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    diode c021

    Abstract: d1c24000
    Text: cosmo D1C240000 Reed Relay UL 60950 File No.E108430 Outside Dimension:Unit Features (mm) 1. M olded epoxy body. K KUAN HSI J D1C240000 2. Dip type construction with the s a m e term inal pitch as - Date Code ICs or T TL s simplifies PC board designing. In addition,


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    KUAN D1C240000

    Abstract: D1C240000
    Text: PRODUCT SPECIFICATION DATE : REED RELAY: co sm o D1C240000 ELECTRONICS CORPORATION 03/26/00’ NO. 50R01021 REV. SHEET 1 OF 2 2 1. OUTSIDE DIMENSION : UNIT ram ID CL JZ 1 Q. KUAN HSI D1C240000 9 ^ TD— CT TZJ— CT 19.5 0.4 5.5 3.0 0 .5 - _L -7 .6 2 -


    OCR Scan     		PDF D1C240000 50R01021 10-2000HZ) KUAN D1C240000 D1C240000

    KUAN HSI D1C240000

    Abstract: KUAN D1C240000 D1C240000
    Text: PRODUCT SPECIFICATION REED RELAY: co sm o ELECTRONICS CORPORATION SHEET 1 OF 2 D1C240000 1. OUTSIDE DIMENSION : UNIT mm n n n n ^ KUAN HSI - Date Code J D1C240000 ^ \ * U U U U 19.5 7.0 — r~7. V 0.25 —U|- ¿0 5— — * I— 7.62— I - — 8 .9iax. — "•


    OCR Scan     		PDF D1C240000 10-2000HZ) KUAN HSI D1C240000 KUAN D1C240000 D1C240000