LAND PATTERN FOR DFN Search Results

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Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These

1206 land pattern

Abstract: NOMCA MPMA HTRN
Contextual Info: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of DFN2510-10 package SOT1165-1 Hx P C Hy Ay By 0.05 D D1 0.05 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: DFN Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 5 x 5 mm DFN packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of DFN2626-10 package SOT1197-1 Hx Gx D P 0.025 0.025 Ay Gy By SPy SLy nSPy Hy nSPx SPx SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit

TB389

Contextual Info: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing

J-STD-005

Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently

J-STD-005

Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently

IPC-7351A

Abstract: MiniMELF land pattern land pattern for TSsOP 16 land pattern for TSSOP sot89 land pattern PowerDI3333-8 SOD-323 land pattern y1 SOT23 DFN2020 SOD523 land pattern
Contextual Info: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523

SOT-563 SOT-666

Abstract: SOD523 land pattern IPC-7351A IPC SOD 323F SOT-95 SOD-323 land pattern SOT-353 G5 Y3 SOT23 DFN1006-3 DFN1006H4-2
Contextual Info: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523

IPC-7351A

Abstract: AP02001 DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP
Contextual Info: Suggested Pad Layout Based on IPC-7351A Figure 1 Dimensions DFN1006-2 MiniMELF MELF SOD-323 SOD-123 SOD-523 SMA SMB SMC 9.3 Z 1.1 4.8 6.3 3.75 4.9 2.3 6.5 6.7 G 0.3 2.1 3.3 1.05 2.5 1.1 1.5 1.8 4.4 X 0.7 1.7 2.7 0.65 0.7 0.8 1.7 2.3 3.3 Y 0.4 1.3 1.5 1.35

Y1 SOT-23

Abstract: MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8
Contextual Info: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523

MMA7660

Abstract: SURFACE MOUNT CAPACITORS footprint land pattern AN3839 MMA7660FC accelerometer sensor land pattern for DFN
Contextual Info: Freescale Semiconductor Application Note AN3839 Rev 2, 9/2009 MMA7660FC Board Mounting Guidelines by: Laura Salhuana ACRONYMS PCB: Printed Circuit Board DFN: Dual Flat No-Lead Cl: Chlorine Br: Bromine RoHS: Restrictions on Hazardous Substances Sn: tin Pb: lead

land pattern for DFN

Abstract: dual flatpack
Contextual Info: v00.0506 LP2 E – 2 x 2 mm DUAL FLATPACK NO-LEAD (DFN) PLASTIC PACKAGE PACKAGE OUTLINES LP2 (E) Package Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. PAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

s2083

Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
Contextual Info: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder

package

Abstract: alpha solder paste PROFILE
Contextual Info: Document No. DSMT-0001 Rev. 1 Page: 1/1 PCB Land Design and Surface Mount for DFN2x5 Sawn Package Introduction DFN2x5 package is a plastic encapsulated package with a copper lead frame substrate. It offers good thermal and electrical performance, near chip scale footprint, thin profile and low

AA112A

Abstract: IPC-7351A
Contextual Info: PACKAGE OUTLINE DIMENSIONS AP02002 SUGGESTED PAD LAYOUT(AP02001) (Based on IPC-7351A) Table of Contents X4-DFN0402‐2/SWP . 10

dfn3020

Abstract: mlx90248 AH1801 AH1802 AH1803 AH1822 DFN2020-3 DFN2020-6 DFN3020-6 SC59
Contextual Info: Diodes, Inc.’s New Product Announcement, May 9, 2008 Micro-power Omnipolar Hall Effect Sensor Switch AH1822 with Ultra Thin DFN Package for the Portable Consumer Electronics Markets

1750mW

Contextual Info: 2008/03/12 Step Dow n DC/DC converter w ith LDO and Reset RP901series OUTLINE The RP901K is CMOS based PWM step-down DC/DC converter combined with a 600mA LDO and a voltage detector VD , with low supply current. Because of DFN(PLP)2527-10 package, high density mounting on boards is possible.

RP111N

Abstract: RP111H Z X C SOT-89-5 RP111L voltage regulator sot-89-5 RP111X
Contextual Info: RP111x Series PRELIMINARY ULTRA SMALL 1ch 500mA REGULATOR NO.EA-241-100911 OUTLINE The RP111x Series are positive voltage regulator ICs, which have been developed using the CMOS process technology, with high ripple rejection, low dropout voltage, high output voltage accuracy, and low-supply current.

CPC7583

Abstract: GR-1089-CORE
Contextual Info: CPC7583 Line Card Access Switch Features Description • Small 20-pin or 28-pin SOIC or 28-pin DFN • DFN version provides 65% PCB area reduction over 4th generation EMRs • Monolithic IC reliability • Low, matched, RON • Eliminates the need for zero-cross switching

Contextual Info: UM5079/Q Single Line ESD Protection Diode Array UM5079/Q FBP2 1.0x0.6 /DFN2 1.0×0.6 General Description The UM5079/Q ESD protection diode is designed to replace multilayer varistors MLVs in portable applications such as cell phones, notebook computers, and PDA’s. They feature large cross-sectional area

FBP02

Contextual Info: UM5059/Q Single Line ESD Protection Diode Array UM5059 UM5059Q FBP02 1.0x0.6 DFN2 1.0×0.6 General Description The UM5059/Q ESD protection diode is designed to replace multilayer varistors MLVs in portable applications such as cell phones, notebook computers, and PDA’s. They feature large cross-sectional area

Contextual Info: 95040 PA2011 Low RDSON SPDT Analog Switch. ANALOG PRODUCTS DIVISION Description Features • • • • • Low Voltage Operation 1.8 V to 3.3 V Low On-Resistance - rON: 1.8  at 2.7 V Low Charge Injection Low Voltage Logic Compatible DFN-6 Package or SC70-6 Package