T R O N IC S IN C . MECHANICAL Shock: MIL-STD-883C, Method 2002, Condition B Solderability: MIL-STD-883C, Method 2003 Vibration MIL-STD-883C, Method 2007, Condition A Terminal Strength: MIL-STD-202F, Method 211, Conditions A and C

mil-std-202

Abstract: mil-std-202 101D 101D 106F "MIL-STD-202" "METHOD 302" "CONDITION B"
Contextual Info: 2 WEATHERTIGHT CONNECTORS PRODUCT BULLETIN 541 Specifications continued Environmental Temperature Limits: -40°C to +65°C non-operating Moisture Resistance: Mil-Std 202 Method 106F Insulation Resistance: Mil-Std 202 Method 302 condition B Thermal Shock: Mil-Std 202 Method 107G

Ac 472 m

Contextual Info: Axial Leads/Glass Encapsulation GENERAL DESCRIPTION Lead Pull & Torsion per MIL-STD-202, Method 211, Condition A & D Resistance to Soldering Heat perMIL-STD-202,Method210, Condition B Vibration and Shock per MIL-STD-202, Method 204, Condition B and Method 213, Condition I

Contextual Info: 3M Electrically Conductive Connector Covers Properties Material Properties Property Test Method Typical Value Resistivity ASTM D991 <105 ohm-cm Contact Corrosivity Kovar plate FTM 101C Method 3005 Pass Crayoning 3M Not visible Elongation ASTM D638 25%

transistor 1015

Contextual Info: Digital ASIC Military Class B Product Flow SPC, QC Monitors Wafer Fabrication SPC, QC Monitors Wafer Sort Electrical Test SPC, QC Monitors Saw, Die Attach and Wire Bond SPC, QC Monitors Internal Visual Method 2010, Condition B Mechanical Tests Method 2011 and Method 2019

c code for convolution

Abstract: Spectrum Signal Processing
Contextual Info: CHAPTER FFT Convolution 18 This chapter presents two important DSP techniques, the overlap-add method, and FFT convolution. The overlap-add method is used to break long signals into smaller segments for easier processing. FFT convolution uses the overlap-add method together with the Fast Fourier

Contextual Info: CFPV-45, -46 ISSUE 2; 18 OCTOBER 2004 Delivery Options • Please contact our sales office for current leadtimes Environmental Specification ■ Mechanical shock per MIL-STD-202, Method 213, Cond. E. ■ Thermal shock per MIL-STD-883, Method 1011, Cond. A

Contextual Info: Noise, MIL-STD-202, Method 308 -20 dB max. Moisture resistance, MIL-STD-202, Method 106 - Hermetic applications ±0.2% max. R/R Stability, 1000 hr., +125°C, 100mw ±0.2% max. R/R Operating tem perature range -55°C to +125°C Thermal shock, MIL-STD-202, Method 107, Test Condition F

method d 1071

Abstract: LTPD
Contextual Info: DMOS Process Option Flow Chart DMOS ARRAY RB FLOW 1 (SIMILAR TO MIL-STD-883 CLASS B) Preseal Visual Method 2010, Condition B Temperature Cycle Method 1010, Condition C, 10 Cycles, -65°C to +150°C 10 minutes minimum @ each temperature extreme Constant Acceleration

MSK196RH

Contextual Info: MIL-PRF-38534 AND 38535 CERTIFIED FACILITY M.S.KENNEDY CORP. 196RH RAD HARD PRECISION RAIL TO RAIL CURRENT SENSE FEATURES: Manufactured using RH6105 Dice Radiation Hardened to 100 Krad Si (Method 1019.7 Condition A) Low Dose Rate Hardened to 50 Krad(Si) (Method 1019.7 Condition D)

MSK196EDU

Contextual Info: MIL-PRF-38534 AND 38535 CERTIFIED FACILITY M.S.KENNEDY CORP. 196RH RAD HARD PRECISION RAIL TO RAIL CURRENT SENSE FEATURES: Manufactured using RH6105 Dice Radiation Hardened to 100 Krad Si (Method 1019.7 Condition A) Low Dose Rate Hardened to 50 Krad(Si) (Method 1019.7 Condition D)

K/MSK496EDU

Contextual Info: MIL-PRF-38534 & 38535 CERTIFIED FACILITY M.S.KENNEDY CORP. RAD HARD QUAD PRECISION RAIL TO RAIL CURRENT SENSE AMP 496RH FEATURES: Manufactured using RH6105 Dice Radiation Hardened to 100 Krad Si (Method 1019.7 Condition A) Low Dose Rate Hardened to 50 Krad(Si) (Method 1019.7 Condition D)

Contextual Info: MIL-PRF-38534 & 38535 CERTIFIED FACILITY M.S.KENNEDY CORP. RAD HARD QUAD PRECISION RAIL TO RAIL CURRENT SENSE AMP 496RH FEATURES: Manufactured using RH6105 Dice Radiation Hardened to 100 Krad Si (Method 1019.7 Condition A) Low Dose Rate Hardened to 50 Krad(Si) (Method 1019.7 Condition D)

pic18f4520 pin diagram

Abstract: PIC18F4550 indirect addressing microchip pic18f4550 pic18f4xx DS39622 pic18F4550 configuration PIC18F4585 PIC18F4580 example code PIC18F2321 PIC18F2423
Contextual Info: PIC18F2XXX/4XXX FAMILY Flash Microcontroller Programming Specification 1.0 DEVICE OVERVIEW ICSP method is slightly different than the high-voltage method and these differences are noted where applicable. This document includes the programming specifications

pic18f4520 pin diagram

Abstract: PIC18F2550 icsp PIC18F4580 example code PIC18F2XXX pic18F4550 configuration PIC18F4620 analog port number pic18f2550 program load circuit free PIC18F4XXX PIC18F2450 usb PIC18F2553
Contextual Info: PIC18F2XXX/4XXX FAMILY Flash Microcontroller Programming Specification 1.0 DEVICE OVERVIEW ICSP method is slightly different than the high-voltage method and these differences are noted where applicable. This document includes the programming specifications

M/mrf 405

Contextual Info: MILITARY KNOBS MS91528, QPL LISTED M A T E R IA L ; KNOB: Molded of polycarbonate self extinguishing thermoplastic. Matte Finish. (Method 111 of Ml L-Std 202) M ETAL IN S E R T ; Aluminum, plated to withstand salt spray. (Method 101, test condition B, of Ml L-Std 202)

pioneer pll

Abstract: simple F.M. transmitter understanding thermal basics for microwave power CP-01052-1
Contextual Info: DesignCon 2009 A New Jitter Classification Method Based on Statistical, Physical, and Spectroscopic Mechanisms Mike Li, Ph.D., Altera Corporation CP-01052-1.0 February 2009 Abstract This paper introduces a new jitter classification method based on jitter physical mechanisms