GT-14
Abstract: dupont mylar M-BOND 610
Text: M-Bond 610 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 610 INSTALLATION: • • • • • • • • • • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A
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GT-14
005mm]
08-Apr-05
dupont mylar
M-BOND 610
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Untitled
Abstract: No abstract text available
Text: M-Bond 610 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 610 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges
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GT-14
005mm]
27-Apr-11
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PDF
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instruction bulletin b-130
Abstract: M-BOND 610 FOR TRANSDUCERS M-BOND GA-61 mjg-2 TT-609 M-BOND GA-61 cure temperatures m-bond 450 b Instruction Bulletin B-130, tt606 GT-14
Text: Instruction Bulletin B-130 Vishay Micro-Measurements Strain Gage Installations with M-Bond 43-B, 600, and 610 Adhesive Systems INTRODUCTION SURFACE PREPARATION Vishay Micro-Measurements M-Bond 43-B, 600, and 610 adhesives are high-performance epoxy resins, formulated
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B-130
11-Apr-07
instruction bulletin b-130
M-BOND 610 FOR TRANSDUCERS
M-BOND GA-61
mjg-2
TT-609
M-BOND GA-61 cure temperatures
m-bond 450 b
Instruction Bulletin B-130,
tt606
GT-14
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curing
Abstract: instruction bulletin b-130 cure GT-14 M-BOND 600
Text: M-Bond 600 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 600 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol • Silicon-Carbide Paper • M-Prep Conditioner A • • • • • • • M-Prep Neutralizer 5A
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Original
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GT-14
08-Apr-05
curing
instruction bulletin b-130
cure
M-BOND 600
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PDF
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Instruction Bulletin B-130,
Abstract: GT-14 dupont mylar rohs
Text: M-Bond 43-B Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 43-B INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol • Silicon-Carbide Paper • M-Prep Conditioner A • • • • • • • M-Prep Neutralizer 5A
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Original
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GT-14
08-Apr-05
Instruction Bulletin B-130,
dupont mylar rohs
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PDF
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Untitled
Abstract: No abstract text available
Text: M-Bond 600 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 600 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges
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Original
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GT-14
27-Apr-11
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PDF
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Untitled
Abstract: No abstract text available
Text: M-Bond 43-B Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 43-B INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges
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Original
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GT-14
27-Apr-2011
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PDF
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27611
Abstract: 27611 transistor A 27611 transistor A 27611 benzene M-BOND 600 monograph LD50 msds vishay M-BOND 600 safety data
Text: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: M-Bond Curing Agent 600/610 October 21, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM013L 919-365-3800 CHEMTREC 1-800-424-9300 U.S.
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MGM013L
805-FRM011
27611
27611 transistor
A 27611
transistor A 27611
benzene
M-BOND 600
monograph
LD50
msds vishay
M-BOND 600 safety data
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PDF
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CAS No. 28064-14-4
Abstract: 28064-14-4 M-BOND 200 msds 14036 flammable LD50 M-BOND 200 safety data M-BOND 200 msds vishay bond 200 M-BOND 200 adhesive
Text: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: M-Bond 610 Adhesive October 21, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM012K 919-365-3800 CHEMTREC 1-800-424-9300 U.S. 703-527-3887 (Outside U.S.)
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MGM012K
805-FRM011
CAS No. 28064-14-4
28064-14-4
M-BOND 200 msds
14036
flammable
LD50
M-BOND 200 safety data
M-BOND 200
msds vishay bond 200
M-BOND 200 adhesive
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vishay PCT-2M
Abstract: PCT-2M M-Prep Conditioner A MCA-2 M-Prep Conditioner A pct-2m installation tape
Text: BAK-200, CEA-200, GAK-2 Series Micro-Measurements Strain Gage Application Kits FEATURES • GAK-2 Series Kits include materials necessary to immediately start making strain gage installations for routine applications. BAK-200 kit contains essential materials for M-Bond 200
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BAK-200,
CEA-200,
BAK-200
CEA-200
GAK-2-200
GAK-2-AE-10
27-Apr-2011
vishay PCT-2M
PCT-2M
M-Prep Conditioner A
MCA-2 M-Prep Conditioner A
pct-2m installation tape
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PDF
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M-BOND 600
Abstract: LD50 CAS No. 28064-14-4 28064-14-4 ld50 c M-BOND 600 safety data 14034 flammable "Flammable Liquid"
Text: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: M-Bond 600 Adhesive October 21, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM011J 919-365-3800 CHEMTREC 1-800-424-9300 U.S. 703-527-3887 (Outside U.S.)
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Original
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MGM011J
805-FRM011
M-BOND 600
LD50
CAS No. 28064-14-4
28064-14-4
ld50 c
M-BOND 600 safety data
14034
flammable
"Flammable Liquid"
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PDF
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WBCR02750000F
Abstract: BCR50000FKAHWS
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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18-Jul-08
WBCR02750000F
BCR50000FKAHWS
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PDF
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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18-Jul-08
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PDF
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WBCR02750000F
Abstract: bcr resistor bcr efi ElectroFilm
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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Original
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11-Mar-11
WBCR02750000F
bcr resistor
bcr efi
ElectroFilm
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PDF
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transistor b941
Abstract: transistor b561 transistor b1416 B941 b1416 B2269 data transistor type bf 224 242557 transistor bf 244 B1321
Text: Pentium PROCESSORS AT iCOMP INDEX 735T90 610T75 MHz WITH VOLTAGE REDUCTION TECHNOLOGY SmartDie TM Product Specification Y Compatible with Large Software Base MS-DOS Windows OS 2 UNIX Y 4 Mbyte Pages for Increased TLB Hit Rate Y 32-Bit CPU with 64-Bit Data Bus
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735T90
610T75
32-Bit
64-Bit
X805025075
X805026090
AP-479
AP-480
transistor b941
transistor b561
transistor b1416
B941
b1416
B2269
data transistor type bf 224
242557
transistor bf 244
B1321
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PDF
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tms 4464
Abstract: LMC 324 4564 RAM SMJ320C40 application TMS320C40 8748 A 7840 SMJ320C40 SMJ320C40KGDC TMP320C40KGDC
Text: TMP320C40KGDC, SMJ320C40KGDC FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024A – MARCH 1997 – REVISED SEPTEMBER 1997 D D D D D D D D D D D D D Commercial L Operating Temperature Range 0°C to 70°C Military (M) Operating Temperature Range
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TMP320C40KGDC,
SMJ320C40KGDC
SGUS024A
C40-60:
33-ns
C40-50:
40-ns
tms 4464
LMC 324
4564 RAM
SMJ320C40 application
TMS320C40
8748
A 7840
SMJ320C40
SMJ320C40KGDC
TMP320C40KGDC
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PDF
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TMP320C40KGDC
Abstract: XDS510 SMJ320C40KGDC SMJ320C40
Text: TMP320C40KGDC, SMJ320C40KGDC FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024A – MARCH 1997 – REVISED SEPTEMBER 1997 D D D D D D D D D D D D D Commercial L Operating Temperature Range 0°C to 70°C Military (M) Operating Temperature Range
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TMP320C40KGDC,
SMJ320C40KGDC
SGUS024A
C40-60:
33-ns
C40-50:
40-ns
TMP320C40KGDC
XDS510
SMJ320C40KGDC
SMJ320C40
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PDF
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100656
Abstract: IEEE-745 748800
Text: TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024C − MARCH 1997 − REVISED OCTOBER 2001 D SMJ: QML Processing to MIL−PRF−38535 D TMP: Commercial Level Processing D Operating Temperature Ranges:
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TMP320C40KGDC,
SMJ320C40KGDC,
TMP320C40KGDCT,
SMJ320C40KGDCT
SGUS024C
MIL-PRF-38535
C40-50:
40-ns
C40-40:
50-ns
100656
IEEE-745
748800
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PDF
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CMP-01
Abstract: No abstract text available
Text: SP - 2107 liHiiiiimui Bond Pad Buried Zener Nichrome Clear Field Area 1- HPNP HNPN 0 N+/P+Diode Esa Pinch Resistor i— i DBNPN | DBPNP (I ) MNPN @ MPNP [] SPNP ¡SNPN Capacitor Block m 1^lpF SP2107 COMPONENT COUNT SUMMARY DESCRIPTION COUNT Tiles:
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OCR Scan
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SP2107
SPI204
CMP-01
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PDF
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1N459
Abstract: 1N456 1N457 IN456 IN457 J 1N456 1N458
Text: DIODE 1N456 JAN 1N457 JAN 1N458 JAN 1N459 Low Current DESCRIPTION G eneral p urp o se low c u rre n t d io d e w ith h ig h re lia b ility c h a ra c te ris tic s FEATURES • M e ta llu rg ic a l Bond • Q u a lifie d to MIL-S-19500/193 • P lanar P a ssivated C hip
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1N456
1N457
1N458
1N459
MIL-S-19500/193
1N456
1N457
1N458
1N459
IN456
IN457
J 1N456
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PDF
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Untitled
Abstract: No abstract text available
Text: TMP320C40KGDC, SMJ320C40KGDC FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES S G U S 0 2 4 A - MARCH 1 9 9 7 - R EVISED S E P TE M B E R 1997 • Commercial L Operating Temperature Range 0°C to 70°C • Military (M) Operating Temperature Range
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OCR Scan
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TMP320C40KGDC,
SMJ320C40KGDC
C40-60:
33-ns
C40-50:
40-ns
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PDF
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9645.84
Abstract: No abstract text available
Text: TMP320C40KGDC, SMJ320C40KGDC FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024A - MARCH 1997 - REVISED SEPTEMBER 1997 • • • • • • • • • • • Commercial L Operating Temperature Range 0°C to 70°C Military (M) Operating Temperature Range
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OCR Scan
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TMP320C40KGDC,
SMJ320C40KGDC
SGUS024A
C40-60:
33-ns
C40-50:
40-ns
Temperatur24
9645.84
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PDF
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY S12C 256K SR A M D IE MICRON ft- n u —.m¡T. we. SRAM DIE 256K SRAM 2 5 6 K X 1, 6 4 K x 4 , 3 2 K x 8 FEATURES • Single 3.3V ±0.3V power supply 3.3V ±0.2V for 12ns and faster • 5V -tolerantI/0 • Common data inputs and data outputs (separate data
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OCR Scan
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150mm
114x114
C1994.
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PDF
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Untitled
Abstract: No abstract text available
Text: M IC R O N » D24A 16 MEG DRAM DIE SEMCQNDUCTDR n c DRAM DIE 16 MEG DRAM MT4C4M4B1D24A, MT4LC4M4B1D24A MT4LC2M8B1D24A, MT4LC1M16C3D24A FEATURES DIE OUTLINE Top View • • • • • • Single 5.0V (x4 only) or 3.3V (x4, x8, xl6) power supply Industry-standard x4, x8, xl6 timing and functions
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MT4C4M4B1D24A,
MT4LC4M4B1D24A
MT4LC2M8B1D24A,
MT4LC1M16C3D24A
PHYSICAL531
150mm
262x569
134x134
114jim
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