LATTICE SEMICONDUCTOR TAPE AND REEL SPECIFICATION Search Results

US mark

Contextual Info: Tape and Reel Specifications A tape-and-reel packing container is available for plastic leaded chip carriers to protect the product from mechanical/ electrical damage and to provide an efficient method for handling. Lattice Semiconductor’s tape-and-reel

Lattice PLSI

Abstract: lattice semiconductor tape and reel
Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for

16-mm

Abstract: 16MM TAPE PACKAGE
Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for

LATTICE SEMICONDUCTOR Tape and Reel Specification

Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. Once loaded, the tape is wound onto a plastic reel for labeling and packing. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel

REELS

Abstract: CABGA 56
Contextual Info: Product Bulletin November 2010 #PB1240I Lattice Ordering Guidelines for Custom Product and Tape and Reel Introduction Lattice “Custom Products” include the following: • Factory Pre-Programming Encryption & Non-Encryption  Custom Processing (Including custom testing, restricted material set, custom product

Contextual Info: iCE40LM Family Data Sheet DS1045 Version 1.2, March 2014 iCE40LM Family Data Sheet Introduction January 2014 Data Sheet DS1045 General Description iCE40LM family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as

Contextual Info: iCE40LM Family Data Sheet DS1045 Version 1.3, March 2014 iCE40LM Family Data Sheet Introduction January 2014 Data Sheet DS1045 General Description iCE40LM family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as

LATTICE SEMICONDUCTOR Tape and Reel Specification

Contextual Info: iCE40LM Family Data Sheet DS1045 Version 1.4, August 2014 iCE40LM Family Data Sheet Introduction January 2014 Data Sheet DS1045 General Description iCE40LM family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.7, October 2013 iCE40 LP/HX Family Data Sheet Introduction October 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device

TFK 7 segment displays

Abstract: TFK 609 7-segment display tfk "seven segment display" tfk tfk 648 TFK BPW 41 N smd code marking Ld50 tfk 605 TFK 7 segment d 350 28 tfk 727
Contextual Info: LEDs and Displays Data Book 1996 TELEFUNKEN Semiconductors Contents General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Selector Guide – Alphanumeric Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.8, February 2014 iCE40 LP/HX Family Data Sheet Introduction February 2014 Data Sheet DS1040 Features – Schmitt trigger inputs, to 200 mV typical hysteresis • Programmable pull-up mode  Flexible Logic Architecture

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.5, August 2013 iCE40 LP/HX Family Data Sheet Introduction August 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.4, July 2013 iCE40 LP/HX Family Data Sheet Introduction July 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device  Flexible Logic Architecture

LATTICE SEMICONDUCTOR Tape and Reel Specification

Abstract: LVDS25E 0.4mm pitch BGA routing ICE40 FPGA pitch 0.4mm BGA 0.4mm pitch 2.5x2.5mm
Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.3, May 2013 iCE40 LP/HX Family Data Sheet Introduction April 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device  Flexible Logic Architecture

ICE40 lattice

Abstract: ICE40 FPGA 0.4mm pitch BGA routing TN1251 ICE40LP1K ICE40LP1K-CM36 GDDR71 pitch 0.4mm BGA 0.4mm pitch 2.5x2.5mm ICE40LP384SG32
Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.2, April 2013 iCE40 LP/HX Family Data Sheet Introduction April 2013 Data Sheet DS1040  Flexible On-Chip Clocking Features • Eight low-skew global clock resources • Up to two analog PLLs per device  Flexible Logic Architecture

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 02.9, April 2014 iCE40 LP/HX Family Data Sheet Introduction February 2014 Data Sheet DS1040 Features  Flexible Logic Architecture – Schmitt trigger inputs, to 200 mV typical hysteresis • Programmable pull-up mode

Contextual Info: iCE40 LP/HX Family Data Sheet DS1040 Version 3.0, July 2014 iCE40 LP/HX Family Data Sheet Introduction February 2014 Data Sheet DS1040 Features  Flexible Logic Architecture – Schmitt trigger inputs, to 200 mV typical hysteresis • Programmable pull-up mode

DS1047

Contextual Info: MachXO3L Family Data Sheet Advance DS1047 Version 00.2, February 2014 MachXO3L Family Data Sheet Introduction February 2014 Advance Data Sheet DS1047 Features  Solutions • • • • • • • • • • Smallest footprint, lowest power, high data

LCMXO2-256 pinout

Contextual Info: MachXO2 Family Data Sheet Preliminary DS1035 Version 01.2, April 2011 MachXO2 Family Data Sheet Introduction April 2011 Features Preliminary Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O 

LCMX02

Abstract: LCMX02 1200 LCMXO2-1200HC-4TG144C LCMXO2-4000HC LCMXO2-1200HC-4MG132C lcmxo2-1200 TQFP-144 footprint LCMXO2-7000HC LCMXO2-640HC-4TG100C LCMX02-2000
Contextual Info: MachXO2 Family Data Sheet Preliminary DS1035 Version 01.5, August 2011 MachXO2 Family Data Sheet Introduction April 2011 Features Preliminary Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O 

Contextual Info: MachXO2 Family Data Sheet Preliminary DS1035 Version 01.5, August 2011 MachXO2 Family Data Sheet Introduction April 2011 Features Preliminary Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O 

machxo3

Contextual Info: MachXO3L Family Data Sheet Advance DS1047 Version 00.3, May 2014 MachXO3L Family Data Sheet Introduction May 2014 Advance Data Sheet DS1047 Features  Solutions • Smallest footprint, lowest power, high data throughput bridging solutions for mobile applications

LCMX02

Abstract: LCMXO2-4000 LCMX02 1200 LCMX02-2000 LCMXO2-7000HC-4TG144 HB1010 LCMXO2-1200HC-4MG132C LCMXO2 verilog HDL program to generate PWM XO2-640
Contextual Info: MachXO2 Family Handbook HB1010 Version 01.9, September 2011 MachXO2 Family Handbook Table of Contents September 2011 Section I. MachXO2 Family Data Sheet Introduction Features . 1-1

Contextual Info: iCE40 LP/HX/LM Family Handbook HB1011 Version 01.2, November 2013 iCE40 LP/HX/LM Family Handbook Table of Contents October 2013 Section I. iCE40 LP/HX Family Data Sheet Introduction Features . 1-1