MCB08 Search Results

Meritek

Contextual Info: MCB08 Series WL Series Wire Wound Chip Inductor MERITEK RoHS FEATURES •      Very strong solderability by flow soldering, soldering iron or wave soldering Highly accurate dimensions, can be mounted automatically Terminals are highly resistant to pull forces

Contextual Info: Chip Dimension & Packaging Chip Bead Dimensions : • 1 < BW Part Number MCB0805 series Length L Inch (mm) 0.079 ± 0.008 (2.00 ± 0.20) MCB1206 series 0.126 ±0.008 (3.20 ± 0.20) 0 Í77 ± 0.010 (4.50 ± 0.25) MCB18Ö6 series — t-m t — Width (W) Inch (mm)

MCB08

Abstract: microcontroller
Contextual Info: General Purpose HC S 08 SNAP Microcontroller MCB08 Features ü ü ü ü ü The MCB08 offers a complete, easy to use hardware/software package for low-cost, low-power 3.3VDC embedded applications. The compact size of the MCB08 and low-power requirements allow it to be used in handheld,

MCB0805G102

Abstract: MCB0805F600 MCB0805G601
Contextual Info: Multilayer Ferrite Chip Inductors Surface Mount The MCI Series ferrite chip inductors for surface mount are manufactured in the U.S.A., with unique multi­ layer process and equipment technologies as well as proprietary materials, including ferrites, internal elec­

MCB0805G601

Abstract: MCB0603G121 0805g MCB0402G241 MCB0805G751 MCB1206G202 MCB0603G151 MCB1806F600 MCB1812F121 AEM MCB
Contextual Info: AEM, Inc. Multilayer Ferrite Chip Beads Features Operating Temperature • Monolithic structure for closed magnetic path and high reliability • Standard EIA/EIAJ chip sizes such as 0402/1005, 0603/1608, 0805/2012, and 1206/3216 • A complete set of ferrite and electrode materials providing a wide

spw 080

Abstract: LEM3225 CL-2M2012-900JT TKS 0603 FBM3216HS800-T ACB2012M-150-T LAL04TB 494LYF FBM2125HS420-T m5258
Contextual Info: CT Technologies - Cross Reference Competitor Part CTC Part 0402R CT0402CSF 0402CS-P CT0402CSF 0402CS L CT0402CSF 0402CS CT0402CSF 0402 CT0402CSF 555-0402 CT0402CSF PE-0402CD CT0402CSF 0402AS CT0402CSF ELJNK CT0402CSF GLZG CT0402CSF KQ0402 CT0402CSF KQT0402L

Contextual Info: RF Power Modules INDEX SELECTION GUIDE GENERAL CONTENTS Page 5 8 12 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Contextual Info: Multilayer Ferrite Chip Inductors Surface Mount The MCI Series ferrite chip inductors for surface mount are manufactured in the U.S.A., with unique multi­ layer process and equipment technologies as well as proprietary materials, including ferrites, internal elec­

LM3661TL-1.25

Contextual Info: MCB Series Mutilayer Chip Bead MERITEK Feature and Applications •  Effective EMI protection Low DC resistance High soldering heat resistance Multiple size availability Computers and Peripheral Equipment VCRS, Television, Pagers Cellular Phones

BGY110F

Abstract: Amplifier Modules PHILIPS UHF AMPLIFIER MODULE LIST FERROXCUBE 4330 BGY110D MCB102
Contextual Info: Philips Components Datasheet status Product specification date of issue May 1991 BGY110D/BGY110E/BGY110F UHF amplifier modules DESCRIPTION MECHANICAL DATA The BGY110 is afour-stage UHF amplifier module, primarily designed for hand-held transmitting equipment

MCB1206F500

Abstract: MCB0603G100 1608 package 0603g 603G MCB0402G221 MCB0805F300
Contextual Info: AEM Components Co., Ltd Multilayer Ferrite Chip Beads Features Operating Temperature • Monolithic structure for closed magnetic path and high reliability  Standard EIA/EIAJ chip sizes such as 0402/1005, 0603/1608, 0805/2012, and 1206/3216  A complete set of ferrite and electrode materials providing a wide

Contextual Info: AEM Components Co., Ltd Multilayer Ferrite Chip Beads High Speed Features Operating Temperature • Monolithic structure for closed magnetic path and high reliability  Standard EIA/EIAJ chip sizes such as 0402/1005, 0603/1608, -55ºC — +125ºC 0805/2012, and 1206/3216

Contextual Info: KOA SPEER ELECTRONICS, INC. SS-219 R5 Multi Layer Ferrite Chip Beads Type MCB CERTIFIED 1. General • Designed to reduce noise at high frequencies ■ Standard EIA Packages: 0402, 0603, 0805, 1206 ■ Nickel barrier with solder overcoat for excellent solderability

SS219

Abstract: SS-219 MCB1206FTE700
Contextual Info: SS-219 R4 Printer's 3/21/0 1:11 PM Page 1 SS-219 R4 Multi Layer Ferrite Chip Beads Type MCB CERTIFIED 1. General • Designed to reduce noise at high frequencies ■ Standard EIA Packages: 0603, 0805, 1206, 1806, 1812 ■ Nickel barrier with solder overcoat for excellent solderability

MCB0603G121

Abstract: type b mcb FERRITE BEAD 1000 OHM 0805 mcb with z curve MCB0805F400 0805g mcb DATASHEET FERRITE 858 type 2 mcb 0603G
Contextual Info: AEM, Inc. Multilayer Ferrite Chip Beads Features • Monolithic structure for closed magnetic path and high reliability • Standard EIA/EIAJ chip sizes such as 0402/1005, 0603/1608, 0805/2012, and 1206/3216 • A complete set of ferrite and electrode materials providing a wide

Contextual Info: N AUER PHILIPS/DISCRETE bTE ]> • bbS3T31 QD3Q2bfl 347 r n m p s u o m p o n e n ts D atash eet status Product specification date o f issue May 1991 BGY110D/BGY110E/BGY110F UHF amplifier modules DESCRIPTION MECHANICAL DATA The BGY110 is a four-stage UHF amplifier module, primarily designed

mcB14

Abstract: MCB15 MCU07
Contextual Info: A I CO PRODUCTS GUIDE RF MODULATORS RF MODULATORS MCB15 SERIES S AW R TYPE 1. RF sw itch equipped m odulator fo r in side appliances. 1 . High 2. Approx. 50% sm aller than our prior models. 2. W id e R F o u tp u t ra n ge : 21 ch - 6 9 ch 12 C BUS . 3. T e st pattern included in m odels fo r P AL and

MCB0603S

Abstract: MCB type MCB1206FTE
Contextual Info: KOA SPEER ELECTRONICS, INC. SS-219 R6 AHA 12/19/01 Multi Layer Ferrite Chip Beads Type MCB CERTIFIED 1. General • Designed to reduce noise at high frequencies ■ Standard EIA Packages: 0402, 0603, 0805, 1206 ■ Nickel barrier with solder overcoat for excellent solderability

INDUCTOR CHIP FERRITE BEAD 0805

Abstract: MCB0603S MCB1206FTE101 MCB0805GTE121
Contextual Info: MULTILAYER FERRITE MCB CHIP BEADS SPEER ELECTRONICS, INC. MULTI LAYER FERRITE • Designed to reduce noise Chip frequencies • Standard EIA Packages: 0402, 0603, 0805, 1206 • Nickel Barrier w/Solder • Magnetically Shielded NEW TYPE 0402 L 0.039±0.004

type b mcb

Abstract: 0805G121 0805g FERRITE BEAD 1000 OHM 0805 mcb with z curve MCB120 MCB0603G190 mcb DATASHEET MCB0402G400 MCB1210G600
Contextual Info: AEM, Inc. Multilayer Ferrite Chip Beads Sn/Pb Terminations Features Operating Temperature • Monolithic structure for closed magnetic path and high reliability • Standard EIA/EIAJ chip sizes such as 0402/1005, 0603/1608, 0805/2012, and 1206/3216 • A complete set of ferrite and electrode materials providing a wide

sii 9136

Abstract: SiI0680ACLU144 BA5 marking code transistor ROHM LI0805E400R HDMI TO VGA MONITOR PINOUT Silicon Image 680 SiI0680ACL144 hard disk ATA pcb schematic SII0680 SiI0680A
Contextual Info: Data Sheet SiI0680A PCI to IDE/ATA Data Sheet Document # SiI-DS-0069-C SiI0680A PCI to IDE/ATA Data Sheet Silicon Image, Inc. Revision History: Version Comment Date Rev. 0.1 First draft from Engineering Design Specification 08/07/00 Rev. 0.2 Additional register definitions added

Contextual Info: KOA SPEER ELECTRONICS, INC. SS-219 R5 AHA 06/21/01 Multi Layer Ferrite Chip Beads Type MCB CERTIFIED 1. General • Designed to reduce noise at high frequencies ■ Standard EIA Packages: 0402, 0603, 0805, 1206 ■ Nickel barrier with solder overcoat for excellent solderability

CBZ1206-202-30

Abstract: CBZ1206-202 CBC0805-600-202 cbz0805-252-20 CBC0603-600-102 CBP0805-600-152 cbc0805-12-152 CBC0603-470-102 ACB-0805A CBG0402-120-10
Contextual Info: MULTILAYER CHIP BEADS EMI SUPPRESSORS FEATURES 100% NO LEAD terminal component Multilayer technology, offering Monolithic structure, excellent for high reliability 100% Magnetic shielding, absolutely ZERO CROSS TALK Excellent solderability and very high heat resistance

UHF amplifier module

Abstract: BGY110F uhf amplifier design transistor CD 910 905-890 SL 100 NPN Transistor uhf amplifier 110G BGY110D BGY110E
Contextual Info: Product specification Philips Semiconductors , 1U_ . . . UHF amplifier modules BGY110D; BGY110E; BGY110F; BGY110G PINNING - SOT246 DESCRIPTION The BGY110 is a four-stage UHF amplifier module, primarily designed for hand-held transmitting equipment operating from a nominal