LAND PATTERN FOR SC70 Search Results

SOD-323 land pattern

Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
Contextual Info: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

tssop 16 exposed pad stencil

Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

qfn 32 land pattern

Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

C1316C

Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
Contextual Info: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface

200123K

Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These

1206 land pattern

Abstract: NOMCA MPMA HTRN
Contextual Info: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin

Contextual Info: UM5304EEXF Quad Channel Low Capacitance ESD Protection Array UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 General Description UM5304EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been

Contextual Info: UM5304EEXF Quad Channel Low Capacitance ESD Protection Array UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 General Description UM5304EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been

Contextual Info: UM5204EEXF Quad Channel Low Capacitance ESD Protection Array UM5204EEAF UM5204EEBF UM5204EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 General Description UM5204EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been

Contextual Info: UESD6V8L4A/B Low Capacitance Quad Line ESD Protection Diode Array UESD6V8L4A SC70-5/SC88A/SOT353 UESD6V8L4B SC89-5/SOT553/SOT665 General Description The UESD6V8L4A/B of TVS diode array is designed to protect sensitive electronics from damage or latch-up due to ESD, for use in applications where board space is at a premium. It is unidirectional device and may be

Contextual Info: 95040 PA2011 Low RDSON SPDT Analog Switch. ANALOG PRODUCTS DIVISION Description Features • • • • • Low Voltage Operation 1.8 V to 3.3 V Low On-Resistance - rON: 1.8  at 2.7 V Low Charge Injection Low Voltage Logic Compatible DFN-6 Package or SC70-6 Package

95040

Abstract: PA2011SC 16 chanel input switch analog PA2011SC-T7
Contextual Info: 95040 PA2011 Low RDSON SPDT Analog Switch. ANALOG PRODUCTS DIVISION Features • • • • • Description Low Voltage Operation 1.8 V to 3.3 V Low On-Resistance - rON: 1.8  at 2.7 V Low Charge Injection Low Voltage Logic Compatible DFN-6 Package or SC70-6 Package

IPC-7527

Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Contextual Info: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2

Contextual Info: ALPHA & OMEGA Document No. SEMICONDUCTOR, LTD. PO—000 1 2 Version rev F SC70 PACKAGE OUTLINE OJ 1_L c O.lOnn b RECOMMENDED LAND PATTERN SYMBOLS sJD Ö 1 r 0.65 in cr> 0,60 UNIT: mm A Al A2 b c D E e el El L DIMENSIONS IN MILLIMETERS MIN 0.00 0.7 0.15 0.08

sc70

Abstract: SC-70 land pattern for SC70
Contextual Info: v01.0109 SC70 E – 6 LEAD 2x2 mm PLASTIC SC70 PACKAGE PACKAGE OUTLINES SC70 (E) Package Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEAD MATERIAL: COPPER ALLOY 3. LEAD PLATING: Sn/Pb SOLDER

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v01.0109 SC70 E – 6 LEAD 2x2 mm PLASTIC SC70 PACKAGE PACKAGE OUTLINES SC70 (E) Package Outline Drawing

land pattern for sot109-1

Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Contextual Info: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products

MO-203-AA

Abstract: a 4x transistor land pattern sc70-5 MO-203AA SC70-5 eiaj SC70
Contextual Info: Plastic Packages for Integrated Circuits Small Outline Transistor Plastic Packages SC70-5 P5.049 D VIEW C e1 5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE INCHES 5 SYMBOL 4 E CL 1 2 CL 3 e E1 b CL 0.20 (0.008) M C C CL A A2 SEATING PLANE A1 -C- PLATING

SOT23-6 p-mos MARKING 57

Abstract: MARKING CODE tw SOT23-6 UM3301DBV
Contextual Info: UM3301 1-Bit Bidirectional Voltage-Level Translator with Auto Direction sensing and ±15kV ESD Protection UM3301 CSP6/SOT23-6/SC70-6 General Description UM3301 is 1-bit bidirectional voltage level translator with auto direction sensing and ±15kV ESD protection. This 1-bit noninverting translator uses two separate configurable power-supply rails.

low voltage reset SC70-3

Abstract: ILC5061 ILC5061AM23 ILC5061AM25 ILC5061AM26 ILC5061AM27 ILC5061AM28 ILC5061AM29 ILC5061AM31 top marking sot23-3
Contextual Info: www.fairchildsemi.com ILC5061 Power Supply reset Monitor with 1% Precision Features Description • • • • • • All-CMOS design in SOT-23 or SC70 package ±1% precision in Reset Detection Only 1µA of Iq 2mA of sink current capability Built-in hysteresis of 5% of detection voltage

marking M8Y

Abstract: marking n1y ILC5061 ILC5061AM23X ILC5061AM25X ILC5061AM26X ILC5061AM27X ILC5061AM28X ILC5061AM29X ILC5061AM31X
Contextual Info: www.fairchildsemi.com ILC5061 Power Supply reset Monitor with 1% Precision Features Description • • • • • • All-CMOS design in SOT-23 or SC70 package ±1% precision in Reset Detection Only 1µA of Iq 2mA of sink current capability Built-in hysteresis of 5% of detection voltage

2SA1774

Contextual Info: 2SA2029 / 2SA1774EB / 2SA1774 / 2SA1576UB / 2SA1576A / 2SA1037AK Datasheet PNP -150mA -50V General Purpose Transistors Outline Parameter Value VCEO IC 50V 150mA VMT3 EMT3F Collector Collector Base Base Emitter Emitter 2SA2029 SC-105AA Features

2SC4081UB

Contextual Info: 2SA2029 / 2SA1774EB / 2SA1774 / 2SA1576UB / 2SA1576A / 2SA1037AK Datasheet PNP -150mA -50V General Purpose Transistors Outline Parameter Value VCEO IC 50V 150mA VMT3 EMT3F Collector Collector Base Base Emitter Emitter 2SA2029 SC-105AA Features

2SC4081UB

Contextual Info: 2SA2029 / 2SA1774EB / 2SA1774 / 2SA1576UB / 2SA1576A / 2SA1037AK Datasheet PNP -150mA -50V General Purpose Transistors lOutline Parameter Value VCEO IC -50V -150mA VMT3 EMT3F Collector Collector Base Base Emitter Emitter 2SA2029 SC-105AA lFeatures 1) General Purpose.