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Catalog Datasheet	MFG & Type	PDF	Document Tags
diode c021 Abstract: d1c24000 Text: cosmo D1C240000 Reed Relay UL 60950 File No.E108430 Outside Dimension:Unit Features (mm) 1. M olded epoxy body. K KUAN HSI J D1C240000 2. Dip type construction with the s a m e term inal pitch as - Date Code ICs or T TL s simplifies PC board designing. In addition,	OCR Scan	PDF	D1C240000 E108430) 100VDC to125 10-2000HZ diode c021 d1c24000
KUAN D1C240000 Abstract: D1C240000 Text: PRODUCT SPECIFICATION DATE : REED RELAY: co sm o D1C240000 ELECTRONICS CORPORATION 03/26/00’ NO. 50R01021 REV. SHEET 1 OF 2 2 1. OUTSIDE DIMENSION : UNIT ram ID CL JZ 1 Q. KUAN HSI D1C240000 9 ^ TD— CT TZJ— CT 19.5 0.4 5.5 3.0 0 .5 - _L -7 .6 2 -	OCR Scan	PDF	D1C240000 50R01021 10-2000HZ) KUAN D1C240000 D1C240000
KUAN HSI D1C240000 Abstract: KUAN D1C240000 D1C240000 Text: PRODUCT SPECIFICATION REED RELAY: co sm o ELECTRONICS CORPORATION SHEET 1 OF 2 D1C240000 1. OUTSIDE DIMENSION : UNIT mm n n n n ^ KUAN HSI - Date Code J D1C240000 ^ \ * U U U U 19.5 7.0 — r~7. V 0.25 —U\|- ¿0 5— — * I— 7.62— I - — 8 .9iax. — "•	OCR Scan	PDF	D1C240000 10-2000HZ) KUAN HSI D1C240000 KUAN D1C240000 D1C240000

Catalog Datasheet

MFG & Type

PDF

Document Tags

diode c021

Abstract: d1c24000
Text: cosmo D1C240000 Reed Relay UL 60950 File No.E108430 Outside Dimension:Unit Features (mm) 1. M olded epoxy body. K KUAN HSI J D1C240000 2. Dip type construction with the s a m e term inal pitch as - Date Code ICs or T TL s simplifies PC board designing. In addition,

OCR Scan

PDF

D1C240000 E108430) 100VDC to125 10-2000HZ diode c021 d1c24000

KUAN D1C240000

Abstract: D1C240000
Text: PRODUCT SPECIFICATION DATE : REED RELAY: co sm o D1C240000 ELECTRONICS CORPORATION 03/26/00’ NO. 50R01021 REV. SHEET 1 OF 2 2 1. OUTSIDE DIMENSION : UNIT ram ID CL JZ 1 Q. KUAN HSI D1C240000 9 ^ TD— CT TZJ— CT 19.5 0.4 5.5 3.0 0 .5 - _L -7 .6 2 -

OCR Scan

PDF

D1C240000 50R01021 10-2000HZ) KUAN D1C240000 D1C240000