SAC396
Abstract: No abstract text available
Text: Package Information www.vishay.com Vishay Siliconix WCSP4: 4 Bumps 2 x 2 , 0.4 mm pitch, 208 m bump height, 0.8 mm x 0.8 mm die size Mark on backside of die 1 A 2 1 2 W A A B e 4xØb D Pin 1 mark B B Note 3 A1 A e D Bump Note 2 Notes (1) Laser mark on the backside surface of die
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SAC396
T11-0497-Rev.
10-Oct-11
10-Oct-11
SAC396
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MO-069
Abstract: No abstract text available
Text: OPEN TOP TYPE TEST & BURN-IN IC SOCKETS B.Q.F.P. Bumpered Quad Flat Pack YAMAICHI 211 Series • ORDERING CODE IC211 - 084 4 - 001 N - K Protection Key K: With Protection Key No Mark: Without Protection Key Positioning Pin N: Without Positioning Pin _No Mark: With Positioning Pin
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IC211
IC211-0844-001
IC211-1004-004
IC211-1324-002
IC211-1644-003
MO-069
500VDC
MO-069
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7 bit hamming code
Abstract: hamming encoding hamming encoder AN1221 HC05 HC08 HC08 c code example AN-1221 HC08 code example IASM08
Text: Freescale Semiconductor, Inc. MOTOROLA SEMICONDUCTOR APPLICATION NOTE Order this document by AN1221/D AN1221 Hamming Error Control Coding Techniques with the HC08 MCU by Mark McQuilken & Mark Glenewinkel CSIC Applications Freescale Semiconductor, Inc. INTRODUCTION
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AN1221/D
AN1221
7 bit hamming code
hamming encoding
hamming encoder
AN1221
HC05
HC08
HC08 c code example
AN-1221
HC08 code example
IASM08
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ultra fine pitch BGA
Abstract: C49B 22-N-4
Text: HIGH DENSITY PACKAGE APPLICATIONS FOR WIRE BOND AND FLIP CHIP: SMALL, FINE PITCH BGA PACKAGES Mark J. Kuzawinski International Business Machines Corp. Endicott, New York Biography Mark Kuzawinski graduated from Worcester Polytechnic Institute with a BSEE in 1978 and
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plessey mark 22 connectors
Abstract: plessey connector assembly CT 00 RT 53884 05124 circular connector plessey connectors AB Connectors "1.6 - 20 UNEF-2A LL 20 AB plessey mark 14 connectors
Text: Mk 22 Connectors Index CIRCULAR CONNECTORS MARK 22 General Description and Classification The Mark 22 Connector Family Orientation Insulator Shelf Size/Contact Arrangements 1 2 3 4, 5 Free U nit Cable Clamping Style A Free U nit with Shrink Sleeve Outlet Style G
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7 bit hamming code
Abstract: AN1221 HC05 HC08 hamming encoding
Text: MOTOROLA SEMICONDUCTOR APPLICATION NOTE Order this document by AN1221/D AN1221 Hamming Error Control Coding Techniques with the HC08 MCU by Mark McQuilken & Mark Glenewinkel CSIC Applications INTRODUCTION This application note is intended to demonstrate the use of error control coding ECC in a digital transmission system. The HC08 MCU will be used to illustrate the code development of this process. A message
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AN1221/D
AN1221
7 bit hamming code
AN1221
HC05
HC08
hamming encoding
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7 bit hamming code
Abstract: AN1221 HC05 HC08 AN-1221 ARCO A70 Motorola application Note 1221 IASM08
Text: Order this document by AN1221/D Freescale Semiconductor AN1221 Hamming Error Control Coding Techniques with the HC08 MCU by Mark McQuilken & Mark Glenewinkel CSIC Applications Freescale Semiconductor, Inc. INTRODUCTION This application note is intended to demonstrate the use of error control coding ECC in a digital transmission system. The HC08 MCU will be used to illustrate the code development of this process. A message
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AN1221/D
AN1221
7 bit hamming code
AN1221
HC05
HC08
AN-1221
ARCO A70
Motorola application Note 1221
IASM08
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NVIDIA GPU
Abstract: NVIDIA quadro NVIDIA geforce NVIDIA geforce nvidia register nvidia* gpu GDC Tutorial Advanced OpenGL Game Development
Text: GDC Tutorial: Advanced OpenGL Game Development A Practical and Robust Bump-mapping Technique for Today’s GPUs March 8, 2000 Mark J. Kilgard Graphics Software Engineer NVIDIA Corporation “Hardware Bump Mapping” mostly hype so far Previous techniques •• Prone
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HP 4194A calibration
Abstract: SG 9B sg 3425 909d HP 4194A 4275a
Text: TECHNICAL INFORMATION RELIABILITY AND CHARACTERIZATION OF MLC DECOUPLING CAPACITORS WITH C4 INTERCONNECTIONS Donald Scheider, Donald Hopkins, Paul Zucco, Edward Moszczynski, Michael Griffin, Mark Takacs IBM Microelectronics Division Hudson Valley Research Park
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S-RCMD00M301-R
HP 4194A calibration
SG 9B
sg 3425
909d
HP 4194A
4275a
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HP 4194A calibration
Abstract: 3,2nf capacitor 10107-B
Text: TECHNICAL INFORMATION RELIABILITY AND CHARACTERIZATION OF MLC DECOUPLING CAPACITORS WITH C4 INTERCONNECTIONS Donald Scheider, Donald Hopkins, Paul Zucco, Edward Moszczynski, Michael Griffin, Mark Takacs IBM Microelectronics Division Hudson Valley Research Park
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h80-539-1501
S-RCMD00M301-R
HP 4194A calibration
3,2nf capacitor
10107-B
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16-channel darlington array
Abstract: example code LTC2448 LTC3544B 7805 12v to 5v 2a flyback converter 30kv dc output mark 68m 2108 npn transistor LTC2499 48v battery charger schematic diagram VISHAY VDR
Text: LINEAR TECHNOLOGY MArch 2007 IN THIS ISSUE… Cover Article Easy Drive Delta-Sigma ADCs Deliver Powerful Features and Reduce Design Mark Thoren Linear Technology in the News….2 Design Features
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RS485/RS422
SE-164
16-channel darlington array
example code LTC2448
LTC3544B
7805 12v to 5v 2a
flyback converter 30kv dc output
mark 68m
2108 npn transistor
LTC2499
48v battery charger schematic diagram
VISHAY VDR
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NVIDIA GPU
Abstract: nvidia* gpu light sensitive project eraser NVIDIA geforce OpenGL integrating sphere VECTOR GHT -453 geforce NVIDIA CORPORATION
Text: GDC 2000 Programming Session: Computations for Hardware Lighting and Shading March 10, 2000 Mark J. Kilgard Graphics Software Engineer NVIDIA Corporation Shading Computations Determine surface appearance •• Lighting Lighting effects effects •• Surface
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PE42556
Abstract: PE42552 power rf switch
Text: NEWS RELEASE EDITORIAL CONTACT: Mark Schrepferman, Director, Comm/Industrial Products Phone: 858-731-9512 Cindy Trotto, Marketing Communications Manager Phone: 602-750-7203 Peregrine Semiconductor Corporation 9380 Carroll Park Drive San Diego, CA 92121 www.psemi.com
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OpenGL
Abstract: NVIDIA geforce 7 nvidia NVIDIA quadro geforce nvidia register GDC Tutorial Advanced OpenGL Game Development NVIDIA geforce brick game NVIDIA CORPORATION
Text: GDC Tutorial: Advanced OpenGL Game Development An OpenGL Extension Safari March 8, 2000 Mark J. Kilgard Graphics Software Engineer NVIDIA Corporation OpenGL Extensions Abound OpenGL’s extension mechanism •• •• Approximately Approximately 200 200 extensions
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Untitled
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK BDTTDM VIEW TDP VIEW 1.60±0.05-—fc -[Ä] BUMP-1 SEE NOTE 2 |— 0.432±0.127 EX 0.102±0.025 ex n jpc+0.040 U.4d3_ooio iti 0.075 C A B © 0.010® C
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05-------------fc
021X0
017X0
DS2502X1
DS2502X1
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AN4095
Abstract: application note AN4095 PPCEABI MPC5566 Z760 e200 service z750 SPFP
Text: Freescale Semiconductor Application Note Document Number: AN4095 CodeWarrior Build Tools Options for Optimal Performance on the Power Architecture e200 Core by Mark Anderson Senior Compiler Engineer CodeWarrior Tools 1 Introduction This document provides two sets of options in the
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AN4095
AN4095
application note AN4095
PPCEABI
MPC5566
Z760
e200 service
z750
SPFP
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Untitled
Abstract: No abstract text available
Text: Package Information www.vishay.com Vishay Siliconix MICRO FOOT : 6-Bumps 1.6 mm x 2.4 mm, 0.8 mm Pitch, 0.290 mm Bump Height E 6x Ø b1 Mark on backside of die e e S2 G1 S1 S2 G2 S1 D e XXXXXX XXX S S b1 Note 5 6x 0.30 to 0.31 (Note 3) Solder mask-0.4 Note 2
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T15-0143-Rev.
27-Apr-15
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nvidia
Abstract: NVIDIA riva tnt 128 riva tnt 0x8128 WIN32 nvidia_multitexture_combiners NVIDIA CORPORATION riva 128 Application Hint 27 0x80E3
Text: All About OpenGL Extensions, including specifications for some significant OpenGL extensions Mark J. Kilgard * NVIDIA Corporation OpenGL is an extensible low-level graphics API. Extensible is the key word. OpenGL implementations are free to extend OpenGL’s basic rendering functionality with new rendering
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Untitled
Abstract: No abstract text available
Text: Package Information www.vishay.com Vishay Siliconix MICRO FOOT : 4-Bumps 1 mm x 1 mm, 0.5 mm Pitch, 0.286 mm Bump Height 4x Ø b1 S D G 4x 0.30 to 0.31 (Note 3) Solder mask-0.4 s e e XXXX XXX S D Mark on backside of die s e e D Recommended land pattern
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T15-0176-Rev.
27-Apr-15
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bsc date sheet
Abstract: DS2760X
Text: REVISIONS ZONE REV DESCRIPTION DATE APPROVED A ORIGINAL RELEASE 29—JUL—2002 B ROTATE LASER SYMBOL; INCREASE DIM. E 16—AUG—2002 B1 11 - S E P - 2 0 0 2 CHANGE SOLDER PASTE APERTURE NOTES! 1, DIMENSIONS! MM 2, BUMP MATERIAL! 95 Pb / 5 Sn 3, LASER MARK INDICATING END OF PACKAGE CONTAINING BUMP RDW A
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DS2760X
G7003â
bsc date sheet
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Motorola MC68HC05B16, 52 pin
Abstract: PWM IC 8-PIN DIP PWM IC 8 PIN DIP 84 pin plcc ic base ic base for 40 pin DIP ic MC68HC11F1 external memory MC68LK332 bdm programming MC3PHAC 908lj12 MSCAN HCS08
Text: MICROCONTROLLERS QUARTER 1, 2004 SG1006/D REV 0 WWW.MOTOROLA.COM/SEMICONDUCTORS About This Revision–Q1/2004 A summary of new information is provided in this section. In addition, a change bar appears in the left margin of every page referenced in this section to mark the
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SG1006/D
Q1/2004
MC9S08GB32
MC9S08GB60
MC9S08GT32
MC9S08GT60
MC9S08RC8
MC9S08RC16
MC9S08RC32
MC9S08RC60
Motorola MC68HC05B16, 52 pin
PWM IC 8-PIN DIP
PWM IC 8 PIN DIP
84 pin plcc ic base
ic base for 40 pin DIP ic
MC68HC11F1 external memory
MC68LK332 bdm programming
MC3PHAC
908lj12
MSCAN HCS08
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C8413-60153 AX4
Abstract: IC 74502 OX2114A-HZ-1-24.576-3.3
Text: Elan Microelectronics Crop. EM65568 130COM/ 128SEG 4096 Color STN LCD Driver April 1, 2004 Version 0.9 Version 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 EM65568 Specification Revision History Content Initial version 1. Add Pad configuration 2. Add the shape of alignment mark
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EM65568
130COM/
128SEG
EM65568
NH20-865X75-26
C8413-60153 AX4
IC 74502
OX2114A-HZ-1-24.576-3.3
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Untitled
Abstract: No abstract text available
Text: Identification Markers Create your own Safety Signs! • Create your own legend using the PANDUIT DURA-MARK PTR2E Printer and clear polyester tapes.‡ • Print legend on clear polyester tape and adhere marker to any of the pressure sensitive or rigid safety
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PPS0710C442
PPS1014C442
PPS1420C442
PRS0710C442
PRS1014C442
PRS1420C442
PPS0710D440
PPS1014D440
PPS1420D440
SA101N179E-ID
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Package Information
Abstract: WCSP4
Text: Package Information www.vishay.com Vishay Siliconix WCSP4: 4 Bumps 2 x 2, 0.4 mm pitch, 208 m bump height, 0.8 mm x 0.8 mm die size Mark on backside of die 1 A 2 1 2 W A B A B B e D 4 x Ø 0.15 to Ø 0.20 Solder mask dia. - Pad diameter + 0.1 0.4 e 4xØb
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SAC396
S14-0844-Rev.
28-Apr-14
Package Information
WCSP4
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