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    LGA PACKAGE THERMAL RESISTANCE Search Results

    LGA PACKAGE THERMAL RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    LGA PACKAGE THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    thermal analysis on pcb

    Abstract: flotherm MODEL AN2026 AN-2026 2026 led thermal cfd thermal resistance of low power semiconductor flotherm
    Text: National Semiconductor Application Note 2026 Lianxi Shen February 8, 2010 Summary Power Module better in thermal performance than other package types. For example, LGA packages have a θJC of about 5C/W or larger for the similar package size, depending on the


    Original     		PDF O-263. AN-2026 thermal analysis on pcb flotherm MODEL AN2026 AN-2026 2026 led thermal cfd thermal resistance of low power semiconductor flotherm

    BTX LGA 775

    Abstract: PCM45F 2510C888-001 CPU COOLER WIESON 2510c888-001 12V cooler MOTOR LGA 1151 109X7912P1H012 San Ace 40 109X7912PT1H012
    Text: SAN ACE MC CPU Cooler For Intel 775 land-LGA Package CPU Cooler " SAN ACE MC" Thermal Module Type II for BTX General specifications Specifications Rated Voltage Operating Voltage Range Rated Current （V ） （V ） （A ） Model No. 109X7912P1H012*


    Original     		PDF 109X7912P1H012* 109X7912PT1H012* AWG26 UL1430 PCM45F 775-lamd BTX LGA 775 PCM45F 2510C888-001 CPU COOLER WIESON 2510c888-001 12V cooler MOTOR LGA 1151 109X7912P1H012 San Ace 40 109X7912PT1H012

    C25704-002

    Abstract: LGA 775 SOCKET PIN LAYOUT Nidec fan C25704-002 intel fan socket 775 air output lga 775 motherboard drawings lga 775 socket details C25704 6010a AL322 Loctite 7452
    Text: Intel Celeron® D Processor in the 775-Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order #303730-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		PDF 775-Land C69175 PSC-2U001 C25704-002 LGA 775 SOCKET PIN LAYOUT Nidec fan C25704-002 intel fan socket 775 air output lga 775 motherboard drawings lga 775 socket details C25704 6010a AL322 Loctite 7452

    C25704-002

    Abstract: LGA 775 Socket PIN layout Nidec fan C25704-002 LGA775 thermal design guide PENTIUM D lga775 WIRING 33 2U nidec 775 AVC cooler LGA775 SOCKET PIN LAYOUT lga 775 socket details
    Text: Intel Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order #302822-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		PDF 775-Land C69175 PSC-2U001 775-Land C25704-002 LGA 775 Socket PIN layout Nidec fan C25704-002 LGA775 thermal design guide PENTIUM D lga775 WIRING 33 2U nidec 775 AVC cooler LGA775 SOCKET PIN LAYOUT lga 775 socket details

    PCM45F

    Abstract: 2510C888-001 775 cpu connector CPU COOLER WIESON 2510c888-001 BTX LGA 775 San Ace 40 2511-T1 9G0912P2E012 9G0912PT2E012
    Text: SAN ACE MC CPU Cooler For Intel 775 land-LGA Package CPU Cooler " SAN ACE MC" Thermal Module Type I for BTX General specifications Specifications Model No. Rated Voltage （V） Operating Voltage Range （V） Rated Current （A） Rated Speed （min-1）


    Original     		PDF 9G0912P2E012* 9G0912PT2E012* AWG26 UL1430 PCM45F 775-lamd PCM45F 2510C888-001 775 cpu connector CPU COOLER WIESON 2510c888-001 BTX LGA 775 San Ace 40 2511-T1 9G0912P2E012 9G0912PT2E012

    LGA PACKAGE thermal resistance

    Abstract: PI5101 LGA60 LGA-60 360 U
    Text: PI5101Family Sheet.qxp:QPO Series 11/9/09 3:46 PM Page 1 µRDS on FET Series 5 Volt, 360 µΩ N-Channel MOSFET, PI5101 PI5101 Features PI5101 Ultra low 360µΩ RDS(on) Extremely low gate charge Very low gate resistance High density, low profile Very low package inductance


    Original     		PDF PI5101 PI5101 PI5101-00-LGIZ LGA PACKAGE thermal resistance LGA60 LGA-60 360 U

    TAIYO PSR 4000

    Abstract: TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600
    Text: Application Note 114 August 2007 Revised March 2009 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds


    Original     		PDF an114fa AN114-8 TAIYO PSR 4000 TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600

    LGA 1366

    Abstract: socket lga 1156 LGA PACKAGE thermal resistance i7 processor cpu lga LGA resistance LGA 2011 Socket LGA2011-0 Intel lga 1156 LGA socket
    Text: Approved by Intel and supporting its top-of-the-line Core i-7 processors, the compact LGA 2011-0 CPU socket provides the electrical, thermal and mechanical reliability servers, workstations and high-end PCs need to achieve target processor performance levels


    Original     		PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012 LGA 1366 socket lga 1156 LGA PACKAGE thermal resistance i7 processor cpu lga LGA resistance LGA 2011 Socket LGA2011-0 Intel lga 1156 LGA socket

    Untitled

    Abstract: No abstract text available
    Text: Approved by Intel and supporting its top-of-the-line Core i7 series processors, the compact LGA 2011-0 CPU socket provides the electrical, thermal and mechanical reliability servers, workstations and high-end PCs need to achieve target processor performance levels


    Original     		PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012

    LGA PACKAGE thermal resistance

    Abstract: No abstract text available
    Text: Approved by Intel and supporting its top-of-the-line Core i7 series processors, the compact LGA 2011-0 CPU socket provides the electrical, thermal and mechanical reliability servers, workstations and high-end PCs need to achieve target processor performance levels


    Original     		PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012 LGA PACKAGE thermal resistance

    LTM46XX

    Abstract: bga dye pry LTM4600 LGA voiding AN114 LGA rework LGA PACKAGE thermal resistance
    Text: Application Note 114 August 2007 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds


    Original     		PDF an114f AN114-8 LTM46XX bga dye pry LTM4600 LGA voiding AN114 LGA rework LGA PACKAGE thermal resistance

    picor

    Abstract: LGA rework JEDEC Drawing LGA reflow profile FOR LGA COMPONENTS MLCC rework PI2121 LGA Application Notes
    Text: Recommended PCB Design & Surface Mount Guidelines for Picor Corporation’s LGA Packages Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1 Receiving PCB Footprint. . . . . . . . . . . . . . . . . . . . . . Page 1


    Original     		PDF

    LGA voiding

    Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		PDF AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale

    AN3281

    Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		PDF AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate

    reflow profile FOR LGA COMPONENTS

    Abstract: LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion
    Text: Enpirion, Inc. EN53x0D AN103_R0.9 Soldering Module Packages Having Large Asymmetric Pads 1.0 INTRODUCTION Enpirion’s power converter packages utilize module package technology to form Land Grid Array LGA packages. LGA module package technology provides additional


    Original     		PDF EN53x0D reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion

    PI2121

    Abstract: PI2121-00-LGIZ PI2125-00-LGIZ
    Text: Cool-ORing Series Full-Function Active ORing Solutions, PI2121 / PI2123 / PI2125 PI2121 / PI2123 / PI2125 Features Combines a high-speed ORing MOSFET controller and a very low on-state resistance MOSFET Integrated high-performance MOSFET PI2121: 8 V, 24 A, 1.5 mΩ


    Original     		PDF PI2121 PI2123 PI2125 PI2125 PI2121: PI2123: PI2125: PI2121-00-LGIZ PI2125-00-LGIZ

    PI5101

    Abstract: No abstract text available
    Text: PI5101   RDS on FETTM Series 360μΩ, 5V/60A N-Channel MOSFET Product Summary Features Ultra Low “micro-Ohm” RDS(on) Extremely Low Gate Charge Very Low Gate Resistance High Density, Low Profile Very Low Package Inductance Low Thermal Resistance


    Original     		PDF PI5101 V/60A 60ADC PI5101 PI5101-00-LGIZ

    SI8233BD-C-IS

    Abstract: SOIC127P600 igbt series Si8232BB-B-IS Si8233 SI8235BB-C-IS1 SI8234A
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation


    Original     		PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 SI8233BD-C-IS SOIC127P600 igbt series Si8232BB-B-IS Si8233 SI8235BB-C-IS1 SI8234A

    Si8235-BA-C-IS1

    Abstract: LGA 32 land pattern silicon labs Si8233 si8230 SI823 SI8233-B-IM Si8238BBCIS1 E257455 SI8238AB-C-IS1 Si8237BBBIS1
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


    Original     		PDF Si823x Si8230/1/2/7 SOIC-16 Si8233/4/5/6/8 LGA-14 Si8235-BA-C-IS1 LGA 32 land pattern silicon labs Si8233 si8230 SI823 SI8233-B-IM Si8238BBCIS1 E257455 SI8238AB-C-IS1 Si8237BBBIS1

    SI8235

    Abstract: Si8233 high side IGBT driver LGA145 SOIC127P600 LGA 32 land pattern SI8234AB-C-IS1 si8235bd-c-is LGA-145 si8236
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features   Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


    Original     		PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 SI8235 Si8233 high side IGBT driver LGA145 SOIC127P600 LGA 32 land pattern SI8234AB-C-IS1 si8235bd-c-is LGA-145 si8236

    WBSOIC-16

    Abstract: LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments       Two completely isolated drivers  Independent HS and LS inputs or in one package PWM input versions Up to 5 kVRMS input-to-output


    Original     		PDF Si823x Si8230/1/2 SOIC-16 Si8233/4/5/6 LGA-14 SOIC-16 WBSOIC-16 LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS

    Si8233BB-C-IS

    Abstract: LGA land pattern SI8233BD-C-IS Si8230 SI8234-B-IM mosfet igbt drivers theory SI8234 solar inverters circuit diagram Si823x Si8233
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments      Two completely isolated drivers  60 ns maximum propagation in one package delay Up to 5 kVRMS input-to-output  Independent HS and LS inputs or


    Original     		PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 Si8233BB-C-IS LGA land pattern SI8233BD-C-IS Si8230 SI8234-B-IM mosfet igbt drivers theory SI8234 solar inverters circuit diagram Si823x Si8233

    Untitled

    Abstract: No abstract text available
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


    Original     		PDF Si823x AEC-Q100 Si8230/1/2/7 Si8233/4/5/6/8 SOIC-16 SOIC-16

    Si8233

    Abstract: LGA-24 land pattern LGA PACKAGE thermal resistance
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation


    Original     		PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 Si8233 LGA-24 land pattern LGA PACKAGE thermal resistance