4900
Abstract: BCC32 LCC-32P-M10 LCC TRAY
Text: FUJITSU SEMICONDUCTOR DATA SHEET BCC32 Maximum storage capacity Maximum storage capacity PKG code PKG code pcs/tray pcs/inner box pcs/outer box LCC-32P-M08 490 4900 29400 LCC-32P-M09 490 4900 29400 LCC-32P-M10 pcs/tray pcs/inner box pcs/outer box 490 4900
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Original
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BCC32
LCC-32P-M08
LCC-32P-M09
LCC-32P-M10
JHB-BCC0505F-1-D-1
4900
BCC32
LCC-32P-M10
LCC TRAY
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PDF
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lccf cable tray conduit clamps
Abstract: LCCF010 tray design LCC010 EMT CONDUIT EMT CONDUIT 3
Text: 106-107.qxp 8/11/2010 10:48 AM Page 107 4F LCC Series Cable Tray Conduit Clamps LCC 4F Applications: LCCF LCC cable tray conduit clamps are used for installation on cable tray side rails with inside flanges requiring inside tray mounting and outside flanges; LCCF clamps are for use exclusively on inside
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Original
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PDF
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SMD BOOK
Abstract: smd 842 SMD Packages TQFP Package 44 lead 20B40 P-MQFP-44-2 P-MQFP-144-1 SMD Devices smd transistor marking 26 MARKING BOOK
Text: Package Outlines Plastic Package, P-DIP-40 Plastic Dual In-Line Package 20B40 DIN 41870 T10 Plastic Package, P-LCC-28-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-44-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-68 (Plastic Leaded Chip Carrier) – SMD
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Original
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P-DIP-40
20B40
P-LCC-28-1
P-LCC-44-1
P-LCC-68
P-LCC-84-2
P-MQFP-44-2
P-MQFP-44-4
P-MQFP-80
P-MQFP-100-2
SMD BOOK
smd 842
SMD Packages
TQFP Package 44 lead
P-MQFP-44-2
P-MQFP-144-1
SMD Devices
smd transistor marking 26
MARKING BOOK
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PDF
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lccf cable tray conduit clamps
Abstract: LCCF 8
Text: 2: 5: SYS19: BASE2 PDFINFO 50: 95: 98: JOB: CRMAIN06-0099-1 Name: 5F-99 100: DATE: JAN 19 2006 Time: 5:01:57 PM Operator: RB COLOR: CMYK TCP: 15001 Typedriver Name: TS name csm no.: 100 LCC Series Cable Tray Conduit Clamps 5F Application: LCC cable tray conduit clamps are used for
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Original
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SYS19:
CRMAIN06-0099-1
5F-99
TGC40
66008com
lccf cable tray conduit clamps
LCCF 8
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PDF
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QFn Package tray
Abstract: QFN tray
Text: UNIT : mm 335±1.0 294±1.0 14.5 14.5 137.5±1.0 180±1.0 21.25±1.0 27.5±0.5 20.5±1.0 21.0±0.5 14.5 5.0 14.5 Applied Package 16pin, 18pin, 22pin, 24pin, 28pin, 32pin, 48pin QFN LCC Quantity (pcs) 90 Tray Material Heat Proof Temp. LA-006 Carbon PVC 70°C
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Original
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16pin,
18pin,
22pin,
24pin,
28pin,
32pin,
48pin
LA-006
QFn Package tray
QFN tray
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PDF
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LT1236S
Abstract: LT6654LS8 LT1236N LTC2442
Text: LT1236LS8 Precision, Low Noise, Low Profile Hermetic Voltage Reference Features Description Hermetic 5mm x 5mm LCC Leadless Chip Carrier Package: Insensitive to Humidity Thermal Hysteresis: 8ppm 0°C to 70°C Thermal Hysteresis: 60ppm (–40°C to 85°C)
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Original
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LT1236LS8
60ppm
10ppm/
1236LS8
1236ls8f
LT1236S
LT6654LS8
LT1236N
LTC2442
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PDF
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huawei microwave Antennas
Abstract: HUAWEi antenna IP clock* huawei Huawei MW Antenna
Text: HUAWEI MG323-B GSM LCC Module Hardware Guide Issue 04 Date 2012-07-02 Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For any assistance, please contact our local office or company headquarters. Huawei Technologies Co., Ltd.
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Original
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MG323-B
huawei microwave Antennas
HUAWEi antenna
IP clock* huawei
Huawei MW Antenna
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PDF
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QFN tray
Abstract: No abstract text available
Text: UNIT : mm 335±1.0 23.5±1.0 288±1.0 19.4 27.5±0.5 19.4 19.4 19.4 5.0 180±1.0 137.5±1.0 21.25±1.0 32±0.5 Applied Package Quantity pcs 64pin QFN (LCC) MAX. 60 Tray Material Heat Proof Temp. LA-013 Carbon PVC 70°C 6 Surface resistance less than 1 x 10 Ω /
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Original
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64pin
LA-013
QFN tray
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PDF
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FJ990-0009-X0081-3-Y-1
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR DATA SHEET BCC48 Maximum storage capacity PKG code LCC-48P-M02 pcs/tray pcs/inner box pcs/outer box 336 3360 20160 20-NO HOLES 135.9 10.9 x 11 = 119.9 8 322.6 315 02 02 02 02 A 11.0 × 27 = 297 B 9 7.62 2 C3 R4.75 34.3 25.4 25.4 255.3
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Original
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BCC48
LCC-48P-M02
20-NO
C48054i4HT-F
FJ990-0009-X0081-3-Y-1
FJ990-0009-X0081-3-Y-1
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PDF
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EBW1444US-E
Abstract: GSPW1653JTE-27Y GSPW1653JTE-27Z GSPW1653JTE
Text: EBW1444US-E High Flux , Power LED Features Package High Heat Radiation Ceramic LCC Type with Metallic Reflector Diffused Pale Yellow Resin Product feature ・Outer Dimension 8.67 x 5.27 x 1.6mm L x W x H ・Temperature range Storage Temperature：-40℃～120℃
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Original
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EBW1444US-E
Temperature-40120
Temperature-40100
350mA)
100pcs
11usages
EBW1444US-E
GSPW1653JTE-27Y
GSPW1653JTE-27Z
GSPW1653JTE
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PDF
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intel 8751 architecture
Abstract: INTEL 8751 bp-2100 intel 8751 data sheet intel 8752 87c51 flash flash simm programmer 87C198 87C51 87C51GB
Text: PROGRAMMERS BP MICROSYSTEMS, INC. BP-2100 Concurrent Programming System • ■ ■ ■ ■ ■ ■ Field Upgradeable to 240 Pins Supports Over 8000 Devices Supports DIP, PLCC, QFP, PGA, SOIC, TSOP, LCC, SDIP, PCMCIA, and SIMM Devices Full Vector and Continuity Test Up to
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Original
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BP-2100
87C5x,
87C51Fx,
87C51,
87L5x,
87L51Fx,
87C51GB,
intel 8751 architecture
INTEL 8751
intel 8751 data sheet
intel 8752
87c51 flash
flash simm programmer
87C198
87C51
87C51GB
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PDF
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LCC 44
Abstract: P-LCC-44 TRAY lcc 68 pin lcc 20 test socket PGA68 6868 E-tec Interconnect DIP64 lcc 28 socket 32 PLCC to 28 din
Text: Adapters & Emulator Interface Cable E-tec the Swiss connection A complete series of adapters, programming adapters and emulator interface cables is available for use in microprocessor test- and development systems as well as logical analysors. The LCC and PLCC adapters as well as the emulator
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Original
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28reel.
LCC 44
P-LCC-44 TRAY
lcc 68 pin
lcc 20 test socket
PGA68
6868
E-tec Interconnect
DIP64
lcc 28 socket
32 PLCC to 28 din
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PDF
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QFN tray
Abstract: QFn Package tray
Text: unit : mm 276±1.0 32±1.0 212±1.0 223±1.0 159±1.0 53±0.5 29 32±1.0 53±0.5 29 LA-030-A 29 15 29 Applied package Quantity pcs 68pin QFN (LCC) MAX. 20 Tray Material Heat Proof Temp. Surface resistance LA-030-A Carbon PVC 70°C 6 less than 1 x 10 Ω/
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Original
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LA-030-A
68pin
QFN tray
QFn Package tray
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PDF
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6X6C
Abstract: RI23110
Text: RI23110 CDMA PCS 3–4 Volt Power Amplifier 1720–1910 MHz The RI23110 Personal Communications Service (PCS) Power Amplifier is a fully matched 6-pin LCC surface mount module developed for PCS and wireless local loop applications. This small and efficient Power Amplifier packs a full 1720–1910
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Original
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RI23110
RI23110
6X6C
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PDF
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|
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MMIC code D
Abstract: china phone BLOCK diagram transistor 2 Amp 3 volt RM912 L8824
Text: RM912 CDMA/AMPS 3–4 Volt Power Amplifier 824–849 MHz The RM912 dual mode Code Division Multiple Access (CDMA)/Advanced Mobile Phone Service (AMPS) Power Amplifier is a fully matched 6-pin LCC surface mount module designed for mobile units operating in the 824-849 MHz cellular bandwidth.
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Original
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RM912
RM912
MMIC code D
china phone BLOCK diagram
transistor 2 Amp 3 volt
L8824
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PDF
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RM807
Abstract: RM807-15 conexant
Text: RM807 iew Power Amplifier Module for TDMA PCS 1850–1910 MHz lR Functional Block Diagram VREF (3) VCC1 (1) Input Match • • • • • • Low voltage positive bias supply Good linearity High efficiency Large dynamic range 6-pin LCC package (6 x 6 x 1.5 mm)
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Original
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RM807
RM807
RM807-15
conexant
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PDF
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IC AN 8249
Abstract: an 8249 china mobile phone circuit diagram
Text: RM914 AMPS 3–4 Volt Power Amplifier 824–849 MHz The RM914 Advanced Mobile Phone Service (AMPS) Power Amplifier is a fully matched 6-pin LCC surface mount module designed for mobile units operating in the 824-849 MHz cellular bandwidth. This device can be driven to power output levels beyond 31 dBm
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Original
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RM914
RM914
IC AN 8249
an 8249
china mobile phone circuit diagram
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PDF
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Untitled
Abstract: No abstract text available
Text: RMPA1967 US-PCS CDMA, CDMA2000-1X and WDCMA Power Edge Power Amplifier Module Features General Description • Single positive-supply operation and low power and shutdown modes ■ 40% CDMA/WCDMA efficiency at +28 dBm average output power ■ Compact lead-free compliant, LCC package 3.0 x 3.0 x 1.0 mm nominal
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Original
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RMPA1967
CDMA2000-1X
CDMA2000-1XRTT/WCDMA
RMPA1965
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PDF
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sandisk flash controller
Abstract: SANDISK flash ID code sandisk date code X32C 08051C103KATMA sandisk flash chipset Sandisk Flash memory SanDisk controller qualitek "Humidity Indicator Card"
Text: Flash ChipSet Product Manual 13.0 Flash ChipSet Manufacturabiltv Specifications 13.1 H ow the Flash ChipSet LCC is Received The Flash ChipSet LCC is shipped in packages that each contain 360 pieces in 4 trays with 90 pieces in each tray. The LCC trays are dry packed and vacuum sealed with a desiccant in a moisture barrier bag.
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OCR Scan
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60pSet.
RB471E
60Hz1
sandisk flash controller
SANDISK flash ID code
sandisk date code
X32C
08051C103KATMA
sandisk flash chipset
Sandisk Flash memory
SanDisk controller
qualitek
"Humidity Indicator Card"
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PDF
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Untitled
Abstract: No abstract text available
Text: Components - LCC-Coaxial Tools Individual Tools Ordering Information Description Catalog Num ber Connection tool kit for LCC connectors Includes: •C rim ptool WT-2 • 735A die set (LCA-000015) • Stripping tool with cassette (STC-13G) • Cable termination tray (LCA-000009)
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OCR Scan
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LCA-000015)
STC-13G)
LCA-000009)
LCA-400001)
LCA-600001
LCA-000009
LCA-000007
LCA-000008
LCA-400001
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PDF
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KJH T6
Abstract: 387DX 80286 microprocessor paging mechanism 80386DXL A31AZ 16 bit 80186 AM386DXL i386dx 32-Bit CHMOS 25MHz 132-Pin PQFP NAFI
Text: Am386 DXL Advanced Micro Devices High-Performance, Low-Power, 32-Bit Microprocessor DISTINCTIVE CHARACTERISTICS • Ideal for portable PCs Ideal for desktop PCs -T rue static design for long battery life -Typical standby lcc< 0.02 mA at DC 0 MHz -Typical operating lcc<275 mA at 33 MHz
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OCR Scan
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Am386â
32-Bit
i386DX
i386SX
132-pin
20-MHz
i386DX
386DX
16-bit
BS16to
KJH T6
387DX
80286 microprocessor paging mechanism
80386DXL
A31AZ
16 bit 80186
AM386DXL
32-Bit CHMOS 25MHz 132-Pin PQFP
NAFI
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PDF
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Untitled
Abstract: No abstract text available
Text: •&AEC INTERC0HNECT10N SPECIALISTS LCC SOCKETS FOR SMD JEDEC TYPE C DEVICES Typical Cellular Telephone Application (Patent Pending) Andon has developed a leadless ceramic chip socket contact providing excellent electrical conductivity and excellent mechanical security.
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OCR Scan
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INTERC0HNECT10N
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PDF
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Untitled
Abstract: No abstract text available
Text: CCI Circuit Components Inc. MicroiQ 3500SM Decoupling Capacitors Micro/Q 3500SM decoupling capacitors are specifically designed to be surface mounted under plastic leaded chip carrier PLCC packages. By residing under the PLCC/LCC, Micro/Q 3500SM capacitors increase board density by eliminating the
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OCR Scan
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3500SM
3500SM
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PDF
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Motorola SMD code
Abstract: PSB21525-N
Text: SIEMENS High-Level Serial Communications Controller Extended HSCX-TE PSB 21525 Version 2.1 1 CMOS Features Package Besides P-LCC-44-1 and P-MQFP-44-2, the HSCX-TE PSB 21525 is available also in P-TQFP-64-1 package. Type Ordering Code Package PSB 21525 N Q67100-H6672
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OCR Scan
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P-LCC-44-1
P-MQFP-44-2,
P-TQFP-64-1
Q67100-H6672
Q67100-H6671
Q67101-H6733
P-LCC-44-1
P-MQFP-44-2
P-TQFP-64-1
FP-64-1
Motorola SMD code
PSB21525-N
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PDF
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