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    LQFP PACKAGE TRAY Search Results

    LQFP PACKAGE TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    LQFP PACKAGE TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    HM-RAE105

    Abstract: RPG100 PEAK TRAY qfn 4 x 4 RPG100F RPG100-01 qfn 5 x 5 TRAY PEAK TRAY qfn
    Text: HM-RAE105-1105 PACKAGE [ RPG100 ] 32-pin plastic LQFP 32-pin plastic LQFP Lead pitch 0.80mm Package width x package length 7 x 7 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Note1 * :These dimensions do not include resin protrusion.


    Original     		PDF HM-RAE105-1105 RPG100 32-pin RPG100F HM-RAE105 RPG100 PEAK TRAY qfn 4 x 4 RPG100F RPG100-01 qfn 5 x 5 TRAY PEAK TRAY qfn

    LQFP Package tray

    Abstract: 128-PIN nec 144 pin LQFP LQFP Package 128-pin LQFP 144 tray
    Text: TRAY CONTAINER UNIT : mm 17.55 135°C MAX 22.63 25.40 17.80 22.63 100.8 A' LQFP 20x20×1.4 25.20 135.9 NEC A 279.4 315.0 322.6 SECTION A-A' 22.63 6.02 (6.35) 7.62 19.85 Applied Package Quantity (pcs) Material 128-pin Plastic LQFP (Fine Pitch) (1.4mm thick)


    Original     		PDF 128-pin 144-pin 176-pin SSD-A-H6553-1 LQFP Package tray nec 144 pin LQFP LQFP Package 128-pin LQFP 144 tray

    LQFP Package tray

    Abstract: TQFP14X14X1 LQFP "100 pin" PACKAGE LQFP Package 128-pin 128-PIN tray container dimensions TRAY CONTAINER LQFP14 100-PIN PLASTIC LQFP NEC tqfp14x14x1.4
    Text: TRAY CONTAINER 7 15.45 16.7 6x15=90 21.00 A' A 150°C MAX. PPE 105.0 TQFP14X14X1.4 15.40 16.7 20.30 284.2 315.0 322.6 Section A – A' 16.7 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 80-pin Plastic LQFP (1.4mm thick) 100-pin Plastic LQFP (1.4mm thick)


    Original     		PDF TQFP14X14X1 LQFP14 80-pin 100-pin 128-pin SSD-A-H6285-2 -A-H6285-2 LQFP Package tray LQFP "100 pin" PACKAGE LQFP Package 128-pin tray container dimensions TRAY CONTAINER 100-PIN PLASTIC LQFP NEC tqfp14x14x1.4

    LQFP Package tray

    Abstract: 128-PIN ST-TQ142014TJ-1 NEC 87 tray dimensions
    Text: TRAY CONTAINER A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A-A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 128-pin Plastic LQFP (1.4mm thick) 5.62 6.35 7.62 19.87 Quantity (pcs)


    Original     		PDF ST-TQ142014TJ-1 100-pin 128-pin SSD-A-H5941-1 LQFP Package tray ST-TQ142014TJ-1 NEC 87 tray dimensions

    LQFP1414-8bt Package tray

    Abstract: LQFP Package tray h658 LQFP1414-8BT
    Text: TRAY CONTAINER HEAT PROOF 7 A' 15.45 18.0 6x15=90 21.00 A 135°CMAXPPE 105.0 NEC LQFP1414−8BT 15.40 18.0 20.30 284.2 315.0 322.6 < SECTION A – A' > 18.0 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (1.4mm thick)


    Original     		PDF LQFP1414-8BT 64-pin 80-pin SSD-A-H6583-1 LQFP1414-8bt Package tray LQFP Package tray h658 LQFP1414-8BT

    STATS ChipPAC

    Abstract: AN 7823 EP 603 LQFP Package LQFP Package tray QFP JEDEC tray 64 leads qfp 32 QFP PACKAGE thermal resistance Techpoint
    Text: QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES DESCRIPTION • Combining devices into one package reduces PCB real estate and cost STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die


    Original     		PDF

    LQFP Package tray

    Abstract: JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER UNIT : mm 7 x 17=119 NEC 135° C MAX. A' 14.60 17.90 14.30 14.60 108.0 13.95 18.00 LQFP12 × 12× 1.4 135.9 PPE A 286.4 315.0 322.6 SECTION A-A' 14.60 5.62 (6.35) 7.62 11.82 Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (Fine Pitch)(1.4mm thick)


    Original     		PDF LQFP12 64-pin 80-pin SSD-A-H7503 LQFP Package tray JEDEC TRAY DIMENSIONS

    LQFP Package tray

    Abstract: JEDEC TRAY DIMENSIONS tray container dimensions
    Text: TRAY CONTAINER UNIT : mm 10 x 25=250 113.4 135.9 PPE NEC 135° C MAX. A' 9.60 11.25 12.60 LQFP7 × 7× 1.4 A 9.60 12.20 11.10 292.8 315.0 322.6 SECTION A-A' 9.60 5.62 (6.35) 7.62 6.82 Applied Package 48-pin Plastic LQFP (Fine Pitch)(1.4mm thick) 64-pin Plastic LQFP (Fine Pitch)(1.4mm thick)


    Original     		PDF 48-pin 64-pin SSD-A-H7499 LQFP Package tray JEDEC TRAY DIMENSIONS tray container dimensions

    LQFP Package tray

    Abstract: TQFP 1414 1.4mm JEDEC tray standard TQFP 1414
    Text: HEAT PROOF 16.7 15.45 21.00 A' 6x15=90 A 150°CMAXPPE 7 105.0 TQFP 14×14×1.4 135.9 UNIT : mm 15.40 16.7 20.30 284.2 315.0 322.6 < SECTION A – A' > 16.7 5.62 6.35 7.62 13.85 Applied Package Quantity (pcs) 100-pin Plastic LQFP (1.4mm thick) MAX. 90 Tray


    Original     		PDF 100-pin TQFP14 LQFP Package tray TQFP 1414 1.4mm JEDEC tray standard TQFP 1414

    QFP JEDEC tray

    Abstract: nec 44 pin LQFP LQFP Package tray NEC lqfp 52 JEDEC TRAY QFP JEDEC tray standard qfp tray standard nec 44pin QFp Package tray tray qfp 160 jedec
    Text: TRAY CONTAINER HEAT PROOF 7 A' 15.20 13.10 12.5 PPE 135°C MAX NEC 15.70 A 8x20 = 160 13.00 109.9 LQFP 10×10×1.4 12.5 288.8 315.0 322.6 SECTION A-A' 12.50 Applied Package 6.12 (6.35) 9.90 7.62 135.9 UNIT : mm Quantity (pcs) 64-pin Plastic QFP (1.4mm thick)


    Original     		PDF 64-pin 44-pin 52-pin SSD-A-H6405-1 QFP JEDEC tray nec 44 pin LQFP LQFP Package tray NEC lqfp 52 JEDEC TRAY QFP JEDEC tray standard qfp tray standard nec 44pin QFp Package tray tray qfp 160 jedec

    ST-TQ142014TJ-1

    Abstract: LQFP Package tray
    Text: A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A – A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 5.62 6.35 7.62 19.87 Quantity (pcs) MAX. 72 Tray Material Heat Proof Temp.


    Original     		PDF ST-TQ142014TJ-1 100-pin ST-TQ142014TJ-1 LQFP Package tray

    LQFP Package tray

    Abstract: fine pitch LQFP24 JEDEC TRAY DIMENSIONS tray container dimensions LQFP-24
    Text: TRAY CONTAINER HEAT PROOF 30.40 20.70 26.4 7 135°C MAX NEC PPE A' 20.70 A 4x10=40 31.50 94.5 LQFP24×24×1.4 135.9 UNIT : mm 26.4 273.6 315.0 322.6 SECTION A – A' 26.4 6.12 7.62 (6.35) 23.9 Applied Package Quantity (pcs) 160-pin • Plastic LQFP(Fine Pitch)(1.4mm thick)


    Original     		PDF LQFP24 160-pin 176-pin 216-pin SSD-A-H6569 LQFP Package tray fine pitch JEDEC TRAY DIMENSIONS tray container dimensions LQFP-24

    3510A

    Abstract: LA10A LQFP Package tray
    Text: Unit : mm 335±1.0 23.5±0.5 288±0.5 27.5±0.1 13.85 A' A 137.5±0.5 180±1.0 21.25±0.5 32±0.1 NEC LA–3510A–1 HEAT PROOF 19.85 SECTION A – A' 22.2 6.8 5.8 8.8 19.85 Applied Package Quantity pcs 100pin Plastic LQFP (1.4mm thick) MAX. 60 Tray LA-3510A-1


    Original     		PDF 100pin LA-3510A-1 3510A LA10A LQFP Package tray

    Marking Code 2K

    Abstract: No abstract text available
    Text: EEPROM & Memory Card Code Information 1/2 Last Updated : August 2009 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 12. Package Type 1 : TEBGA A : SDIP C : CHIP BIZ E : LQFP G : CLCC J : ELP L : CERDIP N : COB Q : QFP S : SOP V : SSOP Y : FBGA 2. Large Classfication : MOS (5)


    Original     		PDF 8K/16K 32K/64K 128K/256K Marking Code 2K

    mp 9141 es

    Abstract: MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L
    Text: Automotive Quarter 4, 2010 SG187Q42010 Rev 40 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad range of


    Original     		PDF SG187Q42010 mp 9141 es MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L

    MC908LJ24

    Abstract: MC908mr16 mc908mr32 xc912dg128 MC908Lk24 mc9s08dz32 reference manual MC9S08SH4 MC3PHAC MC9S08AW32 dsp56f803bu80e
    Text: 8/16/32 Bit Microcontrollers Quarter 1, 2008 SG1006Q12008 Rev 0 FREESCALE’S 8-BIT PRODUCTS SUMMARY For complete part number information and temperature definitions, refer to Product Numbering System on page SG1006-9. General Purpose Products Product Flash


    Original     		PDF SG1006Q12008 SG1006-9. 10-Bit HCS08 MC9S08AW60 MC9S08AW32 MC908LJ24 MC908mr16 mc908mr32 xc912dg128 MC908Lk24 mc9s08dz32 reference manual MC9S08SH4 MC3PHAC MC9S08AW32 dsp56f803bu80e

    tray datasheet bga

    Abstract: fujitsu ic trays sol
    Text: Packing for Shipment • Packing form The packaging used to deliver products consits of tubes, trays, tapes, inner boxes, and an outer box. See Figures 1 to 7. The tubes, trays, and tapes are designed to protect the products from damage. After unpacking


    Original     		PDF DB81-10008-2E DB81-10005-1E tray datasheet bga fujitsu ic trays sol

    MPXY8600

    Abstract: MPC5674 MPC5603 MPC56xx MPC5668G MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E
    Text: Automotive Quarter 4, 2009 SG187Q42009 Rev 37 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: i.MX and MPC5668G product families; S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 and MPC5553 products in 208 MAPBGA packages.


    Original     		PDF SG187Q42009 MPC5668G S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 MPC5553 MPXY8600 MPC5674 MPC5603 MPC56xx MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E

    9s08dz32

    Abstract: 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882
    Text: Automotive Quarter 4, 2007 SG187Q42007 Rev 29 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad


    Original     		PDF SG187Q42007 9s08dz32 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882

    MC908LJ24

    Abstract: MC908Lk24 MC908MR16 mc908mr32 MC3PHAC xc912bc32 MC68376 bdm programming MC9S08SH4 xc912dg128 USBMULTILINKBDME
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56852VFE, DSP56F807VF80, DSP56F807VF80E, MC56F8357VVFE, MC56F8367VVFE


    Original     		PDF DSP56852VFE, DSP56F807VF80, DSP56F807VF80E, MC56F8357VVFE, MC56F8367VVFE SG1006Q12008 MC908LJ24 MC908Lk24 MC908MR16 mc908mr32 MC3PHAC xc912bc32 MC68376 bdm programming MC9S08SH4 xc912dg128 USBMULTILINKBDME

    OBD II Protocol ISO 9141

    Abstract: SC510727 advantages of microcontroller mc9s08aw16 sg2023 relay K-line interface mc9s12dg256 code example assembly electric assisted power steering system motor circuit diagram obd diagnostic SG187 Common rail injector service manuals
    Text: Automotive Quarter 4, 2005 SG187 Rev 22 About This Revision–Q4/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.


    Original     		PDF SG187 Q4/2005 MC68HC908QC4 MC68HC908QC8 MC68HC908QC16 MC9S08AW1e SG187 OBD II Protocol ISO 9141 SC510727 advantages of microcontroller mc9s08aw16 sg2023 relay K-line interface mc9s12dg256 code example assembly electric assisted power steering system motor circuit diagram obd diagnostic Common rail injector service manuals

    MS-026 lqfp 80

    Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
    Text: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging


    Original     		PDF

    QFN tray

    Abstract: 7x7x1.4 tray tray datasheet bga MKT71C1176-00 qfn 5 x 5 TRAY PS007229-1010 lqfp 7x7 tray BGA package tray 64 BGA 31 x 31 tray LQFP Package tray
    Text: Packaging Product Specification PS007229-1010 Copyright 2010 by Zilog , Inc. All rights reserved. www.zilog.com Packaging Product Specification Warning: DO NOT USE IN LIFE SUPPORT LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		PDF PS007229-1010 2000/REEL 1000/REEL 160/TRAY 1600/BAG 490/TRAY 260/TRAY QFN tray 7x7x1.4 tray tray datasheet bga MKT71C1176-00 qfn 5 x 5 TRAY PS007229-1010 lqfp 7x7 tray BGA package tray 64 BGA 31 x 31 tray LQFP Package tray

    MS-026

    Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128
    Text: LEADFRAME data sheet LQFP PowerQuad 4 Features: LQFP PowerQuad® 4 Packages: LQFP PowerQuad® 4 PQ4 is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is


    Original     		PDF