LSI LOGIC CSP Search Results

sulzer s7

Abstract: tag 8730 NEC 2505 sulzer pump westlake capacitors L64364 LA 4636 NEC 2505 nj CRC32 L64363
Contextual Info: TECHNICAL MANUAL L64364 ATMizer II+ ATM-SAR Chip February 2001 ® R14008.A This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties without the express written permission of an officer of LSI Logic Corporation.

sulzer s7

Abstract: L64364 6903 controller MT41LC256K32D4 sulzer pump CRC10 CRC32 R3000 R4000 1048 air hec nv
Contextual Info: ATMizer L64364 ATM-SAR Chip Technical Manual March 2000 ® Order Number R14008.A II+ This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties without the express written permission of an officer of LSI Logic Corporation.

ac motor variable speed control circuit diagram

Abstract: ac motor speed control circuit diagram with pwm ac motor speed control circuit diagram 3 phase inverter HEF4752V HEF4752 HEF4752VP HEF4752V HEF4752VD ac motor control circuit The IC04 LOCMOS HE4000B Logic
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4752V LSI A.C. motor control circuit

hef4752v application note

Abstract: 3 phase ac motor variable speed control circuit d ac motor variable speed control circuit diagram 3 phase inverter HEF4752V ac motor speed control circuit diagram HEF4752VP HEF4752 HEF4752V motor speed control ac motor speed control circuit
Contextual Info: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4752V LSI A.C. motor control circuit

lr33300

Abstract: cw33300 LR33310 transistor m 9587 lsi lr33310 PCF 7900 L64360 hp 7540 J14028 atmizer
Contextual Info: L64360 and ATMizer Architecture Technical Manual This document is preliminary. As such, it contains data derived from functional simulations and performance estimates. LSI Logic has not verified either the functional descriptions, or the electrical and mechanical specifications using

ARM7TDMI-S

Abstract: ARM7TDMI-S instruction set ARM7TDMI ARM7TDMI-S Datasheet ARM7TDMI Technical Reference Manual
Contextual Info: ARM7TDMI-S Microprocessor Core Technical Manual Preliminary This document is preliminary. As such, it contains data derived from functional simulations and performance estimates. LSI Logic has not verified either the functional descriptions, or the electrical and mechanical specifications using

cbp4.0

Abstract: cdma baseband processor LSI LOGIC 3G modem LSI CMOS Technology OakDSPCore LSI coreware library "voice codec" modem Analysis on the ADC cbp3.0
Contextual Info: SignalSphere 3G CDMA2000-A Baseband Processor: CBP4.0 OVERVIEW FEATURES LSI Logic's SignalSphere™ chip is a highly integrated CDMA Baseband Processor for wireless handsets and data applications. The CBP4.0 has all of the baseband processing logic required to support CDMA2000 Cellular, PCS

sulzer s7

Abstract: SECMS L64364 LR4500 faithful one by robin mark atmizer-2 adp 338 cwm 1B3940 atmizer
Contextual Info: BookL64364PG.fm5 Page i Friday, January 28, 2000 4:58 PM L64364 ATMizer II+ ATM-SAR Chip Programming Guide January 2000 Order Number R14012 BookL64364PG.fm5 Page ii Friday, January 28, 2000 4:58 PM This document contains proprietary information of LSI Logic Corporation. The

cdma baseband processor

Abstract: LSI LOGIC modem LSI LOGIC QCELP-13 OakDSPCore QCELP13 F20031 cbp3.0 "single chip" cdma baseband rf
Contextual Info: CBP3.0 CDMA Baseband Processor Features World’s First Single Chip CDMA Baseband Processor • An ARM7TDMI TM control processor CP . Overview The LSI Logic CBP3.0 chip is the most highly-integrated CDMA processing solution available today for wireless handset designers. Thanks in large part to

Contextual Info: S304fl04 OOl Sk.54 275 • LLC LSI LOGIC ATM izer M egaCore Preliminary D escription In a bold m ove to w a rd s the em erging A TM w h ic h is a 32-bit, u se r-p ro g ram m ab le R IS C CPU m ark e t, L S I Lo g ic h a s in tro d u ced th e A T M iz e r

SV92U2

Abstract: CSP1040 LSI csp1040 S28000 isolation transformer v.92 isolation transformer v.90 L-CSP1040A3 L-SV92USV2-T48C-DB L-CSP1040A3-E11-DT
Contextual Info: Product Brief SV92U2 USB Soft Modem F e at u r e s n n n n n n Two-chip, USB 2.0-compliant soft modem solution: — SV92U2 host interface in a 48-pin TQFP. — CSP1040 DAA in a 20-pin TSSOP. USB 2.0 compliant device controller: — Supports high-speed 480 Mbits/s

wristwatch

Abstract: 441-pin BGA
Contextual Info: CSP,MCM Modules CSP,MCM Modules AV, OA Information, Mobile communication, Industry/Field: Industrial equipment Breakthrough in High-Density Mounting High-Density Mounting via 20µm Fine Printed substrate • Development goals: Manufacture of high-density modules for

PCB design for very fine pitch csp package

Abstract: 0.3mm pitch csp package oki pitch wcsp reliability 0.4mm pitch BGA 2asic oki packaging gps watch ceramic QFP Package 100 lead
Contextual Info: Oki’s ASIC Wafer Level Chip Size Packaging Technology Overview March 2004 1 ASIC W-CSP 02/04 The Market’s Requirement for New ASIC Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s ASIC design engineers

Contextual Info: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and

5-Channel CMOS Electronic Switch

Contextual Info: 1/4 Structure Product Silicon Monolithic Integrated Circuit Power Management LSI for MultiMedia LSI on Cellular Type BH6176GU Functions ・1ch 500mA, high efficiency Step-down Converter. 16 steps adjustable VO by I2C ・5-channel CMOS-type LDOs. (16 steps adjustable VO by I2C, 150mAx3, 300mA×2)

BH6173GUL

Contextual Info: 1/4 Structure Product Silicon Monolithic Integrated Circuit Power Management LSI for Multimedia LSI on Cellular Type BH6173GUL Functions ・1ch 500mA, high efficiency Step-down Converter. 16 steps adjustable Vout by I2C ・3-channel CMOS-type LDOs. (16 steps adjustable Vout by I2C)

Contextual Info: 1/4 Structure Product Silicon Monolithic Integrated Circuit Power Management LSI for MultiMedia LSI on Cellular Type BH6176GU Functions ・1ch 500mA, high efficiency Step-down Converter. 16 steps adjustable VO by I2C ・６-channel CMOS-type LDOs. (16 steps adjustable VO by I2C, 150mAx3, 300mA×３)

Contextual Info: 1/4 Structure Product Silicon Monolithic Integrated Circuit Power Management LSI for Multimedia LSI on Cellular Type BH6173GUL Functions ・1ch 500mA, high efficiency Step-down Converter. 16 steps adjustable Vout by I2C ・3-channel CMOS-type LDOs. (16 steps adjustable Vout by I2C)

AMBA AHB to APB BUS Bridge verilog code

Abstract: verilog code ahb-apb bridge pc based rf wireless controlled toy car AMBA 2.0 AHB to APB BUS Bridge verilog code AMBA AHB to AHB BUS Bridge verilog code verilog code AMBA AHB verilog code for amba ahb bus verilog code for amba apb master amba ahb verilog code verilog code for amba apb bus
Contextual Info: 沖のシステムＬＳＩ設計プラットフォーム： 沖のシステムＬＳＩ設計プラットフォーム： µµPLAT PLAT ® 沖電気工業株式会社 シリコンソリューションカンパニー ＬＳＩ事業部 Rev.1.82j 04 Jul 2001

PCL6045BL

Abstract: pcl6045 CU4R stepper motor interface with 8086 block diagram crt horizontal deflection circuit PCL6045B as15 h PRMG 951 ezd 171 PLC6045B
Contextual Info: User's Manual For PCL6045BL Pulse Control LSI Nippon Pulse Motor Co., Ltd. [Preface] Thank you for considering our pulse control LSI, the "PCL6045B." To learn how to use the PCL6045B, read this manual to become familiar with the product. The handling precautions for installing this LSI are described at the end of this manual. Make sure to

Contextual Info: 1/4 ● Structure ● Product Silicon Monolithic Integrated Circuit 7 x 7 Matrix LED DRIVER for Mobile Phone ● Type ● Figure BH6948GU 1. 2. 3. 4. 5. 6. Highly effective Charge Pump circuit that can be switched 1 time, 1.5 times, and 2 times pressure automatically. 190mA / MAX

diagrams hitachi ecu

Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

radioactivity detector

Abstract: matrix led driver rohm 574
Contextual Info: 1/4 ● Structure ● Product Silicon Monolithic Integrated Circuit 7 x 7 Matrix LED DRIVER for Mobile Phone ● Type ● Figure BH6948GU 1. 2. 3. 4. 5. 6. Highly effective Charge Pump circuit that can be switched 1 time, 1.5 times, and 2 times pressure automatically. 190mA / MAX

1000-pin bga 0,8 mm

Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble