LATTICE PACKAGE DIMENSION Search Results

22V10A

Abstract: LVCMOS33 LVCMOS18 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn
Contextual Info: Using the ispGAL22V10A in the QFN Package April 2003 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is

22V10

Abstract: 22V10A LVCMOS25 LVCMOS33 ABEL plastron
Contextual Info: Using the ispGAL22V10A in the QFN Package November 2007 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is

LC4064V

Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Contextual Info: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch

Contextual Info: PA1048-T128-01A Data Sheet 128 pin TQFP socket/28 pin DIP 0.6" plug Supported Device/Footprints Adapter Wiring Using this adapter several 128 pin Lattice devices in TQFP packages can be programmed on 28 pin DIP programmers. This socket will only work for the TQFP package.

Lattice PLSI

Abstract: lattice semiconductor tape and reel
Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for

16-mm

Abstract: 16MM TAPE PACKAGE
Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for

LED43

Contextual Info: LED43 v 2.0 24.11.2014 Description LED43 series are fabricated from narrow band-gap InAsSb/InAsSbP heterostructures lattice matched to InAs substrate. This Mid-IR LED provides a typical peak wavelength of 4.15 µm and optical power of typ. 0.01 mW qCW. It comes in TO-18 package a with a glass window.

LATTICE SEMICONDUCTOR Tape and Reel Specification

Contextual Info: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. Once loaded, the tape is wound onto a plastic reel for labeling and packing. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel

LED21

Contextual Info: LED21 v 1.0 12.02.2014 Description LED21 series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 2.15 µm and optical power of typ. 1 mW qCW. It comes in TO-18 package a with a glass window.

LED38

Contextual Info: LED38 v 2.0 01.12.2014 Description LED19-PR series are fabricated from narrow band-gap InAsSb/InAsSbP heterostructures lattice matched to InAs substrate. This Mid-IR LED provides a typical peak wavelength of 3.75 µm and optical power of typ. 30 µW qCW. It comes in TO-18 package, with cap and without window on request .

Contextual Info: LED23 rev 2.0 29.04.2015 Description LED23 series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 2.35 µm and optical power of typ. 0.8 mW qCW. It comes in TO-18 package, with cap and without window on request .

LED19-PR

Contextual Info: LED19-PR v 2.0 24.11.2014 Description LED19-PR series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 1.95 µm and optical power of typ. 1 mW qCW. It comes in TO-18 package, with a parabolic reflector and a without window on request .

LFXP2-8E

Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Contextual Info: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.

84 pin plcc lattice dimension

Abstract: C045
Contextual Info: Package Diagrams November 2003 16-Pin Plastic DIP Package Dimensions in Inches -BN/2 b1 1 WITH LEAD FINISH E 5 6 CL E1 c1 c N SEE DETAIL A BASE METAL (b) SECTION Z-Z CL BASE PLANE c 5 -A- D 6 eA Z Z 4 A2 A eB 7 -C.015 SEATING PLANE A1 L b2 10 b .010 GAGE

14.5M 1982

Abstract: AC12 MO-220 MO-275 ANSI Y14.5 FCBGA304 fcbga-304 ansi-y14.5m-1982 LAttice bottom marking SCM40
Contextual Info: Package Diagrams November 2010 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B 1 N/2 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL

Lattice Semiconductor Package Diagrams 256-Ball fpBGA

Abstract: LAttice top marking BB 1704 672-BALL SCM40 AC12 MO-220 MO-275 84 pin plcc lattice dimension fcbga-304
Contextual Info: Package Diagrams October 2011 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B N/2 1 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L Z E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL

TMS 3880

Abstract: vantis jtag schematic e2cmos technology jtag cable lattice Schematic NT 407 F lattice electrically erasable gal 1985 Vantis ISP cable lattice 1996
Contextual Info: L A T T I C E S E M I C O N D U C T O R New Dimensions in ISP Programmable Analog Circuits Programmable Analog Circuits WORLD LEADER FOR IN-SYSTEM PROGRAMMABILITY ISP from LATTICE—THE Digital Lattice ispPACTM—Programmable Analog Devices that are custom designed and

3006d

Abstract: J1 3009-2 3004c 30054 3005A STM-1 Physical interface PHY A transistor which is related with H1 3003A ort8850h-2bm680c 30042 pad 3006A
Contextual Info: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver February 2008 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed

Contextual Info: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver April 2006 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed

300b0

Contextual Info: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver August 2004 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed

Contextual Info: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver November 2003 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed

diode D32

Abstract: J1 3009-2
Contextual Info: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver October 2003 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed

Contextual Info: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver November 2002 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed

30054

Abstract: driver 30090 pt35c 30021 30042 30046 3006A 3006d 30079 30080 468
Contextual Info: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver October 2005 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed