MARKING CODE TQFP-48 PACKAGE Search Results

LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

TQFP 100 pin ic

Abstract: 208ld
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

NATIONAL SEMICONDUCTOR MARKING CODE sot

Abstract: national marking code NATIONAL SEMICONDUCTOR MARKING CODE DEVICE MARKING CODE table sot-23 MARKING CODE ZA On semiconductor date Code dpak YEAR A national top marking codes national marking date code national marking code sot sot23 mark code KS
Contextual Info: Device Marking Conventions National Semiconductor marks devices sold in order to provide device identification and manufacturing traceablility information. The method of presenting the information marked on the device is dependent on the size of the device package

TQFP 100 pin ic

Abstract: tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124
Contextual Info: LEADFRAME data sheet TQFP Features: Thin Quad Flat Pack TQFP Packages: Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink

xc9572xl pin configuration

Abstract: XC9572XL XC9572XL-10PCG44C XC9572XL-10CS48I XC9572XL-10VQG44C XC9572XL-7TQ100C XC9572XL-10PC44C xc9572xl-10PCG44C pin XC9572XL-7PCG44C XC9572XL-5TQG100C
Contextual Info: XC9572XL High Performance CPLD R DS057 v2.0 April 3, 2007 Features • • • • • • • • • • • 5 ns pin-to-pin logic delays System frequency up to 178 MHz 72 macrocells with 1,600 usable gates Available in small footprint packages - 44-pin PLCC (34 user I/O pins)

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

MLX81207

Abstract: 008MIN JESD22-B102 tray drawing tqfp 5x5 tray drawing tqfp 7x7
Contextual Info: MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:

MLX81207

Abstract: MLX81215 PEAK TRAY QFN 5X5 JEDEC TRAY DIMENSIONS QFN 5x5 MLX81205 Melexis LIN tray drawing tqfp 5x5 MLX16 TRANSISTOR SMD MARKING CODE BLDC tray drawing tqfp 7x7
Contextual Info: MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:

IDT package marking

Abstract: IDT marking IDT marking TQFP IDT TOP SIDE package marking A-0410-02 IDT CODE DATE marking MQUAD pbga 144 TQFP 132 PACKAGE PDIP-48
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0410-02 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: 10/5/2004 DATE: All IDT Products (see attached list)

Contextual Info: Not Recommendated For New Designs TLV990Ć28 3ĆV, 10ĆBIT, 28ĆMSPS AREA CCD ANALOG FRONT END SLAS300A − AUGUST 2000 − REVISED MARCH 2004 features application D Single-Chip CCD Analog Front-End D 10-Bit, 28-MSPS, Single 3-V Supply D D D D D D D 48-Pin TQFP Package

QFN47

Abstract: MLX81207 melexis hall current sensor MLX16-FX QFN48 5x5 package JEDEC TRAY DIMENSIONS QFN 5x5 sensorless bldc driver
Contextual Info: MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:

tqfp 7x7

Abstract: MLX16-FX
Contextual Info: MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:

TLV990-13

Contextual Info: Not Recommended for New Designs TLV990-13 3-V, 10-BIT, 13-MSPS AREA CCD ANALOG FRONT END SLAS282 – JULY 2000 features D D D D D D D D 48-Pin TQFP Package D D Digital Still Camera PC Camera PFB PACKAGE TOP VIEW STBY RESET CS SDIN SCLK ADCCLK D Single-Chip CCD Analog Front-End

TSSOP YAMAICHI SOCKET

Abstract: TSSOP-56 footprint texas JEDEC Jc-11 mo-205 free IDT marking IDT package marking LVCH JEDEC Jc-11 free OREGA IC280-096-144 marking B44 RC3041
Contextual Info: 32 Bit Logic Families in LFBGA packages: 96 and 114 Balls Low Profile Fine Pitch BGA Packages. Application Note. October 26th, 1998 by: Sylvie Kadivar, Philips Semiconductors Maria Balian, Texas Instruments Ed Agis, Texas Instruments Valentino Liva, Integrated Device Technology

RC3041

Abstract: RC3715 RC3740 RC4650 IDT package marking LVCH OREGA
Contextual Info: 32-Bit Logic Families in LFBGA Packages: 96 and 114 Ball Low-Profile Fine-Pitch BGA Packages Application Note October 26th, 1998 by: Sylvie Kadivar, Philips Semiconductors Maria Balian, Texas Instruments Ed Agis, Texas Instruments Valentino Liva, Integrated Device Technology

marking code f4 3 pin

Contextual Info: XC9572XV High-performance CPLD R DS052 v2.6 April 15, 2005 5 Product Specification Features • • • • • • • • PTOTAL = PINT + PIO = ICCINT x VCCINT + PIO 72 macrocells with 1,600 usable gates Available in small footprint packages - 44-pin PLCC (34 user I/O pins)

DS052

Contextual Info: XC9572XV High-performance CPLD R DS052 v2.7 January 16, 2006 5 Features • • • • • • • • 72 macrocells with 1,600 usable gates Available in small footprint packages - 44-pin VQFP (34 user I/O pins) - 100-pin TQFP (72-user I/O pins) Optimized for high-performance 2.5V systems

footprint jedec MS-026 TQFP

Abstract: dsPIC30F6001 dsPIC30F6003 DSPIC30F PWM4L 14X14X1 JEDEC MS-026 footprint footprint jedec MS-026 TQFP 44 C04-092
Contextual Info: M dsPIC30F Early Production Devices High Performance 16-bit Microcontrollers  2002 Microchip Technology Inc. Advance Information DS70085A Note the following details of the code protection feature on PICmicro MCUs. • • • • • • The PICmicro family meets the specifications contained in the Microchip Data Sheet.

IDT package marking

Abstract: IDT CODE DATE marking FORMAT IDT package marking tssop IDT marking code soic millipaq80 DTQS338 IDT CODE DATE marking IDT Package ssop-28 Marking format idt 20 PIN SOIC IDT marking TQFP
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN 5/1/99 PCN #: L9904-01 DATE: Product Affected: All Quality Semiconductor, Inc. Products Manufacturing Location Affected: See below 6/28/99 Date Effective:

S-PQFP-G48

Contextual Info: Not Recommended For New Designs TLV990Ć21 3ĆV, 10ĆBIT, 21ĆMSPS AREA CCD ANALOG FRONT END SLAS299A − AUGUST 2000 − REVISED MARCH 2004 features application D Single-Chip CCD Analog Front-End D 10-Bit, 21-MSPS, Single 3-V Supply D D D D D D D 48-Pin TQFP Package

vhdl code for dice game

Abstract: Video Proc 3.3V 0.07A 64-Pin PQFP ez811 GRAPHICAL LCD interfaced with psoc 5 cypress ez-usb AN2131QC CYM9239 vhdl code PN 250 code generator CY3649 cy7c63723 Keyboard and Optical mouse program CY7C9689 ethernet
Contextual Info: Product Selector Guide Communications Products Description Pins Part Number Freq. Range Mbps ICC (mA) Packages* 3.3V SONET/SDH PMD Transceiver 2.5V SiGe Low Power SONET/SDH Transceiver SONET/SDH Transceiver w/ 100K Logic 2.5 G-Link w/ 100K Logic OC-48 Packet Over SONET (POS) Framer

KGA0E000BA

Abstract: kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC
Contextual Info: Mobile SoC Code Information • Microcontroller • MSP • MOS August 2009 -1- Part Number Decoder Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte

QFN48 5x5 package

Contextual Info: MLX81205/07/10/15 123456278 Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:

smd code marking 56 sot23-6

Abstract: marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5
Contextual Info: PACKAGING Package Information Packaging & Ordering Packaging Solutions for Modern Electronic Design In addition to standard legacy packaging, Pericom leads the industry in smaller, more advanced packaging profiles and footprints for today’s designers. Our offerings include very small packages,